Editor's note: In 2014, with the release of the State Council's "Outline for the promotion of the development of the national integrated circuit industry" and the establishment of the "advancing team" and the "national integrated circuit industry fund," China's integrated circuit industry has risen to a new strategic height. It is synchronized with advanced countries in 2030. China's integrated circuit industry has truly entered the era of catch-up. The national 'Thousand Talents Program' distinguished expert, Professor Zhu Wenhui of the School of Mechanical and Electrical Engineering of Central South University is the chief of China's first three-dimensional package '973' project. Scientist, an internationally renowned microelectronics packaging expert in the field of integrated manufacturing, a leader of the 'Thousand Talents Program'. He witnessed the rapid development of China's microelectronics industry in recent years, and made personal legendary scientific research career development progress for this field. Outstanding contribution. As he said: 'Overseas students must have a participating attitude and a national sense of national responsibility. Only by doing so can they fully grasp the opportunities as soon as possible, and maximize the social benefits of opportunities, and bring their own professionalism. And experience serves the development of the motherland. '
Fearless choice, open a new chapter in life
After graduating from high school, Zhu Wenhui was admitted to the Department of Modern Mechanics at the University of Science and Technology of China. The Department of Modern Mechanics of the University of Science and Technology was founded after Professor Qian returned to China. He once served as the director of the department, and Zhu Wenhui chose it without hesitation. After completion, Zhu Wenhui was sent to graduate school, and later he completed a Ph.D. in the Department of Applied Physics at the National University of Defense Technology. In 1996, he was invited by Professor Yu Tongxi to visit the Hong Kong University of Science and Technology, and went to the National University of Singapore for the next year to study high-performance computing in Singapore. Senior Engineer of the Institute, engaged in research on impact dynamics and explosion effects. Two years later, Professor Yu Tongxi introduced him to the Assistant Professor of the Ministry of Education and Culture in the laboratory of Shinji Tanumura, Osaka Prefectural University of Japan. 'At that time, I chose to go abroad due to relatively weak domestic scientific research and technology gap. As I was older, I wanted to go abroad to learn advanced things. In the future, I can make even greater contributions to our country!” Zhu Wenhui said with emotion when he recalled the scene of going abroad.
In 2001, by chance, he began his long journey in the microelectronics industry. From the study of mechanics to the transformation of microelectronics packaging, many studies have to start from scratch. Zhu Wenhui has given him the sweat of an extraordinary imagination. In the field of microelectronics packaging, Zhu Wenhui, with his love for scientific research and high concentration, has achieved amazing results in a short period of time. He quickly proposed a green packaging material selection method. The research on the thermal fatigue reliability of the package solder balls is completed, which lays a foundation for the development of green microelectronic packaging.
Innovating and Managing Leapfrogging
At the 2008 EPTC International Packaging Conference in Singapore, Zhu Wenhui met with Mr. Bi Ke Yun, Chairman of the China Packaging Association. Under the great recommendation of Mr. Bi, Zhu Wenhui decided to return to the northwestern region of the motherland to open up a new world of packaging.
At the beginning of Hua Tian, there was a serious shortage of talents, and the basic investment was minimal. The company has been doing low-end manufacturing, and it has almost no innovative research and development. After Zhu Wenhui made clear the situation, he started with research and product planning, researched and formulated the development of the company. Strategy, optimize the research and production system, build a combat team, and fully promote innovation and development. With the support of Chairman Xiao Shengli, Zhu Wenhui began a drastic reform and innovation. He led the establishment of a national enterprise technology center. , Plan to establish the Huatian Packaging Technology Research Institute, establish an engineering R&D system, and focus on cultivating a strong R&D team, which has effectively promoted the identification of the National Enterprise Technology Center.
On this basis, he led and organized the implementation of Huatian's first National Science and Technology Major Project 02 'Multiple Ring V/UQFN, FCQFN and AAQFN Packaging Process Technology R&D and Industrialization' projects and subsequent multiple project topics. With the R&D and industrialization of the Huatian series of advanced packaging products BGA, FC and high-density QFN, the company has achieved breakthroughs in the development of major technologies and industrialization of high-end advanced packaging.
He led the copper wire technology development project, broke the key technology of copper wire ball welding and oxidation protection and other integrated circuit copper wire bonding packaging, reached the international advanced technology level, and gradually gained promotion and application on 90% of the products, and achieved remarkable economic benefits. And social benefits. This scientific and technological achievement has enhanced the market competitiveness of enterprises and has become an important support for maintaining the high profits of Huatian's long-term industry.
He is responsible for the MEMS project research and promotion and application in the three places, and develops into a new product growth point. He opens the development and maintenance work of Huatian International's major customers, helping Huatian Technology become internationalized; he leads the establishment of the Tianzhuzhuang Institute of Different Orientation. , Xi’an Branch and Kunshan Branch. On the high-end packaging leap represented by TSV, Zhu Wenhui has a forward-looking vision, starting from technology trends and market positioning, promoting Huatian’s acquisition of Kunshan Shanxi Titanium Microelectronics Technology Co., Ltd. (now China Technology (Kunshan), sounded the breakthrough for Huatian to high-end TSV packaging.
In the spring of 2012, Zhu Wenhui was appointed as the general manager of Kunshan Shanxi Titanium Microelectronics Technology Co., Ltd. Under his leadership, with the accurate grasp of the latest technology trends and development routes of the global image sensing industry, the development orientation of Titanium Microelectronics was positioned. At the height of dominance of the global image sensor chip, the company achieved profitability in only three months, and the company’s packaging output increased from more than two thousand pieces to eight thousand pieces within half a year. The output value has increased four times in one year. Declared that Kunshan Titanium quickly entered the high-speed development stage, promoted the development and industrialization of TSV-CIS, and was highly recognized by the industry.
Zhu Wenhui is always full of the urgency of 'not waiting for me' on the road to catch up in the industry. In the four years when he was the chief engineer, Zhu Wenhui completed a number of major assignments and served as Director of the Institute, Kunshan Shanxi. Titanium general manager, deputy director of the technical center and other groups have important positions. Behind these auras is a keen insight and hard work.
Pass the torch, grasp both ability and moral education
China's semiconductor industry infrastructure is still relatively weak, but if we want to promote China's packaging industry to achieve 'from catching up to beyond' and improve the international competitiveness of China's packaging industry, our concept, technology and management must be in line with international standards and take the path of internationalization. Not one or two people or one or two companies can do it, and it requires a lot of professionals. And universities will be responsible for taking on the responsibility of cultivating and transporting talents. A thinker who stands at the height of national industrial development has therefore invested in new forms of higher education. In the middle of the challenge, Zhu Wenhui returned to campus in early 2014 and started the journey of teaching and research in Central South University.
'I always think that the 'people' problem is the most critical. No matter which industry, which position, training personnel is everyone's social responsibility. Now, our country's semiconductor industry is in a stage of rapid development. The breakthrough in promoting the semiconductor packaging industry cannot be achieved by a single company, a team, or a manager. 'Zhu Wenhui explained. The development of the industry requires a lot of professionals. The school is such a link to transport talent. Teaching to school is a responsibility for yourself.
Teachers and managers are completely different roles. In enterprises, more economic benefits are considered. After returning to colleges and universities, more attention is paid to the cultivation of talents and academic research. This is yet another challenge for Zhu Wenhui. The many years of management experience accumulated in the company made Zhu Wenhui profoundly aware that the research between universities and enterprises needs to be closely integrated. Since his teaching, Zhu Wenhui devoted himself wholeheartedly to team building and research and teaching, organized and led the implementation of China's first packaging field. The '973' project 'Basic research on wafer-level three-dimensional integration of 20/14nm integrated circuits', and made a number of important advances in the atomic level manufacturing base. At the same time, the leadership set up a new 'Microsystems Manufacturing Science and Engineering Department'. And the 'Advanced Micro-Nano Manufacturing Center' has established a research and teaching team in the direction of microelectronics. The goal is to develop into a demonstration base to lead the domestic three-dimensional integration of disciplines and research and teaching, and to support the rapid development of China's semiconductor industry with talent training and results output support. development of.
In the ordinary life, Zhu Wenhui and the students often interact together, always concerned about the students' scientific progress and living conditions. Teachers and students have formed a good interactive atmosphere, they often play badminton together, similar to mountain climbing and exercise, Holidays also often cook with students at home. Zhu Wenhui often educates students, not just pursuing some utilitarian results, only satisfying utilitarian desires will limit the development of individuals. 'I think the cultivation of personality and ability is the most important. Teachers need to guide students to morality and morals, pay attention to the improvement of students' abilities, and teach them to be practical in their research work. In addition to fulfilling their academic tasks, they must also bravely assume social responsibility.
At present, China is in a critical period of transition from a manufacturing power to a manufacturing powerhouse. Zhu Wenhui is conscious of the arduous task and is working tirelessly to contribute to the scientific research and talent cultivation of the motherland at the frontline of scientific research. Zhu Wenhui has done what he has done. Everything was attributed to responsibility. He said: 'I didn't do much more than just doing what I was supposed to do.'
Expert Profile
Zhu Wenhui, male, was born in 1966 in Miluo, Hunan. He graduated from the Department of Modern Mechanics, University of Science and Technology of China in 1986, received a master's degree from the department in 1988, and received a Ph.D. in applied physics from the National University of Defense Technology in 1995. Specialist Expert of “Thousand People Project”, Expert of Expert Committee of Special Expert of National Science and Technology Major 02, Expert Consultant Committee of China Packaging and Test Industry Innovation Strategic Alliance, Director of the First Board of Directors of Huajin Semiconductor Pilot Technology R&D Center, Consultant, Packaging of China Electronics Association Director of the Club, External Expert of the Guangxu Venture Capital Investment Decision Committee (2017), Chairman of IEEE ECTC2011 (Florida, USA) China Semiconductor Forum. Received the AIST Research Award from Japan Science and Technology Promotion Agency, Humboldt Foundation Prize in Germany, and the 3rd ICEPT Excellent Paper Award 2 Tianshui City Science and Technology Progress Awards. More than 160 papers published, 36 patents granted, 20 awards for various types of achievements, new products/technology, and outstanding paper awards.