NAND Flash As the yield of 2D-to-3D process is improved and mass production capacity is greatly improved, the suppliers including memory, control IC and IC packaging and testing systems have been optimistic about the improvement of production capacity despite the loose price. Hutchison Electronics optimistic about the 64-layer 3D NAND become the mainstream this year, then into the 96-layer stack, the group this year also continued to hold up research and development of energy, is expected to significantly recruit more than 200 R & D engineers. Including volatile memory component engineers, firmware algorithms engineers, software design engineers, digital IC design engineers, analog IC design engineers, system applications / FAE engineers, IC Layout engineers and business professionals, including Taiwan, Qing, pay, into Talents in tertiary institutions are encouraged to take advantage of their talents and hope that outstanding R & D talents will join the ranks of Rangsons Electronics, even if they are inexperienced and have masters degrees, with annual salary of NT $ 1 million. The memory industry said that in 2018 Year smart phone flagship such as AI, AR, biological recognition, 4K HDR video recording and other new applications, mobile phone memory capacity up to 128GB or even look at 256G B. As the leader of the Android camp, the eMMC / eMCP embedded storage capacity specification has been upgraded to 128GB. Samsung Electronics and Apple are equipped with 256GB of UFS embedded memory. High-capacity memory is the trend. 64-layer 3D NAND Become the mainstream, and further to 96. Due to the physical limitations of 2D NAND Flash mostly limited to 128GB capacity, with the improvement of 2D to 3D NAND process yield, the volume of 256GB or more flash memory capacity Will be out, the market estimates, the mobile phone brand owners will also be released in the subsequent release of a new machine with higher capacity memory.Hundreds associated with the electronics industry believes that the 64-layer 3D NAND Flash will be the most mainstream of this year's technology, In addition to the high-speed UFS control chip that supports this process technology, both the eMMC / eMCP full set of control chips simultaneously support the 64-layer 3D NAND Flash of the Toshiba camp and the Micron camp. On the other hand, the 96-layer 3D NAND Flash advanced process technology control chip also have the opportunity to launch the end of 2018, fully locked smart handheld devices, automotive electronics and other fields. Estimates PHISON 2017 dividend is expected to reach NT $ 16 yuan level, but said they would speak only system to expose the dividend policy before the end of March this year, the forecasting numbers do not comment publicly.
