Cao Shilun, president of SEMI Taiwan, stated that the sales of traditional projects led by the growth of smart phones and personal computers were not as good as expected. The demand for semiconductor materials was reduced. However, driven by the mining demand for virtual currency, the overall market scale was offset. degree.
However, the strong demand for flip chip packaging for virtual currency applications has brought a large number of orders to many suppliers, but such a good picture cannot be maintained for a long time.
The Global Semiconductor Packaging Materials Outlook shows that, despite the automotive electronics and high-performance computing areas, continued increases in price pressure and material consumption continue to drive future growth in semiconductor material revenue. Stability, which will maintain single-digit growth, is expected to reach $17.8 billion in the material market in 2021. The material categories that have grown in single digits include leadframes, underfills, and copper wires.
Driven by the virtual currency boom, all 2017 revenues of laminate substrate suppliers have increased significantly. However, the use of multi-chip module technology has increased, and the packaging trend has gradually become fan-out wafer-level packaging. Technology is the mainstream influence, the growth of flip chip substrates will slow down, and the revenue growth of dielectric and plating chemistry suppliers will be stronger.