Funds large fund shares Fu Tong completed the transfer, promote high-end IC packaging and testing market expansion

Set micro-mesh news, the evening of January 8, Tong Fu Microelectronics issued a notice that the company received on November 10, 2017 China Securities Regulatory Commission, "on the approved Tong Fu Microelectronics Co., Ltd. to issue shares to the large fund to buy assets and Approval of raising matching funds ", approving the issuance of 181,074,458 shares to large funds for the purchase of relevant assets; and approving the non-public offering of shares to raise matching funds of not more than RMB 969 million.

Subsequently, Weifu Microelectronics actively promote the above major reorganization items.To date, the issue of shares of the assets of the underlying assets of Nantong Fortune Investment Co., Ltd. 49.48% stake and Nantong Tongrunda Investment Co., Ltd. 47.63% stake has been completed transfer, Large fund Tong Fu Microelectronics become the third largest shareholder.

Fu Runda and Tongrunda as the subject of this transaction, in essence, Tong Fu Microelectronics and large funds jointly acquired Tong Fu Chaowei Suzhou and Tong Fu Ultra Penang 85% stake in the holding platform. The main production technologies of the two factories of Weixu and Tongfu Chaowei Penang include FCBGA, FCPGA, FCLGA and MCM: At present, their products are mainly used in the high-end fields such as CPU, GPU, APU, game chip, etc. The two factories Formerly the world's leading chip maker AMD subordinate professional packaging and testing factory, mergers and acquisitions completed, Fu Weipu docking new and existing customers in the market, Suzhou and Penang business model into high-end customers outsourced IC packaging and testing vendors. All customers are in accordance with the product shape and technical requirements to undertake the order, expanding the application of the terminal area.At the same time, the acquisition of these two factories also completed ahead of the Fu Tong in domestic CPU, GPU industry chain layout.

Tong Fu Chaowei Suzhou and Tong Fu Chaowei Penang has a leading large-scale, large-scale flip-chip technology; from the process, the development and production of 14-nanometer, 16-nanometer technology products, 7-nanometer process is being developed; Stable strategic customers, most of AMD's closures and orders, advanced management systems, and high visibility of the industry; the two JVs have gradually attracted the OSAT plant, the outsourced IC packaging and testing vendor Broadcom, ZTE, Samsung, Alchip, Socionext, Godson, Core sharp, UMC, IDT, with the same color, Faraday and other customers.

Tong Fu Microelectronics said that Tong Fu Chaowei Suzhou and Tong Fu Chaowen Penang asset quality is good, and in the industry-leading position in the high-end IC packaging and testing the market layout is of great significance.The transaction can strengthen the company on the pass Fu Chao Wei Suzhou and Tong Fu Chao Wei Penang's operation and management are conducive to Tong Fu Chao Wei Suzhou and Tong Fu Chao Wei Penang's management team and core technical staff to maintain stability and promote the company's market expansion in the high-end IC packaging and testing field .

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