As high-end smart phones begin to import 18: 9 features, coupled with the requirements of thin and light smart phones, so the use of IDC will become a trend. Supply chain pointed out that although the previous integrated IDC chip touch and screen-driven dual functions, allowing smartphones more Slim but not heavily used due to previous phone brands' inattention to IDC costs.
However, as the second half of 2017, driver IC factory and panel makers joined hands to upgrade their technology to panel hood and interlaced line design, IDC costs began to decline, coupled with more and more drive IC plant to join the IDC battle situation, In order to meet market application and customer demand, panel makers such as BOE, Pegasus, AUO and Quantum also began to provide InCell solutions used by IDCs. In 2018, the use of IDC technology by smartphones will be expected to increase dramatically.
Corporate estimates, IDC shipments will be expected from 1.5 to 200 million units in 2017, growth to 300 million sets by 2018. Among them, Dun Tai shipments in 2017 is expected to reach 6,000 to 65 million units Level, in the overall IDC market share of more than 40% level, also on behalf of 2018 Dunlop shipments will be expected to challenge more than 100 million sets of performance, shipments compared to the expected significant growth.