NXP Semiconductors NV (NASDAQ: NXPI), Nuremberg, Germany (Embedded Systems Exhibition 2018) - February 27, 2018 today announced the release of a new 'IoT chipset' that greatly advances edge computing , This scalable family of products integrates NXP's ARM®-based i.MX Applications Processors, Wi-Fi and Bluetooth into a smaller form factor, giving IoT devices rich functionality and security And connectivity. The new chip helps address the design challenges of implementing applications in extremely constrained IoT devices. As a system-level miniaturization solution, 'IoT chips' provide the performance, scalability and Small size allows developers to quickly put the design into production.
Martyn Humphries, vice president of i.MX Applications Processors at NXP's Industrial and Consumer Market, said: "As a key step toward the vision of the future 'IoT chip' from on-board products, our highly integrated solutions completely unveil the Internet of Things The forward-looking design approach from NXP will provide customers with greater cross-system efficiency, enabling them to accelerate time-to-market without incurring additional costs. "
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'IoT chipsets' NXP's i.MX family of application processors and Wi-Fi / Bluetooth solutions provide developers with a proven solution for industrial and consumer markets, enabling the rapid development of compact IoT products.
Key Features of the Product: • High-Performance Computing and Connectivity - Arm Cortex-A7 Applications Processors Deliver High Performance and Efficacy - High-Bandwidth Dual-Band 802.11ac Wi-Fi and Bluetooth 4.2- Similar solutions to Wi-Fi certified modules using Proven Wi-Fi / BT software stack • Security - The i.MX Applications Processor provides advanced security features such as secure boot, tamper detection and response, and high-throughput encryption - to provide additional physical security, 'IoT chips' can be extended with a custom inter-chip interface to integrate Security Elements without increasing the size of the chip package • Tightly integrated, small form factor - Built-in applications Processor and Wi-Fi / BT solution is only 14mm x 14mm x 2.7mm - a new package design allows hardware designers to stack DDR memories through straight-through boards, simplifying PCB design and saving additional space • Available Expansion and Modularity - Through an inter-chip interface, users can get in the same 14x14 package, depending on the specific needs I.MX level of performance - size compatible module also provides a range of different Wi-Fi / BT options to meet application needs
Availability NXP's i.MX 6ULL application processor based on the 'Internet of Things chip' products will be available in the second half of 2018. i.MX 7 and i.MX 8 processor configuration will be available in 2019. "