The US Defense Advanced Research Projects Agency (DARPA) official last week released a request for information on a new type of urban sensing technology (DARPA-SN-18-44) to support the future DARPA program to improve urban sensing capabilities.
From an industry perspective, DARPA researchers are interested in sensor functions, sensor packaging, unique sensor technologies, sensor technology maturity levels, operational concepts, and system affordability that support city sensing.
Of particular interest is the low-cost, miniaturized sensor and sensor package design, and the level of technology maturity can be tested in the next one to two years.
Sensor technology should have extended operating durations and involve visual, acoustic, optical, radio frequency, pressure, spectrum, and polarization sensors to capture previously unexplored properties and characteristics of urban elements (including people, pedestrians, objects, and activities) .
DARPA researchers explained that advances in embedded technology have driven the rapid development of sensor technology that can obtain data from city-wide deployments for monitoring, modeling and understanding of urban activities.
DARPA hopes that companies, universities, non-profit research centers, US government laboratories, foreign entities and individuals will respond to this request. This response should include technologies that are at least as mature as components and breadboard verification in the lab.
Here are the technical areas that DARPA is interested in:
Integrated multi-sensor kit technology; Combination of sensing elements and specifications; Induction operating specifications; System-level performance capabilities; Storage capabilities; • Methods to reduce power consumption and enhance power harvesting; • Estimated size, weight, and power (SWaP) requirements; • System affordability (cost) assessment; • Ability to integrate third-party sensing elements; Evaluation; · Outline for the purpose of demonstrating system maturity; · Sensing technology; · Sensor specification; · Induction operating specification; · Special or unique capabilities; Networking capabilities; • Processors and storage capabilities; • Affordability assessments; • Technology maturity assessments; • Mature subsystem technologies for integration; • Mature demonstration systems.