DRAM production capacity increased by 10% this year | Semiconductor Industry | 'Three Highs' | Break 400 billion US Dollars

Set micro-mesh news, according to the latest International Semiconductor Industry Association pointed out that by 2017 the global semiconductor output will exceed 400 billion US dollars for the first time mark, and 2018 will be optimistic growth year, the semiconductor output is expected to grow 4% 8%, and 2019 output will be expected to challenge 500 billion US dollars mark.

Zeng Rui Yu, senior manager of Taiwan's industry research at SEMI, said that 2017 is a record year for global semiconductor output, with an annual growth rate of 20%. The main reason is the drive of strong memory growth, in which the output value of DRAM will grow by 75% annually and the storage-type flash NAND Flash grew 45% annually, while other ICs grew 9% annually.

Samsung, Hynix, Micron expansion, DRAM production growth challenges this year, 10%

DRAM and NAND Flash are important drivers of the global semiconductor industry in these two years, especially driven by DRAM price hikes in the global semiconductor output value of over 400 billion U.S. dollars in 2017. According to SEMI estimates, at SK Electronics, SK Hynix continues to expand DRAM production capacity, DRAM supply-side production capacity may grow by 10% in 2018, which will be greater growth, but the terminal demand is also catching up, it is estimated that in 2021, DRAM annual growth rate of 30%.

See Samsung, Hynix and Micron, the three global DRAM industry camps, including Samsung and SK Hynix, which are accelerating their expansion plans. They include Samsung's P1 plant in Pyeongtaek, South Korea and its Line 15 production line. As well as SK hynix M14 production line; In addition, Micron's Fab 15 and Fab 16 in Hiroshima also DRAM expansion plan, but the main expansion is still the main two Korean companies.In addition to expansion of the DRAM industry, the NAND industry Currently, there are plans to expand the production line including Samsung Pingsu Plant, M14 production line of SK Hynix, Micron Lehi and Singapore Fab 10X, Toshiba Fab 2 / Fab 6, and Intel Fab 68 in China.

SEMI estimates DRAM device equipment spending in 2017 will be about $ 13 billion, doubling the growth in 2016 and is expected to continue to grow to $ 14 billion in 2018. NAND equipment spending in 2017 will be about $ 19 billion, up from $ 10 billion in 2016 The U.S. dollar has grown by leaps and bounds. It is estimated that 20 billion U.S. dollars will be spent on NAND equipment in 2018.

In fact, both the DRAM and NAND camps are full of confidence in boosting their production capacity, but do not forget that the demand side is also in the doldrums driven by the adoption of IoT, AI, automotive electronics and consumer electronics. The main growth sources are DRAM, NAND, sensors, optoelectronics and discrete components. These applications are expected to continue to drive the growth of the industry this year. In addition, the demand for applications such as wireless, automotive and consumer electronics products will also grow.

The semiconductor industry 'three high' momentum Wang, localization advantage gradually revealed

In 2017 the global semiconductor output exceeded 4,000 US dollars mark, 3D NAND manufacturers, DRAM factory, foundry three people are expanding production to seize the market, which also inspired the semiconductor equipment and materials industry a tremendous business opportunities rare, The face of 2018, the entire global semiconductor industry will be the emergence of unprecedented prosperity.

'Six big 3D NAND factories, three major DRAM camps, and the expansion of foundries on both sides of the Taiwan Strait have led to a spending of $ 57 billion on equipment investment in fabs in 2017, setting a record high for history. "According to SEMI International Semiconductor Industry Association, 2018 Fab equipment investment-related expenditures will reach 63 billion US dollars, once again climbed the peak!

In addition to the global semiconductor output and semiconductor equipment investment highs, shipments of silicon wafers also hit a new high in 2017. This is the "three highs" in the semiconductor industry in 2017. This is respectively the record high output value, high equipment spending, Wafer shipments hit record highs.

Looking at the expansion of the 3D NAND, DRAM and foundry camps, Samsung Pyeongtaek Plant in Samsung, M14 in SK Hynix, Micron Lehi and Fab 10X in Singapore, Toshiba Fab 2 / Fab 6, and Intel Fab 68. In the DRAM industry, there are Samsung's Pyeongtaek P1 Plant and Line 15, SK hynix M14 and Micron's Fab 15 and Fab 16.

According to SEMI statistics, 2018 DRAM capacity increase of 10%; 3D NAND capacity growth of up to 48%; foundry up to 5%.

In the foundry industry, Fab 12/14/15 fabs with 12-inch fab expansion plans include TSMC's 7-nanometer and 5-nanometer sprints; S2 and S3 from Samsung; Fab1 / 8/11 from GlobalFoundries ; SMIC Beijing Plant B2, Shanghai New Plant, Shenzhen New Plant, UMC Fab 12A P5 and Xiamen Plant.

Affected by this construction boom, the biggest beneficiaries are the semiconductor machine equipment manufacturers, especially the 3D NAND industry and process technology below 20nm, which are heavily used in etch machines, followed by CVD machines, and the related equipment chambers benefit the first .

In 2017, South Korea benefited from Samsung and SK hynix boosted its DRAM production capacity. South Korea replaced Taiwan with $ 18 billion to become the world's largest spending market, followed by Taiwan with 12.6 billion U.S. dollars. In addition, In addition, SEMI predicts that South Korea will consistently top $ US16.9 billion in 2018, while mainland China may overtake Taiwan as the world's second-largest device spending market.

It is also worth noting that China's spending on semiconductor equipment and materials will gradually show its upward momentum in 2018. As China's wafer fab, which completed last year by 2018, is expected to enter the phase of equipment installation, China's spending will grow significantly However, unlike in the past, mainland fab investment mostly came from foreign manufacturers, and for the first time in mainland China, wafer fab spending will catch up with foreign vendors, including Yangtze River Storage, Fujian Jinhua and Huali Many new entrants, such as Microelectronics and Hefei Changxin, plan to invest heavily in setting up plants in mainland China and have plans to build them. The industrial structure will gradually change.

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