ChinaCar will plan to establish a semiconductor R & D center in the UK

At a Glance: Dynex, a parent company based in China, is planning a semiconductor R & D center in the UK that will employ as many as 200 engineers over the next three years and will supply two British subsidiary of Zhuzhou Zhonglun Automobile (CRRC) Dynex and Soil Machine Dynamics provide additional research capabilities.

CRRC Times Electric, a developer of control systems for railways and electric vehicles in China, said it plans to set up the Times Electric Innovation Center (TEIC) in Birmingham, England, in the first half of 2018. It will focus on the research of cutting-edge high-power semiconductor product technologies And development.The company said the research center's results will apply to key growth markets, including electric vehicles, rail traction, aerospace, power distribution and renewable energy.

The establishment of TEIC is part of Zhuzhou CSR Times Dynex's acquisition of Dynex in the United Kingdom as part of its strategy of global semiconductor technology in China. "Dynex and Soil Machine Dynamics will receive free access to new semiconductor-related products developed by TEIC in the future.

According to the statistics, CSR (now China Automotive) acquired Danix Semiconductor in October 2008 and obtained strategic resources to complement the existing CSR power semiconductor industry in China. In pursuit of greater development, CSR established The world's first power semiconductor devices in the strategic goal of the successful completion of the Danisco Company in late 2009 refinancing to further increase investment in the power semiconductor industry, efforts to enhance the production capacity of six-inch IGBT chip; at the same time the world's level of power Semiconductor R & D Center, continue to develop the world's leading IGBT devices.

In the past, China's locomotive and vehicle IGBT modules must be imported from Germany and Japan, especially in the high-grade IGBT devices, there is no Chinese place.In 2008, with the speeding up of high-speed rail, demand doubled, an eight-column EMU will need 152 chips, the cost of up to 2 million yuan each year China needs 100,000 chips, the total amount of up to 1.2 billion.

After several years of research and development investment, at present, China has full control of IGBT chip technology research and development, module packaging and testing and system applications.The technology can be comparable with the world's top companies, but the price is far below the competition.

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