In recent years, ICs have become a key industry for national development. US semiconductor technology has taken the lead. Japan's semiconductor technology level is comparable to that of the United States. Korea's storage market has driven technological advancement by leaps and bounds. What action does China have? After 2014, the Chinese semiconductor industry has also achieved With great progress, the dependence on technology, industry chain, and supply chain is still very high. China's huge market size, national security, and the development of a new generation of information technology urgently require the IC industry to promote.
In the government work report of 2018, the Prime Minister also clearly stated that ICs should be included in the top five industries that need to be promoted to speed up the building of a powerful country, and that China's integrated circuit industry could be developed in a sound policy environment.
On the afternoon of April 16, 2018, Xiamen Haicang District People's Government signed a contract with Xinzhou Technology (Xiamen) Co., Ltd. for high-end package carrier projects and Xiamen Semiconductor Investment Group Co., Ltd. and Xinzhou Technology (Xiamen) Co., Ltd. increased their capital and stocks. The signing ceremony of the agreement was held in Xiamen.
The signing of Xiamen Semiconductor Investment Group will jointly invest in and construct a R&D, design and manufacturing base for high-end package carrier board in Xiamen Haicang District together with JS Technology. It is reported that the total investment of the base is 4.6 billion RMB, which is located in Xiamen Haishu District Information Industry Park. With an area of 200 mu, the annual output value will reach 4 billion yuan. The project is divided into two phases. The first phase of the project will invest 2.3 billion yuan, and the output value will reach more than 2 billion yuan. The mass production is planned for the third quarter of 2019. Zhouzhou Science and Technology is the first time to appear as a parent company of Taiwan Hengjin in the public view. Hu Zhuqing, Chairman of the core boat technology, said that we will be synchronized with the global advanced FCBGA carrier board technology, with the ARMOR® (Xiamen's core boat) exclusive innovation in the carrier board area ( Armored Samurai) technology, focusing on meeting the need for higher-density integrated circuit modules (components), higher density and thinning. The products are mainly for high-performance chips such as CPU, GPU and FPGA, and AI, 5G, Networking and other applications.
Wang Huilian, general manager of Xiamen Semiconductor Investment Group, frankly stated: 'China's development has reached the stage where we must pay attention to core technologies and meet the independent research and development of scientific and technological resources, get rid of dependence on foreign chips and other products, and let more subdivided industries become autonomous. R&D, autonomous and controllable is the only road to the development of China's integrated circuit industry. The implementation of this project has a symbolic significance for enhancing the core competitiveness of the packaging carrier industry in the mainland of China.
The rise of major powers is closely linked with the development of science and technology. Frankly speaking, without the skills to draw up, China-made 2025 will be difficult to achieve. The implementation of this cooperative investment project is of milestone significance to the improvement of the core competitiveness of the mainland carrier board industry. , Also for Fujian and Xiamen Haicang perfect integrated circuit manufacturing process industrial chain to make up a key link.