TEL NEXX supplies electrochemical deposition and physical vapor deposition equipment suppliers for the advanced packaging market of semiconductor devices.
ASM PACIFIC stated that the acquired business will be integrated into the company's post process equipment division, and believes that the acquisition is an opportunity to expand the product portfolio of advanced packaging and high growth markets for semiconductor devices.
In addition, the company also announced that its company ASM Technology Singapore acquired all of AMICRA's shares, but did not disclose the specific price.
AMICRA is a world-leading supplier of ultra-precise die bonding devices with submicron configuration accuracy for a technology company based in Regensburg, Germany.