After the micro-message news, MediaTek launched the Helio P60 chip in the Chinese market. The second quarter of the Indian mobile phone market will be renewed. Legal person points out that MediaTek P60 chip in the second quarter of the rapid growth in China and India, TSMC 12-inch plus 10,000 tablets Capacity, MediaTek-related chipset shipments are expected to increase by 10% to 15% in the second quarter, and shipments will reach 1.5 million to 1.8 million. The revenue will be better than expected, with double-digit growth.
After more than a year of sluggish mobile phone market in India, the research institute investigated that the market conditions in India began to recover in 2018. MediaTek joined hands with Chinese millet, OPPO, and local mobile phone maker Micromax to attack India’s recovery business opportunities. In the first half of the year, mobile phone chip sales will increase by more than 10% from expectations. .
According to research firm IDC, India ranks first among the world’s top 20 smartphones with the best performance. In 2017, India sold 124 million smartphones, an increase of 14% year-on-year, replacing China as the world’s largest growth. Fast area.
The industry stated that the Indian market is heating up in the first half of this year. Among them, China brand mobile phones have grown the most in India. The market share has increased from 34% in 2016 to 53%. In the top five Indian markets, Samsung is Chinese brand.
In the wave of new products released by mobile phone manufacturers in March, new products including OPPO, VIVO, Meizu and many other manufacturers will be equipped with P60. In the price range of smart phones 2000-3000, MediaTek will bring high pressure to competitors. Benefiting from the launch of new mobile phones and customer preparation requirements in China, the P60 has a strong momentum of shipments, and the Indian market has also received high-quality reports. It is a cost-effective way to join hands with millet, OPPO to attack recovery opportunities, among which Xiaomi’s advantage in India is unstoppable. The rate of up to 25% squeezed 23% of the old Samsung, took the throne of India's mobile phone leader, indirectly led MediaTek chip demand to follow.
2. Qualcomm CEO Morenkov: China regards cooperation as a partner to become an innovator;
Xinhua News Agency, Beijing, March 26th (Lin Jiwei) 'Qualcomm has always regarded China as a hot spot for cooperation.' On March 26th, Qualcomm (Qualcomm), who came to China to attend the '2018 Annual Meeting of China Development High Level Forum' CEO Steve Molenkov received an interview with Xinhua.com and stated that Chinese partners can use Qualcomm's technological R&D to create themselves as innovators. In this regard, Qualcomm sees great opportunities - making manufacturers become the driving force for innovation. .
Morenkov believes that the Chinese government is committed to further deepening reforms and expanding opening up, which will give China greater opportunities for development. 'The High Council will continue to invest in the Chinese market. We are very much looking forward to continuing to participate in the process of sustainable development in China. In the middle of the day, 'he said firmly.
Helping Chinese partners to explore the international market and winning the 5G era
In recent years, Qualcomm has maintained fruitful cooperation with Chinese mobile phone manufacturers and even the entire industry chain, and cooperation has become tighter and higher.
'China has tremendous energy in innovation. Some Chinese mobile phone manufacturers have even reached the top of the world in terms of innovation.' Molenkov highly praised the innovative capabilities of Chinese mobile phone manufacturers and believed that they could not only enrich their mobile phone products. New features, but also good at using the new features of the chip.
At present, China's mobile phone manufacturers are facing important opportunities and challenges towards globalization. As a global enterprise, Qualcomm maintains extensive cooperation with various countries in the international market. Molenkov said that Qualcomm will use these resources to help Chinese mobile phone cooperation. Partners develop the global market, and have already cooperated with some mobile phone manufacturers on how to 'go out'.
Looking forward to 2018, the world is about to usher in a new era of 5G, moving from 'connecting people and people' to 'Internet of Everything.' For Chinese partners in the 5G ecosystem, Qualcomm will not only help them achieve their leading position in 5G communications, At the same time, they will also support their overseas business success. 'Molenkov said.
As an important promoter of 5G technology development, Qualcomm has been pursuing 5G R&D for many years. 'The Qualcomm will use our technology and innovation to empower China's partners.' Molenkov said that on the one hand Qualcomm is actively involved with telecom operators and handset manufacturers. Cooperation in the 6GHz frequency band and the millimeter wave field; On the other hand, Qualcomm also hopes that 5G technology can help more partners than terminal equipment manufacturers, which is why Qualcomm acquired NXP Semiconductors.
Acquisition of NXP will enable more Chinese industry and create more opportunities
Currently, Qualcomm's M&A for NXP has been approved by eight countries around the world. It is still waiting for approval from the Ministry of Commerce of the People's Republic of China. This acquisition is not only important for Qualcomm's development in the era of 5G and Internet of Things, but also for Chinese mobile phones. Even greater empowerment of the Internet of Everything industry is crucial.
What will the acquisition bring to Qualcomm and its partners? Molenkov said Qualcomm has leading technology in computing and connectivity, and NXP has accumulated technological advantages in the automotive, Internet of Things, and security sectors. Security-related technologies are very important for promoting the development of related businesses such as mobile banking. These businesses have made progress in China. He said that with the forthcoming large-scale deployment of 5G in China, Qualcomm can immediately adopt the acquisition of NXP. These technologies are available to different industries, different types of Chinese companies.
'This is a good opportunity for Qualcomm to work with more partners, not just smart phones, but also to automotive, Internet of Things, education, medical and other areas based on 5G connectivity.' Cove firmly believes that this acquisition will give Qualcomm greater ability to cooperate with more Chinese companies and create more opportunities for China's IC industry.
For the acquisition of NXP, Qualcomm is very excited. According to Molenkov, Qualcomm has already completed plans and preparations for its business integration.
Good business environment helps Qualcomm to increase investment in smart times
In recent years, the protection of intellectual property rights in China has continued to increase, and a series of deployments have been made in the construction of the property rights legal system and the comprehensive management reform of intellectual property rights.
In Molenkov's view, China has made great progress in the protection of intellectual property rights. Qualcomm’s win-win cooperation in China is an example of this progress. “Our attitude towards intellectual property is not only respected, but also Protection. 'Molenkov said that intellectual property rights are very important to Qualcomm's business, and China is committed to creating a world-class business environment. Qualcomm's business is developing very well in China and Qualcomm's intellectual property rights are also being cooperated in China. Used by partners and paid for intellectual property.
Qualcomm is looking forward to China's future development prospects, and will continue to increase its efforts to accelerate investment and cooperation in China. Looking ahead, Molenkov said that Qualcomm attaches great importance to the development of the Internet of Things, specifically to the safe connection of intelligent Objects, artificial intelligence, and many of the smart elements on the edge of the Internet are securely interconnected. Qualcomm's future technologies and the direction of corporate investment will be based on the creation of technologies that connect smart objects or devices.
At present, Qualcomm is actively deploying artificial intelligence. However, Molenkov made it clear that for Qualcomm, it is more concerned with giving people around us the ability to use artificial intelligence. To make these devices or objects have artificial intelligence, Need to apply low-power technology, security technology, computer vision, etc. 'Based on high-pass to the mobile phone has accumulated a very strong technical experience, which provides us with good conditions to build the above technology in the next artificial intelligence stage. 'Molenkov believes that while the network is being intelligent, intelligence will gradually evolve toward the product terminals, and this will become a great opportunity for Qualcomm's innovation.
Although he has participated in the China Development Forum for many times, Molenkov feels that this year is particularly different. 'This year has given me a strong sense of the opportunity. That is, in the course of China’s continuous economic transformation, many themes are changing the Chinese society, including ' Made in China 2025' and 'high-quality development', and these themes are exactly in line with Qualcomm's business strategy. 'Xinhua
3. TSMC's production capacity has now been queued up.
Before the launch of 3 new iPhones in the second half of the year, the Android camp took the opportunity to grab wafer foundry capacity! Supply chain, MediaTek, NVIDIA, Broadcom, Hass and other customers took up capacity. Taiwan Semiconductor Manufacturing Co., Ltd. currently has fully loaded, 16-nanometer and more advanced processes, and has matured processes such as the 8-inch plant.
Since Apple's iPhone chips are designed or purchased from other manufacturers, nearly 80% of them are in Taiwan Semiconductor Manufacturing Co., Ltd., and Apple's iPhone shipments are large. In the past three years, as long as the Apple iPhone chip production chain was officially launched, TSMC’s production capacity The equipment industry will point out that in order to avoid less than TSMC’s capacity in the second half of the year, front-line customers including MediaTek, NVIDIA, Qualcomm, Broadcom, Hass, and Bitland, etc., all recently rushed to place orders before Apple.
According to the legal person, TSMC is currently fully loaded, 16-nanometer and more advanced processes have customers queuing capacity, and 8-inch mature process is fully loaded from last year to the present, if Apple 7-nanometer A12 processor is scheduled to start investing in the second quarter as scheduled. Film shipments of wafers will increase in the third quarter, and revenue is expected to hit a record high in a single quarter. The world's advanced economies benefited from the spillover effects of TSMC's orders. The order visibility has been seen in the second half of the year.
The industry originally believed that the revision of smart phone supply chain would continue to the end of the second quarter, but due to the fact that inventory de-conversion speed is faster than expected, not only the Android mobile phone factory has begun chip-stocking action recently, but Apple will also start this year for the next 3 years. The new iPhone is stocked with spare parts, representing the smart phone-related chip market has entered a cycle of recovery.
Due to the unsatisfactory sales situation of Apple's iPhone X, Apple has significantly reduced chip pulls this year and actively adjusted its inventory levels. For Taiwan Semiconductor Manufacturing Co., the first quarter was affected by smart phone inventory adjustments, and revenue performance would have normal seasonal corrections. Demand for crypto-currency mining special application chips (ASICs) such as Bitmain is strong, so the forecast for consolidated revenue of US$84-8.5 billion in the first quarter is expected to reach a smooth touchdown.
TSMC has never commented on customer orders and business conditions.
However, according to Apple's supply chain industry, this year is expected to launch three new iPhones equipped with 6.1-inch LCD panels and equipped with 5.8-inch or 6.5-inch OLED panels. The model design has been completed, and batches of components will be started from May onwards. In stock, the A12 application processor for the new iPhone, mobile phone baseband chips, WiFi wireless communication, power management ICs, and micro-electro-mechanical (MEMS) components will begin to roll out in April. That is, Apple’s new iPhone. The chip supply chain has moved.
4. Wanghong NOR Flash won the ST adoption of imported automotive market;
With the micro-message news, Wanghong took orders and reported its success. Its NOR Flash was adopted by STMicroelectronics' new microcontrollers and introduced into automotive, industrial and consumer electronics.
This is Wang Hong's reputation for high quality after Micron and Cypress's two major fabs faded out of the NOR Flash field. They were favored by European semiconductor manufacturers and became the main targets for memory purchases.
Wang Hong said that the newly developed ultra-fast 8-bit I/O NOR Flash, with an operating frequency of 250 MHz and a data transfer rate of 500 MB per second, can meet the needs of the automotive and industrial industries for quick start-up and instant response.
In addition, Wanghong also locked the bitcoin market this year, Flash products into the supply chain of the mining machine, the market customers need high-capacity products, currently only Wang Wang and the other two manufacturers can produce.
In 2017, Megan's market share of NOR flash memory is about 30%, which dominates the global market. In addition, less than 75nm process products account for 60% of NOR revenue in the fourth quarter of 2017, and Wanghong expects NOR type flash memory. In 2018, growth will come from data centers, telecommunications and automotive products.
Wang Hong said that in 2018 NOR Flash part of the current demand for 55-nanometer process stability, production capacity is still close to full capacity. High-capacity NOR Flash prices are still rising steadily, but the low-level NOR Flash products will have oversupply situation.
5. The deadline for approval is expired. Toshiba's flash memory transaction has not been reviewed and it is still seeking for sale;
According to a Reuters report, Toshiba, Japan, said today that it has not received approval from all regulatory agencies for its $18 billion sale of memory chips before its deadline for the end of March, but the company’s goal is to Sell the business.
Toshiba agreed last year to sell the world’s second-largest NAND flash chip production business to a consortium led by US private-equity firm Bain Capital to fill the financial hole left by the bankruptcy of its US nuclear business. Faced with deadlines approved by Chinese anti-monopoly authority before March 23rd.
Bain Capital’s acquisition consortium includes another flash memory chip company, South Korea’s SK Hynix. Due to market share and scale, Toshiba’s transaction needs to be reviewed and approved by US, European Union, Chinese and other anti-monopoly agencies. The statement stated that it has not confirmed approval from all regulatory authorities but has not named China.
"We don't yet know when the sale can be completed, but we will continue to work hard to sell it as soon as possible," Toshiba said. A speaker said the company has not yet given up to complete the transaction by the end of this month.
At the end of March, Toshiba’s fiscal year will end. According to foreign media reports, Toshiba can abandon the transaction if the transaction between Toshiba and Bain Capital reaches the deadline of late March and still cannot be approved by national antitrust agencies. , Seeking other development options. Toshiba does not have to pay any liquidated damages.
Toshiba’s attitude indicates that it is not ready to consider other alternatives. For example, analysts previously forecasted the split-up of flash memory. Previously, some media also believed that the lack of anti-monopoly approval may be a good thing for Toshiba, due to improved financial data. The company can re-raise the offer, even $4 billion more than the current price.
One background of the transfer of flash assets last year was that Toshiba needed to obtain more cash to avoid insolvency until the end of March this year (otherwise it would be completely delisted by the Tokyo Stock Exchange).
After signing with Bain Capital, Toshiba conducted overseas financing, transferred some non-core assets, and its flash memory business also achieved good operating results. Right now, even without flash memory transactions, Toshiba does not need to worry about being traded by securities. Delisted.
According to reports, some active shareholders oppose Toshiba's transaction and believe that the asset value is underestimated. They think that they should negotiate with Bain Capital to negotiate on the purchase price, or make the flash memory business split.
It is generally believed that the biggest difficulty in the review of Toshiba deals comes from South Korea's Hynix. The industry is also concerned that if the acquisition is completed, Hynix will gain greater scale and influence in the market and damage the market competition. Historically, Hynix has passed. Abnormal means to obtain a case of Toshiba Semiconductor Technology.
6. Tuoba Industrial Research Institute: The third-generation semiconductor material market can grow;
According to the micro-network news, 5G will enter into commercial use in 2020. With the trend toward smart, networking and electrification, it will drive the third generation of silicon carbide (SiC) and gallium nitride (GaN). Development. According to Takubo Industry Research Institute, the global SiC substrate production value will reach 180 million U.S. dollars by 2018, while the GaN substrate output will only be about 3 million U.S. dollars.
Topo Research Institute pointed out that compared to the current mainstream silicon wafers (Si), the third generation semiconductor materials SiC and GaN have high temperature resistance and are suitable for high frequency operation, in addition to high voltage resistance. Not only can the chip area be greatly reduced, but also the design of peripheral circuits can be simplified to reduce the module, system components, and the volume of the cooling system. In addition to the lightweight vehicle design, due to the low conduction of the third generation semiconductors The characteristics of resistance and low switching loss can also significantly reduce the energy conversion loss during vehicle operation, both of which contribute considerably to the improvement of the endurance of electric vehicles. Therefore, the technology and market development of SiC and GaN power components, and the Development is inseparable.
However, SiC materials are still in the verification and introduction stage. At this stage, the automotive field is only applied to racing cars. Therefore, the current global level of automotive power components, the use of SiC solution area is less than one thousandth. On the other hand, GaN power modules on the market today are manufactured on GaN-on-SiC and GaN-on-Si wafers. Among them, GaN-on-SiC has the most advantages in terms of heat dissipation performance, and is suitable for high temperature applications. The frequency of the operating environment, so the application of the 5G base station has the highest visibility. It is expected that the SiC substrate will enter the high-speed growth period in the next five years through the depot validation and commercialization of 2020 5G.
In spite of the large area of GaN substrates, the cost remains high and the output value of GaN substrates is still lower than that of SiC substrates. However, the advantages of GaN in high-frequency operation are still the focus of major technology companies. The products use GaN-on-SiC technology. GaN-on-Si, through its cost advantage, has become the mainstream of GaN power components in the market. The applications for power management chips and charging systems required for automotive and smart phones are the most applicable. Growth.
Topo Industrial Research Institute pointed out that observing the development of the supply chain, as 5G and automotive technology are at the center of the industry's growth trend, the supply chain has developed a foundry model to provide OEM services for customers' SiC and GaN, changing the past. It is only supplied by manufacturers of integrated modules such as Cree, Infineon, Qorvo. In GaN part, TSMC and the world’s leading supplier of GaN-on-Si are available. The company specializes in GaN-on-SiC targeting 5G base stations. Business Opportunities. In addition, X-Fab, Han Lei and Huanyu also provide OEM services for SiC and GaN. With the foundry business, the market size of third-generation semiconductor materials will also be further expanded.
7. Resistor price increase: TDK capacitor rose 3-4 times;
According to sources, the daily TDK capacitor product price has been adjusted, and the direct price increase is 3-4 times. The major agents have been notified. In addition, sources also revealed that the giant Taiwanese company MLCC is also The new price will be implemented starting from April 1. The average price increase for the 0201-1206 series is 2-5 times higher than that in February of this year. The individual 0201 price increases 200 times. Moreover, the new price is no longer executed according to the contract, but According to the date of shipment on April 1st. Cloud Finance