Yang Wende, deputy general manager of CINNO Research, believes that the launch of the iPhone X in 2017 will allow smartphones to enter the full screen era. In the second half of this year, Apple will launch three mobile phones (5.8-inch and 6.5-inch OLEDs and 6.1-inch LCDs). Version) will be a full-screen design. Other Chinese smartphone brands such as OPPO, VIVO, Huawei and Xiaomi have all moved closer to this kind of design. However, under the concept of a full-screen design, how to increase the proportion of screen is the biggest challenge, Part of the challenge comes from the change in the package form of the driver IC.
In the past, traditionally, the COG method (Chip-On-Glass) was adopted in a 16:9 screen aspect ratio design, and the driver IC was directly bonded through the glass substrate circuit, but the full screen design was entered at 18:9 or more. Later, in order to increase the proportion of available screens and the internal parts design of smartphones at the same time, in conjunction with COF (Chip-On-Film) packaging technology, TDDI began to be used by a large number of mobile phone manufacturers. With Greater China manufacturers drive IC manufacturers Duntai After the promotion of TDDI's promotion efforts, etc., the speed of IC price decline has also helped increase the penetration rate.
CINNOResearch predicts that TDDI shipments will exceed 300 million units this year and the annual growth rate will exceed 70%. The proportion of smart phones using TDDI will also officially exceed the 20% mark. It is expected that by 2020, the overall TDDI market size will reach RMB. The scale of 5.5 billion yuan.
Another bright spot under the overall wave of screens is AMOLED. Although current shipments of mobile AMOLED panels continue to be dominated by Samsung, the Chinese panel makers led by BOE are gradually making efforts in the production of flexible AMOLEDs. CINNO Research believes that in 2018, the smartphone penetration rate of AMOLED panels will continue to increase, with market share growing to nearly 27%, while Flexible AMOLED panels will exceed Rigid for the first time this year.
However, the proportion of shipments of Samsung's AMOLED mobile phone panels still maintains a share of over 90%, and its AMOLED panel driver ICs are mainly supplied by Samsung's own (Samsung LSI) and MagnaChip, which will also lead to non-Samsung camp AMOLED driver IC manufacturers. The proportion of shipments is low.
Opportunity is also a challenge. BOE and other panel makers have begun cooperation plans with non-Samsung camp driver IC makers, and have also given Chinese panel-driven IC makers an opportunity to overtake. With the shipment of Chinese AMOLED panel makers, The increase will also help increase the market share of non-Samsung AMOLED panel driver ICs. CINNO Research believes that the scale of AMOLED mobile phone panel driver ICs in Greater China (Mainland China and Taiwan) will reach RMB 2.3 billion by 2020.
In the TV market and computer market growth momentum is limited or even recession, the global smart phone market still maintains a small growth, and the rapid changes in mobile phone specification technology has also led to the rapid development of industrial technology, TDDI and AMOLED driver ICs that enable amazing future growth momentum. Become an important application trend of panel driver IC manufacturers to restart the growth trajectory again.