When is the 'official' domestic mobile phone no longer | 'Core pain'

1. When domestic mobile phones no longer 'core pain'; 2. Huawei released the world's first 8-antenna 4.5G LTE modem chip; 3.5G has come! Huawei released the first 3GPP standard 5G commercial chips and terminals; 4. Materials Academician Wang Hao academician innovation, practically promote the development of microelectronics industry; 5. Jiangsu Province, 2017 IC industry data announced

1. When domestic mobile phones no longer 'core pain';

This year's government work report calls for promoting the development of the IC industry. The IC industry, commonly known as the 'chip' industry, can be described as 'industrial food'. As the world’s largest electronics manufacturing country and mass consumer market, in 2017, China's IC imports have reached more than 200 billion US dollars.

This kind of 'core-lessness' pain is also present in smartphones that are almost hand-stitched. In particular, with the development of domestic branded smartphones from mid- to low-end to mid-to-high-end, the resulting high-end component costs have increased. Industry profits have caused further squeeze.

Is it necessary to independently research and develop the chip? How does the independent chip break? These issues have become the focus of attention.

Apple's single mobile phone profit can reach 151 US dollars, which is nearly 14 times the profit of Chinese manufacturers' average mobile phone.

The chip is the commanding point of information technology. Xiaomi founder, chairman and chief executive officer Lei Jun believes that 'the chip is only as big as a fingernail, but it may be the most complicated thing on this planet, because it puts most of the components that the mobile phone needs Packed in, high stability requirements. '

According to experts, mobile phone chips are very important for the R&D and manufacture of mobile phones. Especially now the performance of mobile phones is reflected by the difference in the performance of the chips. The functions of the 'cerebral center', communication, multimedia, and photographing of mobile phones depend on the underlying layers. Type chip to achieve. Most of the current mobile phone chip is a highly integrated chipset.

China is the world's largest smart phone market and production country. In the fierce market competition, China's mobile phone manufacturers continue to rise, but when it comes to 'profit rate', some manufacturers tend to avoid talking.

According to relevant statistics, in 2017, Apple and Samsung took away 86% of global smartphone profits, and the profit of Apple's mobile phones even reached 151 US dollars, which is nearly 14 times the profit of Chinese manufacturers on average for each mobile phone. Brand mobile phone profit of only a dozen yuan.

There are many reasons that influence the mobile phone's profit, such as brand and cost control. However, the factors of the mobile phone chip cannot be ignored. According to calculations, the cost of a chip's core components accounts for more than one-third of the smartphones priced at 1,000 yuan. At present, domestic mobile phones mostly use chips developed and produced by foreign companies. Excessive patent licensing fees have a large impact on the profits of domestic mobile phone manufacturers.

On the other hand, those mobile terminal manufacturers who can produce chips themselves have obvious advantages in combining hardware and software. After mastering the chip technology, the stability index and power consumption of mobile phones will increase by an order of magnitude. With regards to the shipment of millions of handsets, this means excellent handset performance and a great user experience. It also means an increase in brand image and brand value, and it can achieve greater profitability. Currently, the world’s leading mobile phone manufacturers , Basically have their own chips, such as Apple, Samsung, Huawei, Xiaomi, etc. Have their own chips, to become an important way to get rid of the homogenization competition.

'The chip is the commanding height of the technology of the mobile phone industry in the future. If you want to become a super player in this field, the technology at the top of the pyramid must be won.' Zhu Ling, CEO of Xiaogu’s pinecone electronics, believes that only companies that master core technologies can Will be in the future 'exam test', and other players to open the gap.

It takes time for domestic self-developed chips to catch up with foreign chips, but it is constantly making breakthroughs and moving towards high-end

Some experts believe that the current proportion of domestic mobile phones using independent chips is not high, mainly independent chips do not have corresponding capabilities.

A mobile phone contains a lot of chips, such as communication baseband master chip and WiFi, memory, fingerprint identification and other chips. Each chip currently has a market leader. For example, Qualcomm dominates the communication baseband, which occupies almost half of the baseband chip market, and Broadcom leads the company. WiFi and RF front-end chips, Samsung led memory chips, etc.

According to industry insiders, from the perspective of supply, in the Android mobile phone market, the supply of foreign chips accounts for more than 50% of the supply base chip. The domestic mobile phone brands such as Huawei, Xiaomi, OPPO, Vivo, etc., communicate with the baseband chip. Most of them use foreign chips. Among them, Huawei partially uses its own communication baseband chip. RF front-end chips, memory chips basically all use foreign chips.

In the face of strong independent chip demand, several powerful domestic manufacturers responded with practical actions. Ziguang Group successively merged and merged two chip design companies, Hexun and Rui Dike from 2013. Currently, Ziguang Zengrui has become China's shipment. The largest integrated circuit design company and the world’s third largest mobile phone chip design company. Huawei’s Hais Kirin chip shipments exceeded 100 million... Xiaomi released its own self-developed first mid-to-high end mobile phone chip at the end of February last year and became an apple. 3. After Samsung, it was another mobile phone company with its own chip technology.

In a special mobile phone chip design enterprise like Qualcomm, Violet Zengrui is the third largest baseband communication chip company in the world. Its chips are used by more than 80% of domestic mobile phone brands, but at present, it is mainly at the middle and low-end models. The advantages are mainly reflected in the price/performance ratio. The high-end models of the domestic brand mobile phone flagship still use foreign chips.

Experts believe that the development of China's telecommunications industry is starting late compared to developed countries. There is still a gap between research and development capabilities, technology accumulation, patents, and foreign manufacturers. Therefore, domestic self-developed chips basically start at the low end, and it takes time to catch up with foreign chips. However, it will take time. The national government supports and invests in policies and funds. Domestic chips are constantly making breakthroughs and moving toward the mid-to-high end.

The establishment of core technologies requires cycles and undergoes constant breakthroughs. Zhu Ling believes that the self-developed chip released by Xiaomi has been successfully mass-produced and successfully carried on mobile phones. This was a breakthrough that was almost unthinkable before. In addition, currently Huawei’s The mobile phone chip is expected to develop faster on 5G, domestic related companies have begun to start the development of memory chips, domestic fingerprint identification chips are gradually increasing market share.

5G is considered to be the key to catching up with China's own mobile phone chip

Lei Jun believes that with the gradual increase in the complexity of processes and technologies, the cost of chip R&D will continue to increase. There are still many ways to go in the future. The first-generation chip millet invested 1 billion yuan, gradually increasing the complexity of processes and technologies. , The future investment may have to increase to 1 billion yuan or even 2 billion yuan each year.

Industry experts believe that the constant accumulation and perfection of long-period chips required for chip R&D and huge investment are also important reasons why many domestic companies are daunting. Huawei's Hass chips can achieve breakthroughs, and Huawei's mobile phone support behind it is crucial.

At the same time, the accumulation of large-scale funds and talents does not represent an improvement in the level of technology. It still needs the guidance of the market behind. When the chips produced can be put into use and continue to improve iteratively, when the market moves into a virtuous circle In order to really make the industry work.

Taking domestic self-owned brand Ziguang Zengrui as its example, it is the only domestic mobile phone chip design company with its own embedded CPU core technology, which has positive significance for promoting chip safety and control. At the same time, Ziguang Zengrui’s chips gradually cover In the high-end, has a certain degree of technical advantages, Lenovo, Huawei, Cool and other domestic brands mobile phones have used the baseband chip of Violet show sharp.

'With the improvement of independent innovation capabilities, the gap between ours and foreign chips is gradually narrowing. ' Ziguang Group Chairman Zhao Weiguo said that on the one hand, China has the world's largest chip market, on the other hand, the integrated circuit industry is the core of the entire information industry At the core, the country has given strategic support to the semiconductor and chip industries and expects to achieve catch-up in the 5G field.

5G is considered to be the key to catching up with China's own mobile phone chip. Currently, Ziguang Zengrui, Huawei, and Xiaomi are all conducting corresponding R&D for 5G technology, and they hope to achieve simultaneous deployment of 5G mobile network to the market.

Industry experts believe that, driven by the market, China will not only be a gathering place for mobile phone R&D, but will also become a gathering place for the development of global integrated circuits. More and more international technology companies have shown strong intention to cooperate with Chinese companies. If it can lead the leading companies to play a leading role, it will provide a good opportunity for the development of China's semiconductor industry.

Zhao Weiguo believes that international cooperation is the way. Domestic companies have a foothold in independent innovation and master core technologies with independent intellectual property rights. 'Independent innovation + international cooperation' is a two-wheel drive to promote the development of domestically-developed independent chips. Cooperation with international advanced companies It will help domestic companies to rapidly increase their technological strength, achieve complementary advantages, complete technology accumulation, and launch products that are more in line with market demand, thereby further enhancing their independent innovation capabilities. It is believed that in a further five to ten years, domestic mobile phone chips will have a series of core Breakthrough in technology. People's Daily

2. Huawei releases the world's first 8-antenna 4.5G LTE modem chip;

On the 26th of February, at the World Mobile Communications Conference (MWC) in 2018, Huawei released the world's first eight-antenna 4.5G LTE modem chip, the Balong 765 (Barron 765), to show the industry Balong 765's innovations in the application of mobile connectivity and Vehicular verticals provide a reliable solution in the evolution from 4G to 5G, and use connectivity to change the future of life.

Balong 765 has the world's leading communications connectivity capabilities, which can increase the efficiency of spectrum resource utilization by operators, provide end-users with an extremely fast communications experience, and provide highly integrated and highly reliable chip solutions for Vehicular Communications. Balong 765 is the world’s first Supports LTE Cat.19 chip, the peak download rate reaches 1.6Gbps in the FDD network environment, 1.16Gbps in the TD-LTE network, is the world's first TD-LTE G-bit solution; Balong 765 is also the world's first, the only industry Supports 8x8 MIMO (8-antenna multiple-input-multiple-out) technology, modulating and demodulating chips, leading the industry in rate improvement and signal reception, and spectral efficiency is improved by 80% compared to 4×4 MIMO; LTE-V technology is supported, which is a smart network connection The car provides a more secure and stable connection.

The World's First Modem to Implement 8*8 MIMO Technology to Maximize Utilization of Operator Spectrum Resources

In the current world, mobile communication has become an indispensable part of people’s lives. Whether it is work or life, it needs to maintain a stable connection in real time online. In the coming years, with the development of new services such as virtual reality, augmented reality, and 4K HD video, Users’ demands for network capacity and connection experience will continue to grow exponentially, bringing new business opportunities to operators. However, the scarcity of spectrum resources has always been the biggest challenge faced by operators worldwide. How to increase the utilization of spectrum resources , Providing consumers with a better experience in limited spectrum resources is a common problem for global operators.

To overcome this problem in the existing network environment, Huawei's Balong R&D team took full advantage of the communication advantages in the 4.5G field, innovated and upgraded the communications specifications, making the Balong 765 the world’s first chip supporting LTE Cat.19, with a peak download rate in FDD. 1.6 Gbps in the network environment and 1.16 Gbps in the TD-LTE network, again achieving a breakthrough in communication speed, providing faster Internet access for users worldwide. Balong 765 is the world's first 1 Gbps in TD-LTE networks. The communications chip solution, for operators using TD-LTE standard, its users will get unprecedented Internet experience leap.

Balong 765's powerful network signal reception capability brings faster and more stable speed communication experience. Balong 765 is the world's first 4.5G chip supporting 8×8 MIMO technology, compared to 4×4 MIMO, 8×8 MIMO technology. The increase of spectrum efficiency by 80% means that under the same spectrum resources, 8×8 MIMO technology can help operators, expand network capacity, protect operators’ existing investment in spectrum resources, and make more investments in spectrum resources. Good returns. Based on the 8 antenna technology of Balong 765, the terminal signal is stronger and more stable, and the end user can feel higher peak download rate in a wider range of signal coverage.

2018 MWC exhibition area

Baron 765 is the world's first 8-antenna 4.5G modem chip. The 8-antenna technology enables traditional eMBB services to achieve a peak download rate of 1.6Gbps with minimum spectrum, ie 2 carriers, to LTE Cat. 19 Standards. 8 Antenna technology can also provide higher communication coverage. Compared with traditional mobile phones, it can increase 9-10 dB (multiples of units), and optimize the network (mobile phone 2*2 MIMO technology) environment for network optimization. 8. The improvement of coverage by antenna technology will enable some new vertical industries, especially car networking, drones and smart factories.

1. Car networking for car networking scenes, Baron 765 can significantly improve the signal problem. In the past there was no signal in the underground garage, now after 10 dB increase, the reliability of the connection has been greatly improved.

2. When drone drones are at low altitude, according to the current network regulations, there is no specific optimization for UAVs. There are many holes in the coverage. Barron 765 can be significantly reduced after 10 dB increase. The probability of covering a hole.

3, smart factory traditional smart factory because there is no eMBB server, so the signal coverage is weaker. With the Baron 765's 10 dB increase, communication coverage will be greatly improved.

Leading LTE-V communication system, providing high-quality solutions for car networking

With the constant breakthrough of communication technology, the future life is about to enter the era of the Internet of Everything, smart life, smart cities, and smart transportation will become a reality. Operators can achieve close links between industries through connection and data services, and change the world with mobile technologies. However, before the commercial use of the 5G scale, LTE networks need to be further evolved to maximize the value of the existing network. This is also the core meaning of 4.5G technology at this stage. The development of 4.5G communication technologies will help operators based on existing networks. Deploy and use its own advantages to serve the vertical market.

Among them, car networking is one of the core application scenarios of 4.5G. The current development of car networking is facing the predicament of insufficient development of communication technologies. In order to meet the normal operation of various types of automotive applications in the car networking ecosystem, it is necessary to adopt more than existing communication technologies. Lower latency, more reliable technology, and new breakthroughs in communication coverage and bandwidth.

The emergence of Balong 765 will deal with this challenge. Balong 765 is the world's first single chip to support the integration of LTE-V and other communication systems, fully supporting GSM / UMTS / TD-SCDMA / TD LTE / FDD-LTE / LTE- V variety of formats, provides a highly integrated chip solution for car networking, 8x8 MIMO multi-antenna technology will effectively reduce the delay, but also provides a more secure and stable connection for the car network.

Among them, LTE-V is the latest car linkage solution launched by the 3GPP protocol. It is an evolutionary technology based on 4G LTE system for intelligent traffic and car networking applications. It includes vehicles and vehicles, vehicles and transportation infrastructure, and vehicles and people. Connections, these connections will greatly improve vehicle safety and transportation efficiency. LTE-V has two major air interfaces, one is PC5 port and the other is UU port. PC5 port is mainly the communication air interface between car and car, while UU port is Direct communication air interface between car and network, based on Balong 765 has a variety of communication system integration capabilities, single chip can simultaneously support PC5 and UU interface, enhance the connection between cars and cars, cars and networks, make cars become the future of things An important member of the world.

4.5G is the only way to 5G. It can protect operators to the greatest extent on the basis of existing investments, achieve a significant increase in mobile broadband capabilities, massive connectivity of cellular IoT, and bring ultra-low latency applications to the industry. Pave the way for 5G. Balong 765 will also use its own communication advantages to bring infinite possibilities to the Internet of Things. It is worth looking forward to.

It is reported that the terminal equipped with Balong 765 chip is expected to begin commercial use in the third quarter of 2018.

3.5G has come! Huawei released the first 3GPP standard 5G commercial chips and terminals;

Gathering micro-messages, Huawei's consumer business officially launched Huawei's first 3G standard (globally authoritative communication standard) 5G commercial chip, Barong 5G01 (Balong 5G01), on the eve of the 2018 Mobile World Congress (MWC). The chip's first 3GPP standard 5G commercial terminal - Huawei 5G CPE (Consumer Premise Equipment, 5G user terminal).

Yu Chengdong, CEO of Huawei's consumer business, stated that '5G is a brand-new and disruptive starting point that will bring human society into a new era of the Internet of Everything. This will bring great convenience to people's lives and production methods, and users will communicate and share. The way will also produce revolutionary changes. 5G will not only meet the needs of the communications industry, but will also improve the global smart environment, bring new feelings to industrial manufacturing, and the lives of people including medical, home, and travel. The release of Huawei's first 3GPP standard 5G commercial chips and terminals is a key breakthrough in the global 5G industry, which means that the 5G era has arrived.

Huawei's Balong 5G01 is the world's first commercially available 5G chip based on the 3GPP standard. Balong 5G01 supports the world's leading 5G frequency bands, including Sub6GHz (low frequency) and mmWave (high frequency), and can theoretically achieve up to 2.3Gbps. Data download rate, support NSA (Non Standalone, 5G non-independent networking, that is, 5G network architecture in LTE) and SA (Standalone, 5G independent networking) two networking methods. 5G networks and terminals are two commercial 5G Basic conditions, and for the terminal, the chip is the most important, is the key to the development and maturity of the 5G industry. Balong 5G01 is the commercial chip released after the 5G standard was frozen for the first time, marking Huawei's breakthrough in 5G terminals. The commercial bottleneck of the chip has made a significant contribution to the development of the 5G industry. This also means that Huawei is the first company to have 5G chip-to-terminal-network capabilities that can provide customers with end-to-end 5G solutions.

Huawei 5G CPE is divided into low-frequency (Sub6GHz) CPE and high-frequency (mmWave) CPE. Huawei 5G low-frequency CPE weighs 3kg and has a volume of only 2L. It can be placed indoors. Its measured peak downlink rate can reach 2Gbps, which is 100M. With 20 times the peak fiber speed, you can download a episode of network drama in less than 1 second, which can support various types of high-definition video and entertainment applications such as VR high-definition online video, VR network games, etc. based on 5G networks. Extremely enjoyable online entertainment experience, compatible with 4G and 5G networks. Huawei 5G high-frequency CPE includes outdoor ODU (Outdoor Unit, digital microwave transceiver) and indoor IDU (IndoorUnit, interface data unit).

According to the 5G standard defined by the ITU (International Telecommunication Union), 5G networks have high speed, wide connectivity, and low latency. They can achieve peak downlink rates of up to 20Gbps, linking 1 million devices per km2 and as low as 0.5ms. The time delay, which means that communication in the 5G era is not only a connection between people, it will expand people's connection to the object of the IoT (Internet of Things). For 2020 and the future, based on the 5G network of VR /AR applications, industrial Internet, driverless and car networking and other enhanced mobile broadband (eMBB) and Internet of things (IoT) applications will grow explosively with the maturity of the 5G network, it is expected that by 2025 the number of global connections will reach 1000 Billion, where the connection based on objects will account for 90%.

Based on this, Huawei's consumer business has also released a terminal strategy for the 5G era, which will be based on the characteristics of 5G high speed, wide connectivity, and low latency, respectively. They will launch CPE, Mobile WiFi and smart phones that connect home and people, respectively. 5G industrial module, 5G car box connected to the car. According to reports, Huawei's first 5G smart phone will be listed in the fourth quarter of 2019.

As a leader in the global 5G industry, Huawei is actively responsible for industry leaders and has tackled many major technical issues. It also actively participates in 3GPP standards work. As early as 2009, Huawei started 5G related research and has invested at least US$600 million so far. In 5G research and innovation, 11 5G research centers have been established in the world (France, USA, Canada, Germany, Russia, Sweden, Chengdu, Shanghai, Beijing, Shenzhen, Hangzhou), and more than thousands of experts have participated in 5G research. Currently Significant progress has been made in areas such as networking, spectrum use, air interface technology, prototype implementation, and field verification. At present, Huawei's measured 5G network peak rate in the 5G experiment network has reached 20.25 Gbps, with low latency. To 0.33ms, the number of devices that can be connected per square kilometer reaches 2.17 million, which fully meets the requirements of the ITU standard. Huawei has already cooperated with China Mobile, China Telecom, China Unicom, Vodafone, SoftBank, T-Mobile, BT, Telefonica, etc. 30 Yujia’s top operators cooperated in 5G. In 2017, Huawei took the lead in cooperating with partners to open 5G pre-commercial networks. In 2018, it will promote the industrial chain. And completed interoperability testing and commercial support for the first round of 5G. The future, Huawei will join industry partners to promote global harmonization of standards, co-innovation, promote 5G standardization and industrialization process, to build a better all things Internet era.

4. Materials scientist Wang Hao academician innovation, hard work to promote the development of microelectronics industry;

Original title: Shanghai Science and Technology Profession Award | Materialist Wang Hao Academician Innovation, Practicality Promoting the development of microelectronics industry

2017 Shanghai Science and Technology Profession Award Academician Wang Xi Source/Interviewee for illustration

Wang Hao: Academician of the Chinese Academy of Sciences, member of the Communist Party of China, Director of the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, famous materials scientist, chief pioneer and leader of high-end integrated circuit substrate materials in China. Long-term commitment to energy-carrying ion beams The physical phenomenon of interaction with solids was studied and applied to the development of SOI. Academician Wang Hao vigorously promoted a large number of large-scale integrated circuit major projects in China and Shanghai. Among them, the 12-inch integrated circuit silicon wafer project filled China's large-scale silicon. Industry blank.

To be a scientist, we must link our own research with the country's strategic needs, and we must lay out the big picture and do big things. ' This is a word often spoken by Wang Hao.

From the development of SOI to solve the urgent need of China's aerospace electronic devices, the completion of the 12-inch integrated circuit silicon chip project, to fill the gaps in China's large-size silicon wafer industry, Wang Hao is a microelectronics material's 'nurse.'

In recent years, Academician Wang Hao has won the First Prize of National Science and Technology Progress Award, the First Prize of Shanghai Municipal Science and Technology Progress Award, and the Outstanding Achievement Award of Science and Technology of the Chinese Academy of Sciences. He also had a one-time selection of clearance, becoming the youngest academician of the Chinese Academy of Sciences in that year. Colleagues and friends praised Wang Hao as the Shanghai Science and Technology Profession Award. They all said that they deserved it.

Innovative scientists

In 1983, Wang Hao was admitted to Tsinghua University. Since then, he has worked hard in the field of energy-carrying ion beams. At that time, a technology called silicon-on-insulator (SOI) was commercialized by IBM Corporation, widely used for speeding. Computer server. This is internationally recognized as 'silicon integrated circuit technology in the 21st century'. It has important applications in low-voltage low-power circuits, high-temperature circuits, micro-mechanical sensors, and photoelectric integration. The technology blockade was rarely known. Wang Hui, who returned to China in 1998, took up the leading task of researching SOI technology.

'SOI has many applications and is particularly prominent in spacecraft components. When SOI technology is not mastered in our country, we can only use thickened lead plates as a way to deal with radiation.' Wang Hao said. However, for each additional weight of satellites, the cost will increase significantly. 'At that time we had fewer satellites and had a short life span. ' To solve this problem once and for all, SOI development is imperative.

SOI walked out of the thesis and stepped out of the laboratory to gather the sweat of the team. In July 2001, Wang Hao created the only SOI material R&D and production base in China – Shanghai Xinao Technology Co., Ltd. In more than one month, it has built China's first SOI production line with international advanced level. In July of the next year, the first batch of brilliant, crystallized SOI wafer materials came out. The world exclaimed that China 'suddenly' appeared. A modern SOI plant.

On the road to innovation, Wang Hao’s footsteps have never stopped. As the country's major technology special project specialist deputy chief technical officer, Wang Hao vigorously promoted a batch of integrated circuit major projects in China and Shanghai, including 12-inch integrated circuit silicon project filled The industry gap of China's large-size silicon wafers. Wang Hao also led the team to develop special process technology to achieve high-reliability SOI wafers, and to develop high-reliability integrated circuit chips to meet its application requirements in special environments, to achieve key elements in related fields in China. The device is autonomous and controllable.

The strategic vision of the doer

In the process of advancing the national integrated circuit major project, Wang Hao clearly realized that China currently has a large gap with foreign countries in the construction of world-class integrated circuit R&D institutions, and its industrial innovation capability is not strong, and it is difficult to produce core competitive technologies. In 2012, Wang Hao submitted the MtM plan to the city leaders, hoping to promote the role of Chinese IC R&D institutions in the industry by drawing on the innovative models of foreign laboratories. The following year, the Shanghai Institute of Microtechnology Industry was registered in Jiading. , To build a functional platform with enterprise operations. This platform across production and research 'chassis' has become one of the “four pillars and eight pillars” of Shanghai's global science and innovation center. In September last year, China’s first global leading 8-inch 'Beyond Moore' The R&D pilot line is officially operational. This pilot line, built by the Shanghai Institute of Micro-Technology, aims to bridge the layout of the Moore Industrial Eco-Chain from R&D to small-batch production, assisting with innovative R&D.

When the old French Soitec company mainly provided SOI to chip manufacturing companies such as Gexin, Wang Hao had already turned his gaze to new applications for automotive electronics, sensors and other SOI wafers. In 2014, Wang Wei proposed again that he hopes to develop 12 inches. Silicon wafers. At the time, from the outside world, this was a 'yet thankless' job. Wang Hao himself also broke the leg for a financing of 500 million yuan. Over time, the current global silicon tension, wafer prices rose. Once again, the decision of risk has become the right choice. In the future, Wang Hao hopes to integrate with world-class technology and enter the world's first square as soon as possible.

In the memory of Qin Wei, Assistant Director of the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences, Wang Hao has a strategic vision. 'In terms of major decisions, Director Wang is very respectful of the opinions of experts and he has a strong sense of marketization. With a unique vision to acquire domestic and foreign wafer companies.

Emotional leader

On September 26 last year, the establishment of the Zhangjiang Laboratory opened a new chapter in the construction of the Shanghai Science and Innovation Center. Academician Wang Hao served as the director of the Zhangjiang Laboratory. In his heart, he always had a dream to allow scientists to concentrate on doing research on a platform. Don't be distracted for the project.

Zhang Jiang Lab gave Wang Xi an opportunity to realize this dream. However, the burden of falling on Wang Xi is not light. In more than five months, Zhangjiang Lab has established a large-scale scientific facility group with innovations in institutional mechanisms and innovation. Many breakthroughs have been made in the areas of network construction. Now, Wang Shuo has tightened the winding spring. He is further improving the Zhang Jiang laboratory's formation plan and is seeking to be listed as one of the first batch of national laboratories. Wang Hao said that it will face the world. To attract and select high-end talents, establish a high-level scientific research team and a professional management team. Relying on Zhangjiang Laboratories, Shanghai Municipal Science and Technology Major Projects such as 'Siguang' pre-research on 'hard line' and 'brain intelligence', etc. will be launched to upgrade as soon as possible. The degree of concentration and degree of display of the Zhangjiang Laboratory. Recently, Zhangjiang Laboratories signed a contract with the French National Laboratory, and its development entered the 'fast lane'.

In the interview, Wang Wei repeatedly mentioned that real high-tech projects must be industrialized without the involvement of scientists. 'The lab's success and the application of a technology cannot be drawn with equal signs. I hope to have more in the future. Using Market-oriented Rules to Solve National Strategic Needs. ' Xinmin Evening News

5. Jiangsu IC Industry Data Released in 2017

According to the micro-network news, the Jiangsu Semiconductor Industry Association today announced the development of the integrated circuit industry in 2017. In 2017, the total sales revenue of the integrated circuit industry in Jiangsu Province was 168.786 billion yuan, a year-on-year increase of 17.82%. Among them, integrated circuit design, manufacturing, and sealing The total sales revenue of the three industries measured was 131.873 billion yuan, an increase of 20.42% year-on-year; IC support sales revenue was 36.895 billion yuan, an increase of 9.36% year-on-year.

among them:

IC design industry sales revenue was 19.866 billion yuan, an increase of 21.96% year-on-year; IC wafer sales revenue was 24.591 billion yuan, an increase of 13.78% year-on-year; IC packaging industry sales revenue was 87.816 billion yuan, an increase of 22.08% year-on-year; In 2017, the discrete device sales revenue in Jiangsu Province was RMB 16.628 billion, a year-on-year increase of 15.33%.

Among the three integrated circuits industry in Jiangsu Province in 2017, the design industry accounted for 18.65%, and the packaging and testing industry accounted for 66.59%. The tertiary industry accounted for only a small change from 2016 year-on-year. The 2017 IC industry employees in Jiangsu Province reached approximately 123,000. People, up 7.2% year-on-year.

2016 GoodChinaBrand | ICP: 12011751 | China Exports