Qualcomm high integration Xiaolong 5G solution | 2019 a sample

On February 27, 2018, Qualcomm introduced its Snapdragon 5G module solution at 2018MWC and claimed that the solution is highly integrated and optimized to reduce time-to-market while reducing costs and enabling new entrants to accelerate 5G In its system of application.

According to reports, Qualcomm's new 5G module solutions to support OEM manufacturers only by combining a few simple modules can be designed to avoid the use of more than a thousand components to create the complexity of its terminal.The module integrates digital, RF, connectivity and front-end functionality. Key components include application processors, baseband modems, memory, PMICs, RF front end (RFFE), antennas and passive components.

According to Qualcomm, the 5G module is expected to sample in 2019, reducing board space by as much as 30% compared to designing with separate discrete components.