By 2021, the scale of the semiconductor industry in Anhui will strive to reach 100 billion yuan

According to news from Hefei Economic and Commission Commission, in order to seize the significant opportunities in the development of the semiconductor industry, foster and develop emerging industries, promote the industrial transformation and upgrading and realize the sustainable economic and social development in the province, the "13th Five-Year" national strategy Sexual Emerging Industries Development Plan "and" National IC Industry Development Promotion Program "and other documents, Anhui Province formulated" Anhui Province Semiconductor Industry Development Plan (2018-2021). "

According to the plan, by 2021, the scale of the semiconductor industry in Anhui Province will strive to reach 100 billion yuan, and 300 enterprises in the semiconductor industry chain will reach the scale of 2 to 3, leading the design, manufacture, packaging and testing of chips, and leading enterprises in equipment and materials.

Chip design, focusing on the development of new display, automotive electronics, home appliances, mobile terminals, industrial control and other key applications of special chips and memory, microcontrollers, image processing, digital signal processing and other high-end chip research and development, support for design companies and automotive, home appliances And other application companies to develop cooperation and synergy. By 2021, the chip design industry reached 15 billion yuan.

Focusing on breakthrough chip manufacturing, strengthening the layout and construction of advanced production lines, the Company implemented a number of manufacturing projects such as 8-inch or 12-inch wafer panel drivers and memories, and developed analog and digital-analog hybrid circuits, micro-electromechanical systems (MEMS) , Radio frequency circuits, compound semiconductors and other special process lines. By 2021, built 3-5 8-inch or 12-inch wafer production lines, chip manufacturing industry scale of more than 500 billion yuan, the level of technology to achieve domestic advanced.

Packaging and testing, a substantial increase in packaging and testing to meet the design and manufacturing process node evolution needs to support the bumping (FlipChip), wafer-level package (WL-CSP), through-silicon vias (TSV) and other advanced Packaging and testing technology development and industrialization. By 2021, packaging and testing industry scale of more than 300 billion yuan.

Equipment and materials to support the development and industrialization of silicon single crystal furnaces, packaging and testing equipment, accelerate the development of related materials and ancillary products such as wafers, photoresists, sputtering targets and lead frames, and build a domestic chip material industrial base By 2021, the scale of the equipment and materials industry will exceed 5 billion yuan.

Our province will adhere to the principle of taking advantage of advantages, making overall plans, focusing on key points and agglomerating and developing the semiconductor industry development arc with Hefei as its core and Bengbu, Chuzhou, Wuhu, Tongling and Chizhou cities as the mainstay, and building a nuclear arc 'The semiconductor industry spatial distribution pattern.

Hefei should give full play to its existing industrial base advantages and take major projects as its lead. It should actively promote the localization of panel driver chips, home appliance core chips and automotive electronic chip modules, and create a full industrial chain of IC design, manufacturing, package testing, equipment and materials, Perfect industrial facilities, radiation led the province's semiconductor industry.

Bengbu City to grasp the general trend of military and civilian integration, expand the MEMS (Micro Electro Mechanical Systems) and other products R & D and manufacturing space, promote the industrial, automotive electronics, communications electronics, consumer electronics and other fields.

Chuzhou City, relying on location advantages, focusing on the development of semiconductor packaging and testing industry and semiconductor materials industry.

Wuhu City, to compound semiconductor as a breakthrough, and actively promote the automotive, home appliances and other fields.

Tongling City, to take advantage of the lead frame, packaging and testing equipment R & D and manufacturing base to explore the development of high-purity metal targets, bonding wire (copper wire-based), and actively create semiconductor equipment R & D center and the national semiconductor equipment R & D and production base.

Chizhou City, to continue to promote the manufacture of discrete semiconductor devices, such as package testing, to achieve a breakthrough in output value, the formation of industrial scale.

Other cities in the province should integrate the industrial base, support the development of ancillary industries, expand their application fields and gradually integrate into the "one nuclear, one arc" semiconductor industry chain.

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