Millet MIX 2S dismantling figure rewards: internal work fine | double shot into the biggest look

Millet MIX 2S back appearance. The machine uses a four-curved ceramic body, processed through many processes and texture, and attached to the back with anti-fingerprint AF coating, leaving little fingerprints.

The back cover of the back ceramic is coated with glue. After heating, the phone is opened with a professional rocker to separate the rear shell.

When removing the ceramic battery cover, it is necessary to pay attention to slowly open it from one side to prevent tearing of the fingerprint cable. After the back is opened, the wireless charging coil is in sight. The NFC antenna is above the wireless charging coil, and can be accessed through NFC. Complete near-field payment, transportation card and door card simulation and other functions.

Inside the millet MIX 2S back panel. It can be seen that the back cover of the battery is not only glued but also plastic clips.

Backplane fingerprint identification module.

Millet MIX 2S rear dual camera lens with sapphire glass, hardness up to 9H, scratch resistance. Also look carefully will also find that the metal stent around the lens is about 0.05mm higher than the glass, but also for the purpose of protecting the lens.

Millet's ceramic battery cover is a new all-ceramic crystal-reinforced ceramic material that better enhances the strength of the fuselage.

Back to the mobile phone itself, you can see that the graphite sheet has a double layered design and the area covers almost all areas of the motherboard. This design is designed to solve the problem of heat dissipation. We can see that the 3400 mAh battery capacity occupies. A large part of space.

Remove the motherboard and the battery, you can notice there is a U-shaped groove above the motherboard, and this part corresponds to the placement of the MIX 2S hidden handset unit.

The millet MIX 2S rear main camera uses a 12 million pixel Sony flagship IMX363 sensor, with a 1/2.55 inch bottom and 1.4μm large pixels, and a four-axis optical image stabilization. The sub camera lens is 12 million Samsung S5K3M3 + sensor .

Double photo module back copper film.

Removing the main board, the shielding cage of the main chip location has a large opening, this is to achieve better heat dissipation. But this will bring about process problems, such as the control of the flatness of the shielding box and the difficulty of solving EMI.

The most important areas of the motherboard, such as CPU, RAM and flash memory are covered with nano-carbon copper, compatible with heat dissipation and conduction functions, and can meet the double requirements of heat dissipation and shielding.

The details of the main board A surface are shown. The white box in the upper left corner of the ultrasonic distance sensor is the sounding device. The part corresponding to the right half circle is the receiver. Then the distance between the face and the mobile phone is comprehensively determined by a series of algorithms.

Motherboard B surface display.

The main version B surface details.

After removing 8GB of memory, you can see the core component of the whole machine - Xiaolong 845 SoC

Back to the body frame, you can see that the hidden sound guide handset uses a 50mv high-powered core. As a complement to the speaker in the loud speaker, the overall volume is increased. As mentioned before, the motherboard also specifically digs the receiver components Slots allow space.

After the earpiece is removed, it is displayed on the back.

The front shell assembly is removed by heating. In fact, the front shell still has a decorative strip. Its purpose is also very clear. It is to protect the TP and the liquid crystal module, and to mitigate the impact during the dropping process.

According to infrared spectroscopy, the material of this protection ring is high-strength PA high-fiber material. Compared with fiberglass PC materials commonly used in the industry, PA strength and dimensional stability are better, but the cost is high and the requirements for dispensing are high, especially For the control of the front shell and TP surface energy, MIX 2S adds this component to improve the overall screen strength and drop resistance.

Turning over the protective ring actually makes it easier to see the internal structure of the MIX 2S hidden earpiece and ultrasonic distance sensor: Three separate recessed imitation sealed chambers.

Close-up of hidden sound tube.

Before and after the lens contrast.

Before and after the lens size and close-up contrast.

Finally, take a look at the combination diagram of the main MIX 2S core components. From the entire dismantling process, it can be seen that MIX 2S has undergone many redesigns for the full screen. The ultrasound system has to be put down in the very cramped space at the top. The receiver and the ultra-sensitive double shots supporting OIS pose a great challenge to the structural design.