Sights on China's semiconductor packaging materials to enhance demand | Japan's Panasonic decided to mass production in China

According to "Nihon Keizai Shimbun" reported that Japanese technology and materials maker Panasonic recently announced that because of the growing popularity of high-performance smart phones in China, the demand for high-density packaging semiconductor packaging materials is increasing since March in Shanghai, China plant to prevent production of semiconductors Substrate fouling, etc. Panasonic will manufacture high-quality packaging materials in China to shorten lead times and meet market demand.

According to the report, Matsushita will mass produce semi-conductor encapsulation materials for the MUF process at the Shanghai plant. The molding underfill process involves injecting a liquid encapsulating material into a mold and then solidifying it, And the substrate package. Packaging materials are used to protect the substrate and the chip current connection site.

Molded underfills can be packaged in less time than ever before, while reducing the distortion caused by the heating of different materials during packaging and making the semiconductor more stable. Currently, Matsushita's packaging materials will be sold to semiconductor manufacturers and foundries.

Matsushita decided to produce the packaging material at a factory in Yokkaichi, Mie Prefecture, Japan, before producing and supplying semiconductor encapsulants for molding underfill processes in Shanghai, China, which decided to shorten the production volume in China due to the rapid increase in demand for semiconductor packaging materials in China Delivery time to meet market demand.