Linley Gwennap, chief analyst, wrote that Intel's 10-nanometer process has been repeatedly delayed, resulting in sprints of the next-generation process not only lagging behind TSMC, Samsung and its partner GlobalFoundries are also preparing to overtake.
It is reported that TSMC plans to mass-produce 7nm FinFET chips in June this year. TSMC will then achieve a 100% market share of 7nm chips. Qualcomm, Hass, and Xilinx are major customers of TSMC, and the benefits of the 7nm process will be in The second quarter began to reflect.
Samsung has already completed the development of 7nm process technology and used extreme ultraviolet exposure equipment (EUV) in this process technology. Initially, the company expects that the development of 7nm process technology will be completed in the second half of 2018, but it will catch up in the future. TSMC’s pace has now been completed six months ahead of schedule. It is reported that Qualcomm is preparing to send its new mobile chip sample to Samsung.
The report analyzes the chip circuit density produced by major manufacturers and other process technology indicators. The conclusion is that the level of technology used by other competitors has approached Intel. For example, there is almost no gap between 7-nanometer TSMC and 10-nanometer Intel. The report points out that the three major Competitors are procuring next-generation lithography devices more aggressively than Intel's, and it is not ruled out that the three will surpass Intel in 2021.
Intel Moat was attacked by opponents one by one, and the outlook for future revenues is worrisome. Recently, news broke that Apple will replace Intel processors with some of its Mac computers with its own R&D processor in 2020 at the earliest, threatening Intel's revenue.