On April 22, 2018, at the Mandarin Oriental Hotel in Pudong, Shanghai, a press conference for ultra-high temperature expandable microspheres was held by Xiengneng Technology, a world-class new materials technology research and development company, and announced that the world’s first application of the new technology has been developed. Ultra-high temperature expandable microsphere products with a high temperature exceeding 230 degrees indicate that the world microsphere field is bound to usher in a revolutionary innovation.
Academician of the University of France at the same day, Hu Guohua, Dean of the School of Chemical and Biological Engineering, University of Science and Technology Beijing, Expert in the field of acrylic acid polymerization and application research Chen Zhiliang, East China University of Science and Technology, Fellow of the Royal Society of China, Senior Visiting Professor of IRC, University of Durham, UK, and more The country's major scientific and technological projects during the Ninth and Eighth Five-Year Plan, the first person in charge of the National Key Project, Wang Xia, a professor from the Shanghai Polytechnic University attended the conference.
Xieng Technology CEO Zhang Zhihao
First of all, Mr. Zhang Zhihao, CEO of Xiengeng Technology, introduced: 'After many years of in-depth scientific research and innovation, Xiengeng Science and Technology finally broke through the bottleneck of traditional high-temperature microsphere research and development, and brought this innovative product of ultra-high-temperature expandable microspheres into the public view. In the sphere of application research and development of the ball, other world's top 500 chemical giants have continued research since the commercialization of microspheres in the 1980s, but they have not been able to make breakthroughs in the commercialization of ultra-high temperature products. This field has long been a blank. 'Thinking, and Zhiyuan'. Forgetting ahead, Xieng Ultra-High-Temperature Expandable Microspheres will lead the transformation and development of the new lightweight materials field, injecting vitality into the sustainable development of China and the world. '
Next, the application of this innovative microsphere product was shared by Mr. Sun Weixian, CTO of Xiengneng. Faced with the trend of lightweighting of new materials and new products, many chemical product manufacturers of engineering plastics are eager to seek new directions for innovation. Ultra-high temperature microspheres Apparently it can provide them with a lightweight new solution.
The addition of ultra-high-temperature expandable microspheres enables the innovation of lightweight engineering plastics. The main engineering plastics include: Polypropylene (PP), Polyamide (PA, Plain Name: Nylon), Polycarbonate (PC), Polyoxymethylene ( POM), polytetrafluoroethylene (Teflon PTFE), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), etc.; these plastics can be widely used in daily necessities, home utensils, industrial spare parts , Large injection molded parts, Outdoor industrial products, such as trash cans, thin-walled containers, large turnover boxes, motorcycle baffles, vinyl inner barrels and parts, auto parts, general mechanical parts, corrosion-resistant parts and insulating parts, etc. Items that can be seen everywhere in daily life can be lightened by the addition of ultra-high temperature expandable microspheres.
Ultra-high temperature expandable microspheres (starting temperature 160-190°C, maximum foaming temperature up to 280°C) can be applied to the injection molding of thermoplastics with a temperature above 230°C, such as PP, PC, PA, ABS, etc. In the process of injection molding, the microspheres expand by heat, achieve controlled foaming, help all kinds of thermoplastic materials to produce a uniform closed cell structure, improve the surface structure while reducing the density, and improve the stability of finished products. Injection molding in engineering plastics In addition, the addition of ultra-high temperature expandable microspheres can reduce the product density by about 15-30%, thereby reducing the cost. Taking PC molding as an example, there is no addition of ultra-high-temperature expandable microspheres, and how to reduce weight becomes a business. A headache topic. Now that only 2% of ultra-high-temperature expandable microspheres are added, the resulting PC product density is reduced by 30%.
Currently, there are only about 5 companies in the world that are capable of researching, developing and producing microsphere products. As a local R&D company in China, Xiengeng Technology has been developing top-notch ultra-high temperature microsphere products for the world under the team's long-term and unremitting efforts. As more and more Chinese technology products are developed and researched, let China's high-end manufacturing go global and truly realize our Chinese dream.
Photo of participating guests