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1.iPhone baseband transfer to Intel fear caused by the supply chain shuffling;
Set a micro-channel news, KGI Gu Guoming analyst recently released the new machine this year, iPhone related parts report, for the iPhone key components baseband chip part, he pointed out that Apple's iPhone product line this year may be fully switched to Intel's baseband chip , Changed the past Qualcomm Qicheng, Intel 30% distribution.
Kuo Ming-yao analysis, Intel may become the sole supplier of new iPhone baseband chip this year, including Intel baseband chip transmission efficiency to meet Apple's technical requirements, Intel baseband chip can support CDMA2000 and dual card dual standby function, Intel offer more competitive, And Apple and Qualcomm are patent prosecution litigation, hoping to put pressure on Qualcomm.
Industry analysis, the original supply of Qualcomm baseband chip by the TSMC foundry, Intel replaced Qualcomm, the chip is bound to move back to Intel's own fab production.
It is reported that in the past, Intel and Qualcomm shipped to Apple's mobile baseband chip by 28nm process TSMC surgeon, but Intel has long been planning to get its own wafer fab production, it now appears will be made in the second half.
RF components such as power amplifiers (PA) used by Qualcomm's baseband chip platforms are mostly based on products from Avago and may be diverted from Avago to Qorvo after Intel is released.
Beijing Yuan electricity from Apple introduced iPhone 7, is the main back-end Intel baseband chip testing plant, if all the iPhone take orders from Intel, KYO orders will also surge, as Intel and Qualcomm Apple orders for the benefit of vendors .
Reuters sources said Broadcom is now ready to raise the purchase price of Qualcomm, including debt, the second round of the offer as high as 145 billion US dollars.The move is considered Broadcom attempted for the March 6 Qualcomm shareholders' meeting on the board of directors Election Vote to Win Support.
Apple came out this year, the new iPhone may be completely abandoned Qualcomm platform, Broadcom at this time "modest" to increase the purchase price, Apple and Broadcom stand in the same front, intended to exert pressure on Qualcomm's board of directors and shareholders, shareholders would like to contribute to the meeting agreed to a public offer case.
Therefore, set micro-analysis, apple abandon Qualcomm does not rule out Apple's competitive pressure on Qualcomm's competition, the future is really implemented is not yet known.
2. Apple will pass the old Qualcomm chip will be abandoned Qualcomm shares fell;
SAN FRANCISCO, Beijing, Feb. 6 (Bloomberg) - Qualcomm shares fell 3% this Monday after news that Apple will use Intel as the next-generation modem chip supplier for its iPhone instead of using Qualcomm Inc.
Qualcomm has been Apple's chip supplier for years, but relations between Qualcomm and Apple have deteriorated since Apple sued Qualcomm for pricing too high on its chips last year and declined to pay about a billion dollars in refunds.
In a note about chip suppliers, the well-known Japanese brokerage Nomura Instinet said Apple will abandon Qualcomm in favor of other chip suppliers to reduce the material costs of the iPhone, and Nomura believes Apple will source from Intel Corp. All of the required modem chips, currently half of the chip is provided by Qualcomm.
Shares of Intel recently jumped 1.4% to $ 46.81 a share, the world's largest maker of PC chips, a latecomer to the mobile device chip market, but the company is now fully seizing the mobile chip market.
Angelo Zino, an analyst at investment research firm CFRA Research, said: "There are predictions that Apple will completely abandon Qualcomm chips in the next iPhone, which I think is one of the reasons for the decline in Qualcomm's stock price."
Qualcomm last week released a profit forecast, the report has assumed that Apple will abandon Qualcomm chips in future products.
Romit Shah, an analyst at Nomura, said Apple would save more than $ 100 million by switching to Intel chips in the next-generation iPhone.
iPhone 7 is the first product released by Apple after Intel began shipping its modem chip to Apple.
Reuters reported last October that Apple had designed iPhones and iPads without Qualcomm chips, and analysts from KGI have said that Intel's modem chips are cheaper than Qualcomm and also reach Apple's standard.
However, some industry analysts have said that Intel may 5G network technology as Qualcomm, equipped with Qualcomm's iPhone's performance is superior to the use of Intel's chip iPhone.
Apple and Intel declined to comment. Qualcomm did not immediately respond. (Andy)
3. Global wafer CEO: This year silicon wafer prices will rise another 20%;
Set micro-mesh news, more and more news from the upstream industry shows that in 2018 hardware prices will remain the same or even slightly higher in 2017, especially the semiconductor industry, semiconductor products led by SSD and CPU in recent years There is no indication of price cuts as the price of silicon chips soared from the second half of 2016 to the present, and silicon wafer makers including Shin-Etsu Chemical Co. and Sumco now have raised the prices of silicon chips already.
The main reason for the price rise of silicon wafers is the rise of downstream industries such as AI chips, 5G chips, automotive electronics and the Internet of Things - partly due to the DIY market, such as the expansion of 3D NAND chips. Doris Hsu, CEO of the three major silicon foundries, recently said that silicon wafer prices will rise another 20% this year. The demand for large-size silicon wafers is very large. The supply and demand gap of 12-inch silicon wafers Most of the time (the same goes for other silicon foundries), orders for global wafers are already filling full capacity by 2018 and wafers are being produced around the world at 16 plants. Hsu believes that by eliminating manufacturing bottlenecks, by May this year July, 8-inch and 12-inch wafer production capacity will increase by about 7%.
Last year, the FerroTec semiconductor silicon chip project in Hangzhou was actually the product of the cooperation between Global wafer and FerroTec. Through the cooperation with FerroTec, the global wafer sales will increase by 20%. By the end of 2019, the monthly production capacity of 8-inch wafer can be expanded 300,000, in order to ease the pressure of demand.
4. Fight FD-SOI from the East ready to make big business opportunities IoT;
To address 2018 and the most anticipated semiconductor process technologies for the next five years, in addition to the upcoming production of 7-nm FinFET tip processes and 5nm process nodes expected to fully incorporate extreme ultraviolet (EUV) lithography Home-based foundries are also a focus of attention in the industry as they focus on a wide range of mid- to low-tier process technology options for low-power, low-cost component needs in the widely used, all-encompassing Internet of Things (IoT) market.
To address 2018 and the most anticipated semiconductor process technologies for the next five years, in addition to the upcoming production of 7-nm FinFET tip processes and 5nm process nodes expected to fully incorporate extreme ultraviolet (EUV) lithography Home-based foundries are also a focus of attention in the industry as they focus on a wide range of mid- to low-tier process technology options for low-power, low-cost component needs in the widely used, all-encompassing Internet of Things (IoT) market.
Such as 16- and 12-nanometer FFC (FinFET Compact Technology) for wafer foundry TSMC, 22nm ULP, 28nm HPC / HPC +, and 40nm ULP, 55nm ULP and low-power (LP) logic processes, as well as Intel's 22-nanometer low-power FinFET (22FFL) process and GlobalFoundries's 28-nm HPP (Super Low Power) 22FDX process, and Samsung's 28nm FDSOI, LPP, LPH ... and more are solutions that address the needs of a wide range of IoT applications.
One of the biggest differences between GlobalFoundries' FDX series process and Samsung's FD-SOI process, among other competing solutions, is the use of Fully Depleted Silicon, which is very hard to read both in English and Chinese. Silicon On Insulator, FD-SOI) technology pioneered by the SOI Industry Consortium, STMicroelectronics (ST) and its research and development partners IBM, GlobalFoundries, and Samsung in 2011, The 28nm and 20 (22nm) nano-nodes are capable of delivering comparable performance to next-generation FinFET processes supported by Intel, TSMC, and others at lower cost and less risk.
FD-SOI technology advantages?
Unlike 3D transistor structures used in FinFET processes, FD-SOIs are planar processes. According to ST's official technical data, FD-SOI has two major innovations: First, the use of buried oxide (BOX) thin Insulating layer placed on the silicon substrate; then the thin silicon film is deployed in the transistor channel, because of its ultra-thin thickness, the channel does not need to dope (dope), so that the transistor can be completely depleted.The above two innovative technologies The combined name is "ultra-thin body and buried oxide FD-SOI (UTBB-FD-SOI)."
ST says that FD-SOI provides better transistor electrostatic performance than traditional bulk silicon technology, while buried oxide reduces the parasitic capacitance between the source and the drain; in addition This technique effectively limits the flow of electrons between the source and drain and drastically reduces the leakage current that affects the performance of the device (Figure 1). In addition to the gate pass, the FD-SOI can be fabricated by polarizing the underlying substrate of the device To control the transistor behavior, similar to the bulk bias that bulk silicon technology can achieve.
Figure 1: Bulk silicon process and FD-SOI process transistor structure comparison (source: STMicroelectronics)
However, the bulk bias of bulk silicon technology is very limited due to reduced transistor efficiency after parasitic leakage currents and reduced transistor geometries, while the FD-SOI will have better biasing efficiency due to the transistor structure and ultra-thin insulating layers, The oxide layer also enables higher substrate biases to achieve a breakthrough dynamic control of the transistor ─ ─ when the substrate is polarized in the positive direction, that is, forward substrate bias (FBB), the transistor switching speed can be accelerated and therefore Optimize component performance and power consumption.
According to ST, FD-SOIs easily implement FBBs and dynamically adjust during transistor operation, providing designers with a high degree of flexibility, especially for components that require high levels of power-saving performance and speed, and performance, and are therefore the Internet of Things Or portable / wearable consumer electronics applications the ideal solution.
Handel Jones, chief executive of International Business Strategies (IBS), a market research firm, wrote in a 2014 report: "The same 100mm square chip, which uses a 28nm FD-SOI process, costs less than bulk CMOS processes 3% and a further 30% lower at 20nm nodes; this is due to the higher parametric yield and lower wafer cost. "In addition, the complexity of die in FD-SOI process is similar to that of bulk CMOS Process comparison, low 10% to 12%.
Jones further said: "The combination of smaller die area and higher parametric yield yields 20% more product cost advantage over the bulk CMOS process for the FD-SOI process at 20 nm. At the 28 nm node, The performance of FD-SOI is 15% higher than that of 20nm bulk CMOS. "He also pointed out:" The FD-SOI process offers higher energy efficiency (high / low Vdd) than bulk CMOS process The power efficiency of FD-SOI in bit cells is also higher than bulk CMOS due to lower leakage current and better immunity to alpha particles. "
FD-SOI process: Western cold, hot East
However, FD-SOI is claimed to have many of the advantages described above, and the manufacturing yield, the cost of proprietary wafers, and the stability of the source of supply, as well as the exact time history of mass production, and the overall technical support for ecosystem integrity are still among the industry So many FD-SOI supporters in Europe, including ST, NXP (NXP) and other supporters, Samsung, GlobalFoundries also actively promote their own FD-SOI foundry business, the technology in the market's discussion of heat and visibility has been low Especially in the West.
As of February 2017, GlobalFoundries announced that it will invest USD 10 billion to set up a 12-inch fab in Chengdu Hi-tech West Zone (Figure 2). The first production line to be operational in 2018 will be transferred from the Singapore plant The more mature 180/130 nm process, the second is the 22FDX FD-SOI process line from its Dresden facility in Germany and is expected to begin operations in 2019; this message has aroused widespread repercussions in the semiconductor industry, In addition to showing once again the ambition of China to develop its own semiconductor industry chain, the "main battle line" representing the FD-SOI process will be ignited in China.
Figure 2: Globalfoundries builds Fab 11 in Chengdu, China, which is a 12 "fab. The second production line planned for mass production in 2019 is the 22FDX FD-SOI process (source: Globalfoundries)
China was very much interested in FD-SOI technology as early as 2015 when Wayne Dai, chief executive of China-based IC design services provider VeriSilicon, said in an interview with the EE Times that instead of working on the FinFET In the process of following up with TSMC or Intel, he believes China should invest in FD-SOI and use it as an alternative to low-power processes. In addition, Simgui of Shanghai started volume production in the fall of 2015 Inch SOI wafers, using Smart Cut process technology from Soitec, a strategic partner with the company.
There is also an investment platform set up by China's "big fund", with the National Silicon Industry Group (NSIG) announcing its 14.5% stake in Soitec in 2016; wafer foundries Shanghai Huali Microelectronics Shanghai Huali Microelectronics Corp.) revealed plans for investing in FD-SOI production lines before GlobalFoundries announced its investment plan for the Chengdu plant, but there is no specific timetable for these announcements, indicating that the FD-SOI will be the blueprint for China's semiconductor industry Part, and may make this so far in the Western world market somewhat bearish technology, glowing in the East market fever.
According to Alain Mutricy, senior vice president of product management at Globalfoundries, in an interview with the EE Times in May 2017, the company's investment in setting up factories in Chengdu is only the first step, followed by the establishment of an FD-SOI ecosystem in the region to help China Foundry IC design industry and design service providers more easily obtain the required IP and tools.
IoT process war is about to explode
At the end of September 2017, Sanjay Jha, CEO of GlobalFoundries, who delivered the keynote speech at the 5th Shanghai FD-SOI Forum hosted by the SOI Industry Alliance, once again vigorously promoted the FD-SOI process with 22 nm - The smallest node, which is also suitable for cost / power sensitive applications such as IoT and portable devices, is expected to be the "longevity" node in the market ─ as a benchmark, the company's 22FDX process and Intel 22FFL process, TSMC 22ULP process Performance comparison (Figure 3).
Figure 3: GlobalFoundries, TSMC and Intel's 22nm Process Performance Comparison (Source: GlobalFoundries)
In an EE Times China interview after the keynote speech, Jha said: "In terms of cost, the 22nm FinFET with planar technology will have more process steps and higher process control complexity." For FDX, the underlying substrate cost May be higher.It is very difficult to simulate the structure of their respective costs, but considering our construction investment in China's wafer fab and the scale of the cost effect, in terms of production costs, compared to Intel's technology may be slightly Advantage. "
In the same forum, Jones, IBS chief executive, further proposed a cost per-gate analysis of the FD-SOI process (Figure 4). He pointed out that the 28-nm FD-SOI process and the 28nm high- The gate cost of a bulk gate (HKMG) bulk CMOS is quite comparable, and the gate cost of a 22nm FD-SOI is still competitive. In the next generation of 12nm FD-SOI, Less, the gate cost is 22.4% lower than the 16nm FinFET process, 23.4% lower than the 10nm FinFET and 27% lower than the 7nm FinFET, while the low power consumption of the FD-SOI is certainly better than the FinFET.
Figure 4: Comparison of FD-SOI and FinFET Pole Costs (Source: IBS)
In addition, Jones also proposed hardware and software design cost comparison of each process node (Figure 5). The design cost of the 12-nanometer FD-SOI is estimated to be between 5,000 and 5,500 million, while the design cost of the 16-nanometer FinFET is about 72,000,000 U.S. dollars , 10-nanometer FinFET design costs about 131 million US dollars; because the design results of the revenue needs to be 10 times the cost, so the 12-nm FD-SOI potential market size (TAM) than the 16-nanometer and 10-nanometer FinFET Bigger
Figure 5: Design Cost Comparison of Each Process Node (Source: IBS)
GlobalFoundries considers mobile devices, Internet of Things (IoT), wireless communications (5G / LTE / Wi-Fi), and automotive (ADAS / automotive communications) as a combination of features and cost advantages such as low FD-SOI power consumption and ease of integration with RF Jones claims that 90% of existing 28-nm process components are suitable for FD-SOI processes, with an estimated TAM size of 17.1 billion U.S. dollars in 2018 (Figure 6) and even 2025 Reaching 18.4 billion U.S. dollars. How many revenue-generating FD-SOI vendors can actually earn depends on their capabilities. The battle to lock down the business opportunities in the Internet of Things market has become commonplace.
Figure 6: Potential Market Size Forecast for 22-nm FD-SOI Process (Source: IBS)
Chinese IC manufacturers eager to Taiwan manufacturers?
According to statistics provided by GlobalFoundries at the 5th Shanghai FD-SOI Forum, the company's 22FDX process has garnered a total of 135 customers, 20 of which will enter the Multi-Project Wafer (MPW) trial by the end of 2017 15 of them will be officially put into operation by the end of 2018. Among the customers who entered the test design / delivery stage were 10 manufacturers from China.
After GlobalFoundries announced the construction of a 12-inch new plant in Chengdu with a total investment of 10 billion U.S. dollars in February 2017, Global Foundry announced in May of the same year with the Chengdu Municipal Government that the two sides will work together to build a cumulative investment scale of over 100 million in 6 years The USD's "world-class FD-SOI ecosystem" covers a number of R & D centers in Chengdu and research projects with universities and colleges that aim to attract more top semiconductor players to Chengdu and "make Chengdu the next generation Chip design center of excellence. "
Companies joining the FD-SOI ecosystem in Chengdu include EDA vendors Cadence, Synopsys, design services core Veritas, Invecas, and chip designers MediaTek, RockChip, Shanghai Fudan Microelectronics Fudan Microelectronics Group Company) and others. In an interview with EE Times, Weimin Min of VeriSilicon said that to obtain R & D funding from Chengdu's FD-SOI ecosystem investment, "Every company must deploy a research and development team in Chengdu."
Dai Weimin pointed out that FD-SOI backers have already laid the groundwork for China and continue to strongly promote the local Chinese chipmakers and IC design engineers, government officials and private investment funds through events like the Shanghai FD-SOI Forum ; And in his view, there are several key points to expand the FD-SOI ecosystem in China, including the feasibility of using FD-SOI for mixed-signal and RF design, support from design service providers such as Verbatim, and substrate bias Design processes and tools, design education, seminars, university courses, labs and textbooks, and government support.
Global IC Founders said their FD-SOI process ecosystem has reached 33 partners as of September 2017 (Figure 7). As a result, , Covering the upstream and downstream industries in the semiconductor industry.While they occupy a very small number, Taiwanese operators are also among them, including ASE, the manufacturer of embedded memory IP, and IP of processor IP Andes.
Figure 7: GlobalFoundries Actively Establishing Industrial Ecosystem for FD-SOI Process (Source: GlobalFoundries)
In an interview with EE Times, Lin Zhiming, general manager of Crystal Heart Technologies, said in an interview with GlobalFoundries' longtime partner, Invecas, a US IC design service provider, in 2015, introducing its 32-bit N7 processor core to a reference design using the FD-SOI process And later won GlobalFoundries' 22FDX process validation.
He pointed out that the heart of the processor core development was originally based on low power consumption, high efficiency as its N7, N8 and N9 series have been used in the Internet of Things and portable consumer electronics market, presence, including smart watches , Smart voice assistants, game consoles and portable karaoke microphones, etc. The target market is in the same direction as the FD-SOI technology. With this process option and the crystal IP, it is expected to bring better power saving to customers' designs efficacy.
Figure 8: Lin Zhiming, general manager of Crystal Technology: The target market for the FD-SOI process is exactly the same as our product line
Taiwan's semiconductor IP suppliers are not absent in the FD-SOI ecosystem, but when will Taiwan IC designers follow up? In addition to MediaTek, which is already preparing to join the FD-SOI ecosystem in Chengdu, As the semiconductor test lab iST said it is understood that the Taiwanese IC industry is still in the minority trying FD-SOI design and it is expected that the process will be slower than those in mainland China Much more.
Conclusion
Huang Zhiyu, an analyst at Semiconductor Research Center of Taiwan's TrendForce Research Institute, said that at present, statistics of global FD-SOI production capacity are not easy to obtain and can only roughly estimate that the process occupies the global wafer generation in 2017 Worker sales accounted for about 0.2%; he pointed out that mainland China actively establish FD-SOI industry chain, the introduction of wafer maker Soitec, foundry GlobalFoundries, Taiwan's foundry industry's 28-nanometer process Competence can have an impact.
However, Huang pointed out that it is also important to observe the timing of China's FD-SOI production capacity, taking into account the depreciation of the 28-nanometer process used by the existing foundries and the actual capacity of the FD-SOI: " When FD-SOI process capacity of small scale, the cost is relatively high, and if the foundry industry depreciation in good condition, will be able to provide more favorable 28-nanometer process price, so in the cost-oriented end-product competition, FD -SOI may not be beneficial. "
28nm process can be said that Taiwan's foundry HMC UMC (UMC), TSMC's "cash cow", which TSMC in 2017 28 nm wafer shipments hit a record high of 180,000, the Nodes Revenue In the third quarter of 2017, TSMC still accounted for the highest quarterly overall revenue to 27%, higher than the advanced 16 / 20nm node; UMC saw the market of 28nm HKMG in the third quarter Demand slows down.
Will the menacing FD-SOI process have an impact on the existing 28-nanometer wafer foundry market? Will China's semiconductor industry rewrite history because of the development of FD-SOI technology? TSMC's forthcoming 22-nanowatt M new process is able to obtain market momentum? As the Internet of Things market opportunities, UMC in the 28-nanometer process and then resorted to what the new "weapons"? 2018 semiconductor market developments worth watching! Eettaiwan
5. Cypress revenue for the fourth quarter of 2017 was $ 575.5 million, an increase of 12.7%
Set the micro-mesh news, embedded solutions leader Cypress Semiconductor Corporation today announced its 2017 fourth quarter and annual report.
• Driven by the automotive and IoT wireless business performance, total revenue hit an all-time high of $ 2.33 billion in 2017 • Total revenue in the fourth quarter was $ 599.5 million, up 12.7% y / y • Fourth quarter GAAP (GAAP ) And non-GAAP margins were 44.6% and 45.4%, up 650 and 530 basis points year-on-year respectively • Diluted GAAP and non-GAAP diluted earnings per share increased by 55% and 87% respectively in the fourth quarter • Operating cash for FY17 Flow of 403.5 million US dollars, an increase of 86%
Hassane El-Khoury, Cypress's president and chief executive officer, said: "Cypress has shown strong performance and record highs in 2017. We formulated the Cypress 3.0 strategy in 2016 to focus on IoT's rapid We are seeing strong revenue growth due to the popularity and rapid growth of automotive, industrial and consumer markets, and our profits have more than quadrupled in 2017. Cypress is now a leader in IoT embedded solutions This success is based on our unrivaled IoT connectivity solution in the target end-market, as well as a broad portfolio of microcontrollers and high-performance memory solutions. "
Total revenue and profit for the fourth quarter of FY 2017 and FY 2017 as compared to the previous quarter and fiscal year are set out in the table below (Unit: $ 1,000, excluding earnings per share data)
1. See the 'Reconciliation Between GAAP Financial Indicators and Non-GAPP Financial Indicators' table (Non-GAPP Financial Statements) listed below 2. 2. 2016 contains the results of the Broadcom IoT business acquired on July 5, 3. Revenue for the 12 months ended 2016 ended with a pre-Spansion $ 18.75 million non-GAAP allowable income.
Business Review
+ Cypress extends its portfolio of automotive infotainment solutions with two new product launches, announcing the availability of the industry's first true dual-band (RSDB) automotive-grade Wi-Fi® and Bluetooth® combo ) Solution that enables multiple users to simultaneously connect devices and deliver content independently on their devices, Cypress also introduced a new line of automotive capacitive touch-screen controllers that provide the next generation of information The entertainment system offers the most advanced features on the market, including detecting fingers up to 35 millimeters above the screen and accurately measuring the different pressing forces applied by multiple fingers.
+ At the recent Consumer Electronics Show in Las Vegas, Cypress demonstrated its products based on its PSoC®6 microcontroller (MCU), the industry's lowest power and most flexible dual-core MCU, Built-in Bluetooth Low Energy (BLE) Wireless Connectivity PSoC 6 is designed for a wide range of smart home, wearable, smart speaker, sound system and other IoT applications.
+ Cypress's single-chip wireless MCU and combo solution for the Internet of Things is the first in the world to offer certified Bluetooth mesh connectivity to consumer products and is used by LEDVANCE's SYLVANIA SMART + Bluetooth Lighting Products. Cypress released three wireless combo chips, as well as the latest WICED® software development kit that supports the most advanced Bluetooth mesh networking capabilities.Cyprus solutions enable easy, secure and ubiquitous Bluetooth connectivity, Enables low-cost, low-power device mesh networking to allow devices to communicate with each other and with smartphones, tablets, and voice-enabled home assist devices.
+ As of the close of the market on December 28, 2017, Cypress paid a dividend of $ 38.7 million, or $ 0.11 per share, to shareholders holding ordinary shares in the company. As of December 28, 2017, the market capitalization The dividend corresponds to 2.9% annualized yield, which was paid on January 18, 2018.
Revenue Summary (In US $ 1,000,% excluding) (Unaudited)
1. The Microcontroller and Interconnection Division ('MCD') includes microcontrollers, automotive and interconnect products and the Storage Products Division ('MPD') includes RAM, flash memory and AgigA Tech products 2. See the 'GAAP Financials' Non-GAPP Financial Statements' table (Non-GAPP Financial Statements) 3. 2016 results of Broadcom's IoT businesses acquired on July 5, 2016 4. Business for the 12 months ending in 2016 Revenue from US $ 18.77 million non-GAAP income from Spansion Asia Pacific, direct sales channel, MCD business included in the previous fiscal year 5. MCD's historical performance includes Deca Technologies dating back to July 29,
First Quarter 2018 Financial Outlook
Cypress's financial performance forecast for the first quarter of 2018 is as follows:
In the last table of this earnings report, reconciliations between forward-looking GAAP estimates and forward-looking GAAP non-GAAP estimates are provided.
Some of the material items that are necessary to calculate financial indicators in accordance with GAAP include restructuring charges, asset impairment, changes in the value of deferred compensation assets and liabilities, the impact of stock compensation due to changes in equity incentives, and the tax implications of non-GAAP adjustments , Etc. whose time and amount are unpredictable by themselves or beyond the Company's ability to control may have a material impact on the financial performance of the Company and therefore Cypress may not be able, with reasonable efforts, to provide any information A fully reconciliation of the non-GAAP financial measures to the GAAP financial measures in the first quarter financial outlook data is also available and additional amendments may be made in the non-GAAP performance reports for the first quarter of 2018. The accompanying non-GAAP financial In the metrics section, Cypress provides a qualitative description of the expected differences between non-GAAP financial metrics and GAAP financial metrics.