One of the major trends in the field of mobile communications is the unlocking of smartphones with 3D facial recognition rather than fingerprinting or PIN codes.With the help of the 3D image sensor chip from Infineon Technologies AG, the face recognition unlocking function becomes smarter, Faster and more reliable.
Infineon, partnering with innovative partner pmdtechnolgies, has developed a new 3D image sensor based on time-of-flight (ToF) technology, part of the REAL3 ™ family of chipsets that enables the world's smallest intelligence of less than 12 mm x 8 mm Mobile phone camera module, which contains the receiving optics and VCSEL (Vertical Cavity Surface Emitting Laser).
Infineon
Infineon and pmdtechnologies showcased this product innovation at CES® 2018, a Dresden-based chip developed in Munich and Graz that incorporates technical know-how from Germany and Austria.
ToF camera module can be put into mass production
The Infineon and pmdtechnolgies cameras are the only ToF-based depth cameras integrated into commercial smartphones and have won the trust of leading camera module manufacturers for handsets and have been shown to be mass-producible efficiently. In addition, It is not necessary to recalibrate it during use.
ToF advantage to help achieve rapid market growth
The two factors determine the range and measurement accuracy of the camera: the intensity of the emitted and reflected infrared light, and the pixel sensitivity of the 3D image sensor chip The REAL3 chip has a resolution of 38,000 pixels with unique background illumination suppression for each pixel (SBI) circuit that further utilizes the 940 nm infrared light source to make the projected light invisible to further enhance outdoor performance, and the IRS238xC incorporates special features to support the first level of laser safety in a complete solution.