Last year, the world advanced one after another received orders from foreign IDM plant, especially for automotive electronics bulk, this year in power management IC, fingerprint identification IC will appear double-digit growth, in which the power management IC benefit from the foreign production outsourcing trend , Last year has made customer orders, mass production in succession this year, accounting for a large number of production capacity, which squeeze out a lot of IC design small factory orders, you need to increase the price have the opportunity to row capacity.
The world's advanced chairman and chief strategist has said that benefiting from power management, imaging sensors, fingerprint recognition chips and driver ICs, strong demand for 8-inch wafer foundry will make the world's advanced production capacity "very tight" this year. The company is seeking to build a new 12- This breakthrough capacity bottleneck.
As the 8-inch production capacity is tight and the utilization rate is full, the world's advanced cost of responding to 8-inch silicon wafers increases. Gradually adjust the quotation of the foundry, which is estimated by the corporation to increase by 1% to 2% quarter-to-quarter. , Estimated full-year gains of 4% to 8%.
The reason is that in the past most fabs gradually shift their production capacity from 8 inches to 12 inches, the global 8-inch production capacity gradually reduced, and the current investment in 8-inch wafer equipment is expensive, not cost-effective in recent years, 8-inch wafers Foundry capacity has been reduced.
In addition, fingerprinting is gradually gaining popularity in smartphones and the demand for such products has risen sharply. Fingerprinting, on the other hand, eats up to 8 inches of production capacity. The other is that the demand for crying MOSFETs went up last year. The two major applications accounted for more capacity for 8-inch wafers.