1. Samsung is promoting: Murata MLCC part capacity reduced by 50%, or up to 300%;
MLCC out-of-stock has been more than 15 months, the price increases in both the original and spot markets have been one after another since early 2009. Today, MLCC maker Murata issued a heavy notification, Murata MLCC part of the product Cut production to 50% in 2017 and price increases, product order prices now (March 2) into effect.
Insiders said in an interview with micro-grid that the customer has received the Murata cut this price increase notice is expected to 2018 MLCC market will lead to price increases in stock prices continued to rise, the current spot market, some models MLCC has started to raise prices again.
Some Murata MLCC products cut 50% and prices
On March 2, Murata issued a notice on the miniaturization, multi-party certification and order transfer of Murata MLCC, signed by President Maruyama Yoichi. The circular states that with the rapid growth of demand for high-performance laminated ceramic capacitors in the communications, automotive and other markets in recent years, MLCC manufacturers including Murata are unable to meet the overall demand.
In addition, because other MLCC manufacturers continue to raise prices, Murata's production capacity adjustment is struggling due to the continuous concentration of orders of 'old product groups' such as '0603/0805 size high dielectric constant type and electrostatic capacity 1uF or less'.
Now, Murata aims to reduce its 'old product group' orders through a plan to miniaturize, multiple supplier certification and move orders to other MLCC vendors in Taiwan, etc. In this context, given the future delivery of customer presence Risk, customers should stop the certification and import of Murata's 'old product group'.
In order to strengthen the control over the over-concentration of orders for 'old product groups', Murata will implement the initial price adjustment for the following products starting today (March 2): Murata MLCC 0603/0805 Size High Dielectric Constant Capacitance less than 1uF.
Murata MLCC products cut some of the real reason is that?
According to Murata's cut-price notification, it can be seen that the cut product refers to the "old product group" such as the '0603/0805 size high dielectric constant type and the electrostatic capacity of 1uF or less', and such low capacity MLCC prices Cheap, but in great demand, mainly used in power management and monitoring products, more importantly, these MLCC in the spot market is basically Samsung low-cost monopoly.
So in Murata's notice why such orders originally occupied by Samsung are constantly concentrated in Murata Industry insiders said in a micro-interview that the low-cost low-cost MLCC low profit margins, the market supply to Samsung, Samsung The low-capacity MLCC, which had previously dominated the spot market at lower prices, had slashed supply again in the past year as Samsung slashed prices by as much as 10 times, and customers gave orders to Murata.
However, as a leader in the MLCC industry, Murata's MLCC products do not profit from these low-margin products. In particular, last year, Apple released the iPhone8 series and iPhone X with wireless charging, while the wireless charging applications required high-capacity NPO MLCC was exclusively supplied by Murata and was highly profitable and in short supply. In addition, Murata originally planned to abandon the low-capacity MLCC market and shift to high-end markets such as industrial and automotive electronics.
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Previously set micro-network has pointed out that in 2016, Samsung would like to occupy the MLCC spot market, long-term low-cost shipments, combined with the presence of Samsung Electronics technology and cost advantages of such products, playing other original factory no fight back, so quickly occupied The vast majority of the spot market share.To 2017, Samsung to improve the quality of capacitor products, reduce production capacity, while substantially raising the MLCC spot market prices.
Earlier this year, Samsung Motor said that its 0603, 0805, 1206 size ordinary products limited production, and again price increases, the original capacitance of a few cents has risen to a few dollars chip price, which allows downstream end customers Complain bitterly
So in this year's mobile phone terminal a new round of pulling goods, customers began to transfer a single Murata, Murata has passed several supplier certification and the transfer of orders to Taiwan and other MLCC manufacturers for the program, in order to achieve 'old product group' orders The reduction, at the same time it will also benefit the country giant, Huaxin Branch, Fenghua Hi-Tech, Yu Yang Technology MLCC original.
Murata MLCC increase in some products how much?
In fact, for this Murata MLCC miniaturization, multi-certification, order transfer notice, in addition to some of the MLCC cut, Murata MLCC 0603/0805 size high dielectric constant type capacitance of 1uF the following product prices is the focus, However, Murata did not announce the price range in the notice.
So Murata MLCC designated material prices will be much? A dealer close to Murata Business Insiders told reporters that micro-MLCC Murata to 30% -300% of the price increases, people Unexpectedly, this may be some exaggeration, but the purpose of Murata should be basically achieved.
The insider further disclosed that, in fact, as early as last week Murata released the wind up the cut-off price increases, Murata agents and spot market sellers seldom ship this week, we are waiting for today's notice of Murata.
Another Huaqiang North MLCC seller told reporters that this week to hear Murata MLCC wind up the price, the spot market part of the MLCC has begun another price hikes, prices of products focused on specifications such as 104 and 105, which is currently Market the most lacking, the largest amount of specifications, prices will continue.
Overall, MLCC out of stock for a long time, this wave of MLCC out of stock prices rose for at least 15 months.MLCC original plant also opened in the last year expansion plans, but due to the process of stacking, sintering is expanded Bottleneck section, the relevant machine equipment delivery time of more than 10 months, the new capacity to release until the fourth quarter of 2018. But far can not solve the recent thirst, under the capacity shortages, the original MLCC prices have risen again, now With the MLCC Murata part of the cut production price increases, the entire MLCC market conditions in the next period of time will be pulled again. (Proofreading / Fan Rong) 2.AMD: Miners' Mover May Affect GPU Business
According to AMD, the US semiconductor company, in its latest 10-k annual report, the decline in demand for GPUs by global digital money miners could 'seriously' affect AMD's chip business.
AMD said the rise in digital currency prices and volumes will push GPU demand up in 2017, but there are several factors that can change the GPU environment, especially market and regulatory risks that could cause miners to buy more GPUs. 3. Infineon, SAIC set up a joint venture to produce electric vehicle power module;
Bloomberg reported that in response to the rapid growth in demand for electric vehicles in the Chinese market, German chipmaker Infineon announced that it will work with Shanghai Automotive Group (SAIC), the No. 1 automaker in China, to set up a joint venture, Generating power modules for Chinese electric vehicles and plug-in hybrid car makers, jointly investing at least 100 million euros (122 million U.S. dollars) and hiring 250 people to expand Infineon's wafer fab in Wuxi.
Jochen Hanabeck, director of operations at Infineon, said in an interview: "The electric car market is about to take off. China has become a pioneer in the electric car market, and SAIC can help us become a leader in the industry."
Last year, SAIC said it will jointly invest more than 10 billion yuan (1.6 billion U.S. dollars) with China's battery maker Ningde. SAIC is also a partner of Flowserve and General Motors in the Chinese market.
Hanabeck said that the formation of a joint venture will allow Infineon to save some money on import duties and take advantage of SAIC's background of state-owned enterprises in local procurement, both of which will share the profits of module sales.
4. Shanghai issued the first batch of driverless licenses in China! Wei to / SAIC starting;
On March 1, the Shanghai Municipal Government Information Office developed and published the Measures for the Administration of Test and Management of Shanghai Intelligent Link Automobile Roads (for Trial Implementation), and issued the first batch of license plates for automobile open roads in China. Wei Lai and SAIC took the lead in the road.
According to the Measures, according to the third-party institution test and expert group appraisal, Shanghai Intelligent Network Lian Automobile Road Test Promotion Working Group reviewed and approved that Shanghai Automotive Group Co., Ltd. and Shanghai Wei-Lai Automotive Co., Ltd. won the first batch of intelligent network connection Car open road test number plate, access to intelligent network Lian car test road qualifications.
From the number plates exposed by the media, these special plates have a 'test' after the license plate number, and the top of the plate is marked with the 'road test on the smart grid or connected car'.
According to the actual situation of road traffic in Shanghai and the assessment of relevant roads by third-party agencies, a 5.6-kilometer road with high safety level and low risk level was delineated in Jiading District as the first phase of the trial of intelligent network-linked vehicles.
The specific sections are: Boyuan Road (Moyu South Road to Anyan Road intersection), a length of 2.7 km; Broadway Road (An Hong Road to Anzhi Road intersection), a length of 0.9 km; North Ande Road Chi Road intersection), length of 2.0 km.
The next step will be gradual opening up of more road environment for intelligent network car test.
The Measures also clarify the application conditions for road testing of driverless vehicles, clearly define the test subjects, test drivers and test vehicles, and set forth specific requirements such as:
- The test subject should establish a test vehicle remote monitoring data platform, while access to third-party data platform as required;
- To apply for a test vehicle to buy a car accident liability insurance of not less than 5 million yuan per vehicle or issue a compensation guarantee letter of the same amount;
- The test driver should have more than 50 hours of operating experience in the autopilot system, of which more than 40 hours of driving experience should be applied for the test items;
- The test vehicle shall carry out the actual vehicle test of the corresponding test item in the closed test area designated by the third party according to the test and evaluation rules, meet the corresponding requirements within the prescribed effective test times, and so on.
In addition to the road test to promote the management agencies, road test review process, identify and deal with traffic accidents, traffic accidents identified and deal with the "measures" are also made clear one by one.
(NYSE: CEVA), a global leader in signal processing IP for smart and connected devices, announced that Ceragon Networks Ltd. (NASDAQ: CRNT) Has licensed the CEVA-X2 and CEVA-XC4500 DSPs to be deployed in the new software-defined wireless modem to address the mature phase of the launch of the 5G service network.
Yuval Reina, Executive Vice President of Global Products and Services at Ceragon Networks, said: "CEVA DSPs dominate our strategic roadmap by delivering eight-core modems in a single chip and being vertically integrated into our next generation wireless backhaul solution, Enabling us to quadruple our unique multi-core technology performance.As the 5G path of development, increasingly complex mobile and other networks require higher capacity, making wireless backhauling critical to meeting the business and network deployment goals Increasingly important.
'With the continued surge in capacity requirements and increasing network complexity, Celaon's unique octal modems are used in vertically integrated full 5G wireless backhaul solutions to dramatically increase capacity and achieve efficient spectrum utilization, requiring only the smallest footprint Area and lower energy consumption will provide Ceragon customers a tremendous additional advantage over our current state-of-the-art solutions. As a key component of the current IP-20 platform, Ceragon's multi-core technology addresses wireless connectivity with wireless backhaul The key challenges associated with delivering a highly innovative, rapid deployment and scalability to mobile operators as they move from 4G to 5G, can expand and de-agglomerate networks to increase network capacity over time. "
Michael Boukaya, Vice President and General Manager of Wireless Business Unit at CEVA, said: "Ceragon is a global leader in wireless backhaul and we are pleased to deliver the key 5G DSP technology for its next generation multi-core platform." While developing DSPs to handle the most advanced wireless We have a unique expertise in the technology; Ceragon's decision to work with us to develop the next generation of platforms further confirms this. "
CEVA's Industry-Leading DSP Cores Boost Many of the World's Leading Wireless Semiconductor and OEM Manufacturers to Deliver Unparalleled Power, Performance, and Cost-Effectiveness for Cellular IoT, Terminal and Infrastructure Solutions Ultra-Low-latency Physical Layer Control is 5G The CEVA-X2 DSP is ideal for use cases. The CEVA-XC4500 DSP supports a wide range of wireless technologies for cellular baseband, wireless infrastructure, wireless backhaul, connectivity, V2X, unmanned aerial vehicle communications, satellite and smart Power grids and other applications designed specifically for the development of high performance baseband solutions that meet their stringent power consumption, time to market, and cost constraints For more information, visit the company website at https://www.ceva- dsp.com/app/wireless-communication/.
6.CEVA-TeakLite-4 ultra-low-power DSP running Maxim dynamic speaker management technology;
(NYSE: CEVA), a global leader in signal processing IP for smart and connected devices, announced today that Maxim Integrated Products, Inc. (NASDAQ: NASDAQ: CEVA) : Dynamic Speaker Management (DSM ™) software from MXIM, available in the CEVA-TeakLite-4 family of ultra-low power audio / voice DSPs. The DSM optimization software implementation running on CEVA-TeakLite-4 Has been integrated into smart phone SoCs in leading smartphone OEMs.
Many devices, including smartphones, earphones and wearable devices, present significant challenges in speaker design.The miniature speakers in these devices are becoming smaller and smaller and meet the power constraints, severely limiting the use of traditional D Class Amps. DSM ™, which runs on the CEVA-TeakLite-4, overcomes these challenges with Maxim's enhanced IV sense class D speaker amplifier, providing a richer sound experience than traditional class-D amplifiers, 2.5 times louder sound and two octaves bass.
Jonathan Chien, Managing Director and General Manager of Audio Solutions at Maxim, said: "Maxim continues to break the boundaries of the miniature speaker quality to create a louder and richer listening experience for customers. The DSM running on the CEVA-TeakLite-4 DSP can be used with any speaker Limited and power-sensitive mobile devices provide excellent solutions that have been used and proven by leading smartphone OEMs. "
Moshe Sheier, director of strategic marketing at CEVA, said: 'While smartphones, wearable devices and other products have very small form factor and power budget constraints, consumers are still increasingly expecting mobile devices to have powerful sound capabilities. "Maxim's DSM technology Combined with our ultra-low-power CEVA-TeakLite-4 audio / voice DSP, it delivers rich, loud sound even on the smallest microspeaker without compromising device reliability and power efficiency. "