With 100G connectivity requirements evolving to 200G and 400G, optical module vendors are looking for cloud data centers and high-performance computing (HPC) clusters using small-sized, low-power, and low-cost optical connectivity solutions. MACOM's full analog chips The group solution uses MALD-38435 driver and MATA-38434 TIA and existing MASC-38040 and MAOM-38051/38053 CDR devices to provide customers with the best combination of high performance, low power consumption and low cost. MACOM's solution Full analog circuits (instead of digital signal processing functions) achieve best-in-class low latency, which is especially important for high-performance computing applications.
The MALD-38435 driver and MATA-38434 device are available as chip-scale solutions (channel pitch 250um) and are ideally suited for direct bonding to VCSEL lasers and photodetectors. These devices support separate channel control via the I2C interface, through the module's Local control chips for flexible management. These devices have low power consumption, small die size and can be implemented in QSFP and QSFP-DD modules. They also have low jitter performance and can achieve 1E-15 low bit error rate (BER). And FEC protection link. Used in conjunction with MACOM's CDR, this solution provides rich channel-by-channel equalization and eye shape programmable functionality, as well as PRBS generator, inspector and eye diagram monitor functionality.
Following the success of the 100Gbps chipset for short-range applications, MACOM is pleased to introduce a new generation of devices targeting 400Gbps QSFP-DD and OSFP modules, said Marek Tlalka, Senior Marketing Director of MACOM's high-performance analog products. With our analog circuit technology, we can offer a complete chipset for high-performance, short-range optical interconnects with low power, low cost, and low latency (essential for cloud computing and HPC applications).