1 billion euros! Bosch Group plans to build a 300mm chip line in Germany

Germany's Bosch Group's most advanced chip factory will hold a groundbreaking ceremony in the eastern German city of Dresden on April 24. The Bosch Group will invest 1 billion euros in the city to build a fully automated 300mm silicon wafer production line with a total construction area of ​​100,000 square meters. Provide 700 jobs. The plant has started construction in March this year and is expected to be put into production by the end of 2021.

Mr. Jens Fabrowsky, a member of the Bosch Group's Automotive Electronics Division, said at the ground-breaking ceremony: 'The chip is the golden key to the opening of the Internet of Everything! To this day, cars without chips are difficult to move. Dresden has a unique advantage as a chip industry base. This brings together Europe's leading microelectronics industry clusters, including the world-famous Dresden University of Technology, renowned component manufacturers and service providers, and a complete industrial chain. Even the German Ministry of Economics and Energy has set up here. The project develops IoT technology. Bosch is willing to cooperate with these universities and semiconductor companies to develop the most advanced chip technology and to strengthen the strategic position of Germany and Europe in the global chip market. 'The current Bosch can produce chip products: ECU Chips for controller chips, acceleration, speed, mass flow, pressure and ambient temperature sensors. These products are produced at the Reutlingen plant in West Germany, which produces 15 million chips and 45 million mechatronics per day. Products. Bosch has more than 1,000 patents in chip manufacturing. In 2008, World due to a major breakthrough in the 'surface MEMS processing technology' field was awarded on behalf of German President established 'Future Award'.

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