Intel and Micron discontinue cooperation after 3D NAND 96 layers, will find their own partners

Set micro-network news, Intel and Micron jointly announced on January 8, 2018, after the completion of the third generation 3D NAND Flash R & D, the two sides will open their own R & D, the two sides jointly developed the second generation of products for the 64th floor 3D NAND Flash is expected to be the third generation of the stack can be 96 layers, also means that after the 96-layer 3D NAND Flash product development, Intel will officially parted ways with Micron .Although this resolution will not follow-up on both the process, product planning But decided to split the two sides will have greater flexibility to seek new partners.According to the survey of semiconductor research center (DRAMeXchange), Intel and Ziguang Group are actively developing follow-up cooperation plan, both parties are expected Establish formal sales and cooperation.

Intel and purple to develop sales contracts, Ziguang storage sales channels to cultivate competitiveness

From the recent Intel's move, DRAMeXchange analysis, Intel has been highly concerned about the Chinese market, in the CPU, modem, memory and other areas are actively seeking different opportunities for cooperation or joint venture.In addition to actively seeking partners, Intel also continued to expand in China Capacity, NAND flash independent production capacity including 3D NAND that includes in China's Dalian area will continue to expand.Recently Intel and China Ziguang Storage (a subsidiary of Ziguang Group) are actively developing long-term contracts in the future under this contractual structure, Will be able to get a certain percentage of NAND wafer from Intel, after testing into different products by their own packaging, the sales channels owned by the violet store.

In order to observe the layout of the flash memory of Tsinghua Unisplendour Group, Tsinghua Unisplendics Group Co., Ltd. is mainly responsible for the development, design and production of flash memory, and is responsible for the sales of flash memory, but due to the 32-layer NAND flash products still being designed by Changjiang Storage, Until they formally develop products with 64 or more tiers, Violet Storage will be able to obtain flash-based wafer finished products from Intel every month through contractual agreements in order to maintain the competitiveness of its channel sales, and then packaged into packages containing UFS, eMMC, and SSD product.

In this way, Tsinghua Unisplendour Group can enhance its brand visibility in addition to maintaining its channel competitiveness. In addition, despite the inability to cut into high-end smartphones or take advantage of the client SSD in the beginning, the above strategy will Looking to lower the price of applications containing Chromebooks or other consumer electronics products, the subsequent changes in the overall price of NAND Flash variables.