The full-screen smart phone product development trend, COF board Yi Hua is expected this year, one after another harvest has been deeply ploughed. Yihua deputy general manager Huang Meixue said that the previous LCD driver IC COF (foil chip) package is mainly used in In the field of large-size TVs and so on, 99% of them are still in this area. Although the growth of the mobile phone market has slowed down, the effect of COF gradually replacing COG process will rise in an all-round way. E-Huadu has already been very confident to enter into the supply chain of first-line mobile phone brands in mainland China. , It is estimated that COF demand will start to increase in the second quarter. Yihua’s major shareholder is Changhua Group, which is 42%, and its packaging and testing plant, Nanmao, is about 19%. Yihua’s related industry estimates that full-screen smart phones will grow significantly, with small and medium size panels. The COF board shipments required by the driver ICs have gradually increased since the second quarter. Higher COF boards in 2019 are more likely to be in short supply. Huang Meixue explained that using the COF process does not depend on the OLED or the LCD, but the full-screen ratio. It seems that mobile phone makers may have more full-screen designs in the second half of the year, including a very narrow border panel with a 21:9 ratio, which will be more suitable for COF packaging. It was pointed out that 90% of the original COF package was used for driving. ICs are all in the TV field. The penetration rate of 4K UHD LCD TVs continues to increase, and the demand for COF for panel driver ICs grows. However, the increase in the number of GPUs was originally thought to have been offset by the reduction of Gate ICs by panel makers using GOA (Gate on Array) processes. The use of LCD driver ICs to increase the number of stars is not much imagined, but ECO's COF is mainly applied to Source ICs. The impact is not significant. The market estimates that large-sized TV panel driver ICs use COF shipment growth, which is about 3 to 5%. In fact, judging from its financial performance, Yihua’s 2017 consolidated revenue was approximately NT$1.323 billion, net profit after tax of RMB 4.41 million, and net profit per share after tax of RMB 0.04. Huang Meixue also admitted that the COF factory also Only a few companies insist that most of the losses or gains and losses are flat. However, as the full-screen smartphone brand will become a trend, there will be an entire year of COF replacement for mobile panel driver ICs in 2019, plus 8K TVs. Also gradually attracted market attention, becoming the next wave of growth momentum for COF packaging. Huang Meixue frankly, the driver IC package to decide whether or not to use the COF is suitable for the full screen, the full-screen trend started in the fourth quarter of last year, currently looks 18 : 9 scale panel is not necessary to use C The OF package, but if it comes to 21:9, the driver IC must use COF package is not. Familiar with the semiconductor supply system industry, said that the current Taiwan CoF factory including Shan State, Yihua, and the end of the state, South Maodu It is foreseen that COF packaging will gradually replace COG changes this year. Driver IC designers including Qijing and Lianyi have all invested in full-screen driver IC products, and supply key raw material components for COF plants. Related companies estimate that as COF market conditions become increasingly hot, There may be shortage of material. Changhua Group is expected to provide better support for E-Hua Power. According to E-Hua, the current monthly COF capacity for mobile phones is about 9 million, and it is expected to reach 10 million units in the second half of this year. In fact, Last year, the design progress of new mobile phones was chaotic. Until the first quarter of this year, operators were still adjusting their product strategies. It is estimated that new products will be launched in large quantities in the second half of the year. For EAC, the demand in 2019 will be for the entire year, and there will be an opportunity to look at 2,000. Million, because a cell phone uses a COF package, which company will be able to provide the finest Fine Pitch packaging process in the future. Familiar with packaging and testing industry, this year is 18 micron, 16 The COF of meters will be launched one after another. The Yihua SEMI semi-additive process has a very high fine-pitch yield, and it also has 2 Metal COF process technology available. In the future, the market will need to increase production capacity. The COF process will With thick copper, fine pitch development, the future includes large-size LCD, OLED TV, small and medium size full-screen panel driver IC packaging and testing, high-level LED substrates, etc.
