Shanghai – March 08, 2018 – Two industry experts Rick Hemond and Ding Shuji from Dow Electronics and Imaging Division will attend the Industry and Technology Investment Forum (TIIF) organized by this year's SEMI Industrial Innovation Investment Platform (SIIP China). The forum will be held during SEMICON China on March 15th, 2018 (Thursday).
Rick Hemond is chief marketing officer (CMO) of the electronics and imaging division of Dow's DuPont Specialty Products business unit. He will discuss the potential impact of artificial intelligence on future economic growth, emphasizing that electronic materials will play a role in future semiconductor manufacturing. Important role and success of artificial intelligence.
'The truly revolutionary new technology will create significant opportunities for growth,' Rick Hemond said. 'With a wide range of technologies, from machines and deep learning, big data and cloud computing and automation, artificial intelligence has to create intelligent machines And manufacturing, intelligent environments and products, the ability to increase productivity and efficiency to achieve higher growth and economic value. In software and hardware, including high-performance electronics and integrated equipment, it is essential to develop and implement artificial intelligence-based applications. Important. '
Ding Shuji is the global head of lithography and head of China business development in the electronics and imaging division of Dow's DuPont Specialty Products business unit. She will participate in SIIP's technical innovation and investment in the development of semiconductor equipment and materials in China. Panel discussion. Ding Shuji will share her views on opportunities for the development of China's semiconductor industry. In particular, she particularly stresses the importance of further investment by Chinese and global companies in China. Companies must demonstrate their capacity for large-scale manufacturing while investing in technology. Factory manufacturing capabilities and focus on quality design.
TIIF is a brand event of SIIP China and is held concurrently with the annual SEMICOM China. TIIF 2018 will focus on recent policy changes, review current industry status, analyze capital flows and predict future growth. This year's conference theme will focus on artificial intelligence and semiconductor equipment. Investment and M&A activities in the fields of materials and materials.
As an honorary sponsor of SIIP China, Dow DuPont congratulated SEMICOM China on its 30th anniversary. It has a rich history of technological development and promoted the development of the industry.