1. The 11% global IC design revenue share is still behind Taiwan;
ICinsights reported on Friday that the company's share of global IC sales reached 27% in 2017, an increase of nearly 10% (9%) from a decade ago. The so-called fabless semiconductor company means no Fab IC design company.
Regionally, U.S. companies accounted for more than half of global non-factory semiconductor revenue, reaching 53%, but lower than 69% in 2010, mainly due to the acquisition of Broadcom by Singapore Avago. It is preparing to move its headquarters back from Singapore to the United States. After the completion of the operation, the United States’ share is forecast to rise back to 69%.
Taiwan’s IC design company accounted for 16% of the world’s total in 2017, about the same level as in 2010, ranking second in the world. It includes MediaTek, Lianyungang, and Ruixin’s IC revenue exceeded US$1 billion last year, and squeezed into the global market. Leading position before reluctantly.
In 2017, mainland China accounted for more than 10% of the world's non-factory semiconductor revenue, and came to 11%, which is twice the 5% in 2010. In the past year, a total of ten land-based plants have entered the top 50.
However, according to TSMC, mainland China's IC design revenue reached 21 billion U.S. dollars in 2017, accounting for 21% of the world's total, while the number of mainland companies entering the world's top 50 reached 12. Both data exceeded ICinsights' report.
2.Vanchip tailors high-performance RF front-end for 4G full-screen mobile phones;
Original title: HPUE is not the best choice, Vanchip tailored high-performance RF front-end for 4G full-screen mobile phones
The micro-network message, starting with the emergence of a full-screen concept on the market in 2016, this smart phone's revolution in value and value quickly swept the entire mobile phone industry. In 2017, under the leadership of new machines released by Samsung and Apple, they took a wave. In the design trend, with the smartphone market becoming saturated and the replacement rate slowing down, the micro-innovation of the design became one of the focuses of mobile phone brand manufacturers. The full-screen mobile phone also became the mainstream of the market. In particular, the Apple iPhone X was once Tucao's Notch special (Qi Liuhai) design, this year has also become a target for mobile phone brand manufacturers to imitate.
On the one hand, large-screen mobile phones do give users a better viewing experience in terms of screen visibility. On the other hand, with the advent of full-screen products, the size of large-screen mobile phones can become even smaller, portable and portable. The sense of grip can give users a better experience. Although 2017 entered the full screen battle, the full screen is not a standardized concept.
From a technical point of view, the current comprehensive screen still belongs to the shortage of resources in the market. Due to the larger screen share ratio, the comprehensive screen not only requires special-shaped design, but also uses CNC or laser to cut the panel shape, and the proportion of the screen is larger. The smaller the space inside the cabling line. In addition, the larger screen share will also put new demands on other parts. At the same time, it needs the cooperation of cameras, fingerprints, handsets, antennas and equipment factories. For ODM manufacturers, they also tested their ability to integrate upstream and downstream resources.
In particular, when the screen occupation ratio basically reaches 80%-85% or more, less mobile phone space is left to the circuit design part. Therefore, with the rise of LTE and even 5G multi-mode multi-band design boom, The smart phone RF front-end not only faces multi-antenna or multi-band interference, but also challenges the design space. It must also support carrier aggregation to improve signal reception capabilities. As a result, the relevant chip developers are stepping up to deploy next-generation RF technologies to meet the stricter requirements of mobile phone manufacturers. Specifications.
Typically, the RF front-end module is composed of RF device components such as RF switches, power amplifiers (PAs)/low noise amplifiers (LNAs), RF filters, and antenna devices (tuners and switches). The components that are essential to communications, for increasingly complex mobile phone RF designs, all know that mobile phones look better and better, antennas are more and more difficult to do, and efficiency is getting lower and lower. Traditionally, it is designed at the upper and lower ends of mobile phones. The space between the mobile phone screen and the metal shell is used.
The width of the so-called 'headroom' part of traditional mobile phones left for antennas is about 7-9mm. In a full-screen design, this part of 'headroom' is greatly reduced and compressed to 3 to 5mm, especially for iPhone-X. Liu Hai Noach screen, may be about 2 mm clearance.
The reduction of antenna headroom reduces the gain of the antenna, which results in the traditional radio frequency system design failing to meet the communication protocol and networking requirements. A higher output power RF front end must be used to compensate for this part of the antenna loss.
At present, most full-screen mobile phones use high-power RF front-end systems developed by foreign manufacturers for HP UE systems to solve this problem. However, after all, this program is developed for HP UE systems and is not tailored to 4G full-screen mobile phones. Therefore, it is not the best solution, for example, the RFT module (TxM) of foreign manufacturers does not consider the application of the full screen, and the GSM saturation power is slightly insufficient.
The high-power RF front-end does not simply increase the power. While increasing the power, it also needs to solve a series of problems such as harmonics, current loss, and temperature compensation, which poses a great challenge to the RF front-end design. Understanding customers After the demand for high-power RF front-ends, Vanchip quickly organized its forces to develop new technologies. Relying on its strong research and development capabilities and long-term accumulated engineering experience, Vanchip took the lead in launching a front-end RF front-end for 4G full-screen mobile phones. solution.
The only RF front-end solution for the 4G full-screen mobile phone application is CD-CX, which is fully compatible with the mainstream Phase2 RF front-end solution. The power output of all frequency bands supported by the product has been enhanced and the harmonics have been optimized. Current and current. In particular, the saturation power of the necessary call module (TxM) for 4G smart phones has also been properly improved, ensuring that the phone call quality is not affected by the change of the antenna. This helps the mobile phone R&D engineer to complete the mobile phone design quickly and easily. Guaranteed the progress of research and development.
This solution has been well received by users since it was introduced, and has been introduced into multiple designs. Soon, the market will be able to see a full-screen mobile phone using Vanchip high-power RF front-end components.
3. Anhui Chizhou IC industry is developing rapidly;
In recent years, Chizhou City has been vigorously developing the integrated circuit industry. A large number of integrated circuit companies have gathered in Chizhou, and the industry has developed four characteristics: high, fast, strong, and full.
High degree of integration. 18 companies such as Anhui Semiconductor Semiconductor and a number of integrated circuit projects have settled in the Chizhou Economic and Technological Development Zone. The district has now concentrated more than 95% of IC companies in the city. The development speed is fast. The existing integrated circuit companies in the city 20 companies, which have tripled compared to 2015, have increased production value by nearly 20 times. Strong innovation capability. The only discrete device engineering laboratory in the province was approved, and radio frequency integrated circuit engineering laboratory passed acceptance; OLED Chinese Sanjie Chen Jinxin settled a group of top talents in the industry, and successively identified 10 high-tech companies. The entire industrial chain. The integrated circuit industry has gradually expanded from the initial wafer manufacturing to the core, screen, and device. “Intelligent terminal industry-wide ecological chain, including small-size wafer chips, IC chip packaging annual production capacity in the forefront of the province. Chizhou Daily
4. Filling the gaps in China! Zigong IC 8/12 inch silicon wafer project started;
On March 22nd, Sichuan Jingle Changfeng 8/12 inch silicon wafer project was started construction in the Zhangcang Industrial Park in the High-tech Zone. This project will fill gaps in domestic silicon wafer products and effectively supplement domestic semiconductor integrated circuit industry and automobiles, computers, communications, etc. Industry's market demand for 8-inch and 12-inch semiconductor-grade monocrystalline silicon wafers. Party Secretary Li Gang attended the groundbreaking ceremony and announced the start of construction. He Shuping, deputy secretary of the Municipal Party Committee, and mayor attended and addressed.
At the end of the national “two sessions” victory, the city started to learn and implement the 'two sessions' spiritual upsurge, Sichuan Jingle Changfeng 8/12 inch wafer project started, to expand the city's new generation of electronic information industry clusters, enhance the level of industrial development , has a very important role.
Qin Shu, technical expert of the project, said that semiconductor silicon technology has been monopolized by Japan, South Korea, and the United States.
At present, China's 12-inch integrated circuit-level silicon wafers can not be mass-produced, relying on imports. After the implementation of this project will reduce China's dependence on the import of high-quality semiconductor wafers.
He said that in the next few years, it will remain an important strategic and golden development period for the development of China's semiconductor industry. The completion and production of the 8-inch/12-inch silicon wafer project in Zigong will significantly reduce the production costs of related products and further increase the competitiveness of domestic industries. Force to make new contributions to the development of China's semiconductor industry.
He Shuping pointed out in his speech that in recent years, the city has taken industrial transformation and upgrading as an important breakthrough in promoting high-quality development, and vigorously implemented the '633' industrial restructuring and upgrading action.
A new generation of electronic information industry from scratch, a dozen of companies have settled in Zigong one year. He asked the Hi-tech Zone and all relevant departments to firmly establish the "need to optimize the business environment is to liberate productivity, enhance competitiveness," and take the initiative to do Good service work, timely coordination of difficulties and problems in project construction, provide strong guarantee for project construction, and hope that project owners and construction units will seize favorable opportunities according to project requirements, ensure project quality, speed up construction progress, and strive to achieve early Completed, put into production as early as possible.
Lin Meng, Chairman of Sichuan Jingle Changfeng Semiconductor Co., Ltd. introduced that the 8/12-inch wafer project started this time covers a total area of 580 mu. The first-phase project will be completed in one year. The company will invest in the acquisition of epitaxial wafer processing equipment 400 Yutai, building a standardized production system, formed monthly production capacity of 100,000 8-inch and 400,000 12-inch wafers. After the project is fully put into production, the annual output value will reach 3.6 billion yuan, and the annual tax revenue will be 150 million yuan.
Before the ceremony, Li Gang and He Shuping heard a report from the director of Sichuan Jingle Changfeng Semiconductor Co., Ltd. on the progress of the project. The opening ceremony was hosted by Zhang Bangju, member of the Standing Committee of the Municipal Party Committee and Secretary of the Party Committee of the Gaoxin District. Vice Mayor Zeng Mingquan, Secretary-general of the municipal government Huang Xuezhi Attended the opening ceremony. Zigong.com
5.Dun Tai IDC shipments are still strong, Q1 revenues increase by double digits
Duntai (3545) went to IDC (integrated drive touch single chip) shipments in (2017), and shipped 62 million units, accounting for 30% of last year's revenue. This year, the company is still optimistic about IDC market demand. It is estimated that this year will account for nearly half of this year's revenue. However, the outside world is also concerned that, in the fourth quarter of last year, United (3034) shipped about 10 million TDDI shipments. Faced with an opponent’s menacing situation, it is fearful to divide up the market. However, Dun Tai is optimistic. Full In- The cell should gradually become mainstream, and the market will also become bigger. Let's enjoy watching the peers join in. Looking forward throughout the year, the legal person predicts that IDC will still be a growth driver with 15 to 20% growth in revenue, and it will continue to be profitable. Observe the pressure of peer competition.
In the product line, the three major product lines of DunTai currently include the three major products of panel driver ICs (DDI), touch ICs, and integrated drive touch ICs (IDC). Last year, there were also some fingerprint identification products. However, the volume is still small. Based on the proportion of revenue from last year, DDI accounted for about 40%, followed by touch IC accounted for about 30%, and IDC accounted for about 30%.
In the DDI segment, Duntai's products are mainly small-size LCD panels. They are mostly used in smart phones and are supplied to panel makers. They are mainly BOE and Tianma, and their brand customers are land-based mobile phones, such as Huawei, OPPO, VIVO et al. As the mobile phone market has become saturated, the slow declining trend is unstoppable. Duntai also said that this year's first look at the same level as last year or a small recession.
Touch ICs are divided into two types, Out-cell and Full In-cell. Out-cells are used to fit the panel module and the touch module. This year's shipments ranged from 300 to 3.5 million units. Full In-cell puts IDC directly in the panel LCD, which is more lightweight. With the increasing proportion of mobile phone screens, the space under the original mobile phone is reduced. Therefore, DNT believes that Full In-cell will gradually become The mainstream, IDC shipments will also rise. In this trend, Duntai also believes that the traditional Out-cell shipments should decline by about 20 to 25%.
The so-called IDC integrates the driver ICs and touch ICs in a single chip, which is also known as TDDI in the market. IDC of Duntai is an FHD standard mainly used in LTPS panels, used in mid to high-end mobile phones. The other is HD specifications for a-Si panels. Terminals are mid- to low-end phones. The application of both is about half.
IDC accounted for Duntai’s revenue of 30% last year, with shipments of 62 million units and market share of approximately 35 to 40%, second only to 50% of Synaptics in the United States. Duntai said that currently In addition to the original customer's orders, the demand for new customers is also obvious. Therefore, it is expected to ship more than 100 million units this year, which is expected to account for 50% of the revenue, which is the largest kinetic energy this year.
The legal person cares that TDDI’s plan to launch TDDI into the mobile phone market will swallow up the market share of Duntai. However, Duntai said that since the panel maker hopes to unify the IC pin specifications this year, the panel can replace the IC at any time. Currently in the panel of FHD, the United States Xinsi does not want to adopt a unified specification, but Duntai, United is willing to, so this year, Duntai and United have the opportunity to share the market share of the new thinking. In addition, Duntai also believes that despite IDC The ASP has indeed declined slightly due to pressure from rivals. However, due to the fact that Full In-cell is becoming more popular this year, the market is getting bigger, and the overall revenue growth this year can still be expected. In terms of gross profit margin, new products are consolidated through cost reduction.
In addition, in the product line of fingerprint identification, Duntai is still in its infancy, and its shipment volume is still small. It can be divided into two types, capacitive and optical. In the past, it was mainly capacitive. In the beginning, an optical fingerprint identification scheme under the screen was introduced. , Support for multi-point fingerprint recognition under the screen, can be applied to mobile phones with AMOLED and LCD panels. The technology is to use infrared light receiving. In addition to identifying fingerprints, it can even carry blood sugar, blood pressure and heart rhythm and other non-invasive physiological measurements. Duntai It is said that all solutions on the market today can only be equipped with AMOLED panels. Since LCDs are opaque panels, it is difficult to use light to identify them. The 5.5-inch cell phone equipped with 3 units will be capable of full-screen recognition. High-end mobile phone models entered the market, is expected to see the fastest aircraft models next year.
As for other applications, such as wearables, vehicles, home appliances, industrial controls, etc., but the amount is not large, such as the car is locked in the front loading market, such as dashboard, central control panel, etc., the current monthly production capacity is less than 1KK In the second half of this year, there should be moderate growth.
DunTai's revenue last year was 10.798 billion yuan, a 2% year-on-year decrease. In the fourth quarter, the U.S. tax reform policy resulted in taxation of U.S. subsidiaries. The one-time income tax amounted to approximately 250 million yuan, resulting in an EPS loss of 0.28 yuan last year.
Looking forward to the first quarter of this year, due to the continued strength of IDC shipments last year, legal persons are expected to grow by 10~15% compared with the same period of last year. Looking at the whole year, corporations are expected to have 15 to 20% growth in revenue due to the momentum of IDC. In terms of profit, it is still necessary to observe the pressure of peer competition.