The ubiquitous computing, communication, trading, management, decision making... digital storage faces an era of explosion.
On SEMICON China 2018 forum held in March 16th at the "China Memory Industry Development Forum", the memory industry experts conducted in-depth analysis from different angles to share insights and seek common memory. From Spin Transfer Technologies, Pan-Lin Semiconductor, Tokyo Electronics, Changjiang Electronics Technology, Zhaoyi Innovation, senior experts and analysts from the industry and other industries of Chibang Technology have analyzed the market and technology trends from different perspectives. Memory packaging manufacturers from local memory manufacturers and local companies, Memory Application Design The plan manufacturers, related materials, equipment manufacturers' professionals, and leaders of the cities and development zones that are laying out the memory manufacturing industry in China and representatives of manufacturers gathered at the forum.
E. Jan Vardaman, President of TechSearch International, analyzed the future trends of memory packaging in the keynote speech of "Memory Packaging Trends: An Era of Change".
Mustafa Pinarbasi, CTO & Senior Vice President of Magnetic Storage at Spin Transfer Technologies, shared the theme of "Unleashing MRAM Potential" on the scene.
Harmeet Singh, Vice President Global of Universal Circuits, analyzed the topics of “The Challenges and Responses of Storage and Manufacturing Technology” to analyze in detail the various challenges in the manufacturing process of next-generation storage devices, including their complexity, process challenges and corresponding solutions. And shared the manufacturing requirements and roadmap for future generations of storage devices.
Tokyo Electron's Head of Semiconductor Technology, Prof. Tony Koo, addressed the 'Advanced Memory Manufacturing Equipment and Process Innovations', and detailed analysis of how to address the challenges of DRAM and 3D NAND manufacturing through technological innovations in equipment and processes.
Scott Sikorski, vice president of technology strategy and product technology at Changjiang Electronics Technology Group, conducted a detailed analysis of the "memory advanced packaging route and the response of OSAT."
Su Zhiqiang, strategic market director of Beijing Zhaoyi Innovation Technology Co., Ltd., shared the theme of “Special Memory Market: Building an Ecosystem and Promoting Rapid Growth” from the perspective of industrial ecosystems, pointing out that the development of special storage is a suitable basis for China’s current industry and market. The correct direction, the construction of a sound ecosystem is the right path for the rapid development of special storage.
Guo Bangrong, research vice president of Jibang Technology, brought '2018 Global Memory Industry's Future Development and Depth Analysis'. It is estimated that the memory industry will still be dominated by the three major memory factories in 2018. Although the price increase will not be easy to see, it will still maintain high prices. Water level, continues to be a good profit structure so far.