Silicon said that the effectiveness of the merger and acquisition of Taiwan Satellite Branches has appeared, and the Taixing Branch has received strong orders from mainland China. The consolidated revenue in February was approximately 220 million yuan, up by 6.2% on a monthly basis, which is an increase of 19.5% year-on-year. Inch wafer-level packaging capacity, combined with TSMC and Xingke Jinpeng technology, is a first-class level, and the cooperative customers are also the first-tier international companies. They are very helpful in developing high-end packaging services for silicon grids. At present, the US-based customers are interested in bumps. Bumping order to seek Si grid Segment IC packaging and testing services.
Huangxing Yang, Chairman of Silicon Grid, pointed out that for many years, SiGe has taken a differentiated strategy to test mixed signal products such as RF, WiFi, Bluetooth chips and power management of Netcom and mobile phone applications. IC packaging and testing plant to rapidly expand its product line and customer base. It is expected that under the complementary synergic fermentation of mergers and acquisitions, it will become the largest RF component testing plant in Taiwan and successfully grab smart phones, wearable devices and artificial intelligence (AI) Networking opportunities pie.
Huang Xingyang said that in the future, new generation of wafer products will enter the nano-scale process, such as artificial intelligence, virtual reality, Internet of Things, unmanned vehicles and mobile devices, etc., will all use a new generation of nanotechnology, and silicon in the wafer In the field of testing, there has been a professional and leading position, but in order to be able to provide packaged and tested one-stop services, Cheng Yuan and Taixing Branches, which are very superior in terms of packaging technology, have been found, and the customer base of the three companies has only a few overlaps. Therefore, business complementarity is very strong and it has a deeper effect.