With the advent of 5G connectivity, the demand for data traffic from wireless access, enterprise networks, and cloud data center applications is growing rapidly. Optical module customers continue to explore solutions that offer lower power, smaller size, and lower cost. MACOM The new TIA devices reduce power consumption by 20%, while providing higher sensitivity and greater overload performance, making TIA more cost-effective and ideal for high-density optical connectivity solutions. MACOM's new TIA solution The solution reduces the need for external components and streamlines the sealing of TO sockets or on-board chip (COB) components.
'MACOM's new TIA extends our 28G TIA product portfolio and is taking the lead in the rapidly growing market driven by the new generation of 5G network architecture,' said Angus Lai, MACOM's high performance analog product marketing director. 'Our latest TIA series There are PIN and APD diodes for excellent optical sensitivity and overload performance. In addition, with our highly integrated 28G VCSEL and DML laser drivers, ultra-low power consumption is a top-notch 28G module solution.
MACOM's MATA-03003 family of devices provides die placement flexibility for optical components that can be assembled into a variety of TO sockets with PIN probes for short-range (SR) and long-range (LR) applications; MATA-03006 can be equipped with high-performance APDs for applications with wider coverage (ER). The new TIA device supports low-rate mode operation through 28G VCSELs with integrated CDR (MASC-37028/MALD-37030) This is achieved with the RSSI control pin of the DML laser driver, which improves receiver sensitivity at low data rates and is backward compatible with traditional 10G optical modules.