Founded in 2001, NEXX is an industry leader in advanced packaging markets and has strong technical capabilities in highly specialized Electrochemical Deposition ("ECD") and Physical Vapor Deposition ("PVD") technologies. This new acquisition will Incorporating APST's Post Process Equipment Business Segment.
"This strategic acquisition complements the advanced packaging applications we currently offer, and turns ASMPT into a premier interconnect technology company, while fulfilling our commitment to promoting innovation and providing customers with the highest value and innovative solutions. By combining NEXX With highly specialized ECD and PVD technologies, we are seeing tremendous opportunities for development in the advanced packaging market, which will help develop our business and strengthen the market driven by these data-driven eras,” said Mr. Li Weiguang, CEO of ASMPT Group.
Toshiki Kawai, chairman and chief executive officer of TEL, stated: “ASMPT provides an exciting opportunity for NEXX to enhance and expand its wafer-level packaging, ECD and PVD products. TEL believes that NEXX will benefit from outsourcing assembly with ASMPT and Test customer networks for greater synergy.
"As the demand for semiconductor equipment is at historically high levels, we look forward to increasing the coverage of global customers through ASMPT and expanding sales and service capabilities for our customers." explains Tom Walsh, president of NEXX.
About ASM Pacific Technology Limited As a global technology and market leader, ASMPT (Hong Kong Stock Exchange stock code: 0522) is committed to developing and providing cutting-edge solutions and materials for the global semiconductor assembly and packaging industry. Its extensive surface mount technology solutions Used in different end-user markets, including general electronics, mobile communications equipment, automotive industry, industrial, LED, and alternative energy sources.
ASMPT has been listed on the Hong Kong Stock Exchange since 1989. Currently, ASMPT has been included in the Hang Seng Composite Mid Cap Index under the Hang Seng Composite Market Value Index, the Hang Seng Composite Information Technology Index under the Hang Seng Composite Industry Index, Hang Seng Hong Kong 35 Index and constituent stocks of the Hang Seng Global Composite Index. For more information on ASMPT, please visit our website at www.asmpacific.com.
About NEXXNEXX Founded in 2001, it has developed Electrochemical Deposition ("ECD") and Physical Vapor Deposition ("PVD") technologies for semiconductor advanced packaging markets. TEL USA is a wholly owned subsidiary of TEL. TEL was acquired in 2012. NEXX, NEXX became a wholly-owned subsidiary company of Tokyo Electron US Holdings, Inc.