On the 26th of last month, Micron Technology announced three new 64-layer stacked second-generation TLC (triple-level cell) 3D NAND storage products. The company stated that its current flagship smartphone capacity is up to 256GB. Capacity will increase to 1TB by 2021.
Micron pointed out that this new product will enable smart phone manufacturers to enhance the user experience of next-generation mobile functions such as artificial intelligence (AI), virtual reality, and face recognition. According to Gartner's prediction, up to 80% of intelligence will be achieved by 2022. Mobile phones will have built-in AI functionality.
Cowen analyst Karl Ackerman pointed out that the average price of memory chips remained at a healthy level in February. German silicon wafer maker Siltronic AG also mentioned on the 5th that the market research institute IHS Markit expects the DRAM market situation to show an upward trend in 2018.
Micron is going to hold a law meeting in New York City on May 21, 2018.