Global semiconductor technology giant German Infineon Technologies AG and Shanghai Automotive Group Co., Ltd. announced on the 2nd to set up a joint venture to manufacture power modules for the Chinese electric vehicle market.
It is reported that the joint venture company named 'SAIC Infineon Automotive Power Semiconductor (Shanghai) Co., Ltd.', SAIC 51% stake, Infineon 49% stake in. The company is headquartered in Shanghai, the production base is located in Infineon Wuxi plant expansion Within the project, it is planned to start mass production in the second half of 2018. The joint venture between the two companies will provide a power solution for the Chinese electric vehicle market, mainly producing the automotive-grade frame IGBT module HybridPACKTM, which has been widely used in the world Plug-in hybrid and electric vehicles.
Chen Zhixin, president of SAIC Motor Co., said that electric vehicles not only provide customers with extremely convenient and superior driving experience, but also effectively ease the pressure on energy and the environment and look forward to Infineon's power module solutions SAIC in the field of electric vehicles with the perfect integration of expertise.
Hanibaker, a member of Infineon's management committee and the company's operations, said that working with SAIC will further strengthen and strengthen Infineon's market position and meet the rapidly growing market demand through capacity expansion.
According to the China Association of Automobile Manufacturers, the output of China's plug-in hybrid and pure electric vehicles was 794,000 units in 2017. According to the latest forecast by market research firm IHS Markit, by 2020, China's plug-in hybrid and pure electric vehicles Production will reach 2 million by 2024 to reach 4.3 million, accounting for about 45% of the global expected total demand.