Christiano Amon, president of Qualcomm Incorporated, said: "Only Qualcomm Technologies provides a reliable, end-to-end RF front-end and modem solution tailored to all tiers of terminals to solve the increasingly complex RF in today's gigabit LTE and future networks This is evidenced by our extremely strong RF front end design, our state-of-the-art RF solutions provide excellent connectivity and support for flexible terminal design, and we are excited to work with Google, HTC, LG, Samsung and Sony Mobile and other clients to bring consumers around the world in both shape and function of the terminal.
Adrian Tung, senior vice president, HTC, said: "With Qualcomm Technologies' complete modem-to-antenna system-level solutions and integrated modem software, HTC is able to create the leading smartphone with advanced LTE connectivity with advanced features." Consumers are focused on reliable and consistent cellular Connectivity, Qualcomm Technologies 'end-to-end solutions not only speed up business hours for our products, but also streamline our supply chain.'
Min Kyung-ho, Head of Hardware Platform, LG Electronics Mobile Communications, said: "LG has unique strengths in performance and sophisticated smart phone design with Qualcomm Technologies' tightly integrated modems and RF front-end solutions that allow us to create a Smartphones in the global market while accelerating support for 600 MHz and high-power user equipment (HPUE) with Qualcomm Technologies' platform for envelope tracking, enabling our products to deliver ultra-fast data transfers to customers worldwide Speed, high-quality voice service and reliable voice connectivity. '
Yeonjeong Kim, vice president of research and development at Samsung's mobile communications business, said: "For global consumers, strong signal strength needs to be ensured even in the most challenging environments thanks to Qualcomm Technologies' end-to-end integrated modems and RF solutions Program, Samsung is able to do that, and Samsung is proud to be able to create the state-of-the-art mobile terminal with industry-leading LTE connectivity that is enabled by Qualcomm Technologies' state-of-the-art complete RF front-end solution.
Izumi Kawanishi, director and executive vice president of Sony Ericsson's mobile business unit at Sony Mobile Communications, said: "Sony Mobile achieved significant performance gains using Qualcomm Technologies' RF front-end system-level approach, which works as expected by consumers as the modem and RF front- Of the refined product form factor provides excellent signal performance.In addition, our terminal can achieve lower power through envelope tracking, and shorten the design and test cycle helps us in a very short period of time to achieve high performance products commercially '
The RF front end is crucial to the end user's desired mobile experience and to drive the mobile industry's future growth. "Qualcomm Technologies' RF Front-End Portfolio Matches with Company's Leading Modem Technology for Next-Generation Mobile Terminals and Industry-Leading Mobile Solution for Breakthrough Technology Protocols such as gigabit LTE, 4x4 MIMO and LTE Advanced are also crucial for the evolution and commercialization of 5G technology in 2019.
Qualcomm Technologies' robust RF front-end design represents a continuation of the company's strategy to develop and commercialize a complete mobility solution from digital modems to antennas. Following the February 2017 joint venture between Qualcomm Incorporated and TDK Corporation After RF360 Holdings Singapore Ltd., Qualcomm Technologies introduced a complete RF front-end offering with important new features added to its product portfolio including its first GaAs power amplifier modules, next-generation Qualcomm® TruSignal ™ antenna tuning solution, top-level power amplifier (PAMiD) module, low frequency PAMiD module with full support for 600 MHz Band 71, TC-SAW diversity receive filter and duplexer, 71 features GaAs multimode power amplifier (GaAs MMPA) and aperture tuner optimized for Band 71. In addition, RF360 holding company held a groundbreaking ceremony in Singapore in November 2017. In its important manufacturing Production base to expand capacity signing ceremony, the production base dedicated to the manufacture of radio frequency End of the surface acoustic wave architecture of the wafer, and the most advanced acoustic thin film encapsulation.
Qualcomm Technologies has the complete core technology of a radio front end and delivers truly integrated solutions to the ecosystem with the unique benefits of addressing the rapidly growing complexity and challenges of 4G and 5G.