Mainly to research and development, production, sales of high-density interconnect Laminates, multi-layer flexible boards, Rigid-Flex PCB and package carrier board projects, the products are widely used in data computing and storage, automotive electronics, communications and networking , Industrial and security, consumer and intelligent terminals and other fields, business distribution in the Asia Pacific, Europe and the United States and other places by the world top 500 enterprises Lenovo, Asus, Foxconn, MOBIS, Samsung and other customer recognition.
It is reported that in June 2015, Aosi Kang and Samsung Electronics began business contact in June 2017, began trial production of samples, mass production started in July the same year, the scale of cooperation continued to grow.October 1, 2017, Small board.