As telecom operators and Internet content providers continue to increase the demand for data rates and panel density, OIF is striving to develop standards for small-sized components, 64 Gbaud and 64 QAM. To meet the small size and high operating frequency requirements, Driver-chip and Mach-Zehnder modulators are extremely advantageous with package-level integration. Compared to existing discrete driver solutions where multiple die are integrated in surface-mount modules, this drives a single semiconductor The need for four-channel linear drivers in die.
Rajiv Somisetty, Senior Product Manager at MACOM Networks, said: 'We are very pleased to introduce this new type of highly integrated high-bandwidth modulator driver. In the past seven years, MACOM has been at the forefront of innovation in the deployment of coherent technology in modulator drivers. The newly launched modulator driver product portfolio for 64Gbaud systems, our leading position will be extended to the next-generation 400G and above rate deployment.
MACOM's MAOM-006408 integrates four channels in a single silicon germanium chip and enables full digital control through the Serial Peripheral Interface (SPI), enhancing the technological innovation standards. MAOM-006408 has been optimized to be able to Low power consumption flexibly drives various types of MZ modulators. In addition, it provides full analog and full digital control, which is expected to meet the requirements of HB-CDM and IC-TROSA standards.