ST's space-saving and thin ACEPACK technology integrates high power density and reliability in a cost-effective plastic package. Product features include an optional solderless crimping process. This process can replace traditional solder pins and metals. Screw clamps simplify the assembly process for fast, reliable installation.
Inside the chip, ST's third-generation trench field stop IGBTs achieve a perfect combination of low on-resistance and high switching performance. The new module is available in two configurations: six pack modules with six IGBTs and free-wheeling diodes. Can be used as a three-phase frequency converter; Power Integration Module (PIM) provides a complete drive power stage. PIM is a converter-converter-brake (CIB) product that integrates a three-phase rectifier, three-phase frequency converters and process load feedback Energy braking unit. Both products contain a negative temperature coefficient thermistor for measuring and controlling the temperature.
Various PIM/CIB and sixpack products are available in ACEPACK 1 or larger ACPEACK 2 packages, with built-in 650V or 1200V IGBTs and rated currents from 15A to 75A. The internal layout of the module is optimized to reduce stray inductance and EMI radiation, making it easier to achieve Compliance with EMC regulations. 2.5kV isolation ensures robust performance of the module under harsh operating conditions. The maximum rated operating temperature for all modules is 175°C, allowing designers to more freely optimize heat sink size and power dissipation.