Mini-U! Intel low-key release Core B series: 65W integrated package

Intel recently expanded its army of the eight generations of Core Duo to breathe in a variety of high-performance mobile and desktop versions. However, few people have noticed that Intel has also quietly added a Core B series.

This series currently only has three models Core i7-8700B, Core i5-8500B, Core i5-8400B , Specification parameters and desktop version without B suffixes are almost exactly the same, including the number of core threads, cache capacity, CPU frequency, GPU core size and frequency, memory support, Ao Teng support, thermal design power (65W), etc. , It is to remove the insignificant Boot Guard boot protection function.

The difference is, They are not the traditional LGA1151 socket-independent package, but instead the FCBGA1440 integrated package, like a notebook processor soldered on the motherboard.

Their specifications are obviously higher than the high-performance mobile H series released at the same time, but Intel stressed that this is not to add a separate B-series, but to meet the needs of specific compact devices such as all-in-one machines. Their internal space is limited, especially the height restrictions are very large, but they also require strong performance, so they also occupy more space. The independent socket is not suitable, and the integrated package is very good.

It can be imagined that in the future high-end all-in-ones, mini-computers and other products, these Core B series will be seen, providing performance equivalent to high-end desktops.

However, subject to thermal design power consumption and acceleration constraints, their performance, especially multicore performance, is lower than the standard version without the B suffix.

In addition, Intel quietly added a Mobile chipset CM246, Equivalent to the enhanced version of HM370, supports 24 PCI-E 3.0 buses, six USB 3.1 10Gbps interfaces, eight SATA 6Gbps interfaces, vPro vPro, Optane vPro, RST Enterprise Technology, thermal design power consumption 3W.

It is used with the new Xeon E-2186M/2176M mobile processor with the same homogeneity of the eight generations of Core high-performance mobile for mobile workstations, both of which are also 6 core 12 threads, especially the former and the flagship Core i9-8950HK. Specifications are basically the same, and additional support for ECC memory, vPro technology.

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