Group-Electronics today officially announced the new PCI-E SSD SSD masterPS5012-E12', top flagship SSD has a new choice.
PS5012-E12 is the first master of the group to use 28nm new process , Can be called a big leap forward, TSMC foundry, and the new process helps reduce the chip area and reduce power consumption.
It supports PCI-E 3.0 x4 System Interface , bandwidth up to 8GB/s, Supports the latest TLC, QLC and other types of 3D flash memory, with a maximum capacity of up to 8TB. It also supports Thunderbolt 3 interface external SSDs.
In terms of performance, the official example matches Toshiba's BiCS3 flash memory, which allows continuous read and write speeds up to 2TB. 3.2GB/s, 2GB/s , Random read and write speeds are all up to 600,000 IOPS.
In fact, at the Yingchi Carnival at the end of 2017, the group association with Yingchi’s unique strategic partnership in China introduced the PS5012-E12 master control in detail and called it support. NVMe 1.3 standard protocol, Tantalum capacitor brownout protection, Second generation LDPC error correction, Smart X-Block, Code Sign, etc. , and continue to support SmartFlush, SmartRefresh, GuaranteedFLush, end-to-end data path protection and other optimization techniques.
At that time, GALAXY also showed the new PCI-E SSD based on the main control, with a capacity of 8TB, and with a tantalum capacitor.
I believe that GALAXY once again got the starting problem.
At the beginning of the year, CES Group also demonstrated this master control.
