According to Korean media reports, In order to satisfy the PC, the smartphone market continues to have high demand for NAND flash memory, and Intel is negotiating with China's Violet Group to license its 64-layer 3D NAND flash memory.
This kind of flash memory technology comes from the Intel, Micron joint venture IMFlash. However, by the beginning of next year, the two parties will end cooperation and optimize their products and services independently. At the same time, Intel will sell almost all of its shares to Micron.
The flash memory currently used and supplied by Intel comes from IMFlash. If it is completely independent, it will inevitably greatly affect the production capacity and supply. As the current market demand for flash memory continues to be high, Intel urgently needs a new partner.
Violet is a key target for the development of the semiconductor industry in China. In the next five years, China will invest RMB 1 trillion in the semiconductor industry. The goal is to increase its own capacity to 70% by 2025. Ziguang naturally plays a key role. Character.
At present, Violet has invested US$30 billion to build its own memory and flash memory plant in Nanjing. It has also established a SSD development and manufacturing facility in Suzhou with Lite-On.
As a result, it is not surprising that Violet can win the favor of Intel.
It is unclear whether Intel, the specific content of the purple light authorization, is a pure manufacturing license, or a more advanced technology license.
If it is the latter, Violet can also use Intel flash memory for its own products, and it can be used as a supplement when independent flash memory is not yet fully mature. However, it is hoped that independent flash memory will not abandon itself. After all, this lesson is too much. .
In any case, this is an excellent opportunity for the development of purple light. It can be in close contact with the world's most advanced flash memory technology, and it is of great benefit to enhancing its technical strength.
Korean media also believes that this will be a severe challenge to Samsung, SK Hynix and Toshiba.
In addition, IMFlash is also developing a new generation of 96-layer stacked 3D flash memory, supplemented by a 10nm manufacturing process, which will double the capacity density compared to the current 64-layer, and it is also expected to settle in the future.
