Since the advent of the AMD Zen architecture, it has covered different market segments, including consumer desktops / laptops, business-class desktops / notebooks, and server data centers, and has entered the new APU, with the next battlefield to be embedded.
Taiwan's industrial embedded manufacturer IB Technology (iBase) today exposed a new motherboard 'MBN806', the processor labeled 'AMD EPYC Embedded 3000 Series Exactly yes A BGA integrated package on the motherboard SoC system-on-chip, model EPYC 3201, 8 core 8 threads.
Have heard of a before EPYC 3251, But the specification is unknown, the estimated number of cores more.
And this embedded EPYC 3000 series actually we already heard, in the first half of 2016 was exposed, was also classified as Opteron Opteron sequence.
The series Code-named Snowy Owl, is designed for high-end embedded markets such as communications and networking. The architecture is also based on 14nm Zen and is a modular design that is divided into SCM BGA, MCM BGA and up to 16 cores 32 threads (32MB L3 cache), another 12 core, 8 core, 4 core version, thermal design power 35-100W.
In contrast, ThreadRipper up to 16 core 32 threads, but the thermal design power consumption reached 180W, of course, the frequency of the EPYC 3000 series will certainly be much lower.
EPYC 3000 series there Four-channel DDR4 memory (RDIMM / UDIMM / LRDIMM / NVDIMM / Flash / 3DS), Up to 64 PCI-E 3.0 buses, up to 16 SATA or NVMe devices, up to eight 10GbE 10 Gigabit Ethernet and consolidation of independent security subsystems, Server Controller Hub.
Unlike the top-of-the-line Naples EPYC 7000 Series for data centers, the EPYC 3000 Series is a BGA integrated package that plugs directly into the motherboard.
A big advantage of embedded platform is stable and lasting, AMD will provide the EPYC 3000 Series with up to 10 years of technical support.
Its rival is obviously the Intel Xeon D series , Which is currently the most high-end Xeon D-1587 specifications for 16 core 32 threads, 24MB L3 cache, the highest frequency of 2.1GHz, 32 PCI-E 3.0, thermal design power 20-65W.
