With the explosive growth of data traffic and the increasing demand to force cloud data centers to rapidly expand their capabilities, MACOM can provide CWDM4 with a cost-effective, high-performance and highly integrated interconnect chipset solution that can be extended to FR4 and FR1/ The DR1 application, therefore, has the ability to become a leader in the transition from 100Gbps to 400Gbps and 4G to 5G.
The core of MAOT-025402 is the MAOP-L284CN L-PIC device. This device integrates four high performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC), which can achieve 100Gbps communication based on duplex single mode fiber. MACOM L -The PIC platform provides highly integrated silicon photonics solutions for specific data center applications, including four CW lasers, monitoring photodiodes, high bandwidth waveguides, modulators and CWDM multiplexers. The L-PIC platform is patented with MACOM Self-aligned end-etching technology (SAEFTTM) accurately embeds a laser on a silicon chip, eliminating the need for active laser alignment, helping customers significantly reduce costs and enable mainstream deployment.
'MACOM is leveraging our L-PIC platform for leading scalability to meet the rapidly growing demand for CWDM4 modules,' said Vivek Rajgarhia, senior vice president and general manager of MACOM's lightwave business. 'This platform's automatic self-alignment calibration and Firmware control is expected to provide the necessary scale and cost combinations for mainstream cloud data center deployments.
MACOM's L-PIC platform provides leading bandwidth that is critical to the implementation of CWDM4 and is now available in TOSA and chip-scale form. Each L-PIC product includes a companion driver and PIC controller. With these three devices Chipsets, customers can significantly reduce engineering risks and shorten time to market. The accompanying software provides automatic calibration and self-test functions that can help customers significantly reduce capital investment required for the production line. MACOM's fully integrated, pre-assembled component platform It is expected to provide the high performance needed to implement 100Gbps and 400Gbps data center links while reducing the engineering costs and capital equipment costs of transceiver manufacturers, thereby reducing time to market while ensuring a lower level of investment.