Global semiconductor industry's High-profile 7 nm process War, in early 2018 by TSMC first debut, although Samsung Electronics (Samsung Electronics) also planned 7 nm process, but TSMC has won more than 40 customers, including mobile communications, high-speed computing, artificial intelligence (AI) and other fields, Is the most extensive application and customer-level high-end process, in particular, TSMC-take-all Apple iphone processor chip large single, 2018 wafer generation of the Battle of TSMC has won most of the first. TSMC recently disclosed the advanced process planning, 5 NM production base Fab18 will be officially started in South Branch, and a plan three, as for the 3 NM process start-up time although not yet announced, but TSMC has revealed that it will invest more than 20 billion dollars to plan 3 nm, Obviously with the division of Independent Wafer Foundry division of Samsung all-out fight. Samsung was temporarily defeated by TSMC in the 7 nanometer process, in the face of Apple, Qualcomm and other big customer orders fell into the TSMC pocket, Samsung Brewing launched a counterattack, a few days ago with the South Hua City reached a consensus, plans to establish a new 7 nm process production line, Samsung and the United States, the mainland customers to negotiate new cooperation cases, positive counterattack strategy is obvious. Samsung in the division of the wafer foundry sector, the adjustment tactics more and more positive, planned to launch the 4 nano-process in 2020, is clearly aimed at the TSMC 5 nm process, Samsung also planned in 2017-2020 years, continuing to promote semiconductor process technology, the 2018 production of 7 nm, 2019 has been invested 6 NM and 5 NM research and development. Samsung Wafer Foundry department related executives said that it is expected to take 5 years to win the global wafer Foundry 25% market share. At present TSMC's global market share is close to 60%, much higher than other rivals, and Samsung's market share is less than 10%. Samsung early is to help Apple cell phone processor chip OEM, and then focus on high-end process technology, even in the 14 nm and 10 nm FinFET process generation, Rob TSMC big customer Qualcomm orders, let its wafer foundry career First World War fame. However, after entering the 7-nanometer process generation, TSMC also grabbed Apple and Qualcomm orders, obviously win Samsung, for this reason Samsung's wafer foundry strategy has also changed significantly, in the past focused on high-end manufacturing fast overtaking, the recent wide range of applications with the customer contact, so that the wafer foundry business layout more extensive, in order to lift the market occupancy rate. TSMC, though at 7 nm Cheng, but has also experienced the pressure of Samsung in the process technology, so, TSMC in the 5 nanometer process layout is not to relax, the current planning 5 NM production base is Fab18, is expected to start in South Branch in 2018, and planning the three-phase land, Shows how much it attaches to the 5-nanometer generation. The semiconductor industry has pointed out that the TSMC 5 nanometer process will be a continuation of the 7 nm generation, the application of the same locked mobile communications, high-speed computing, artificial intelligence, machine learning, etc., is expected to enter the 2019 risk of production. In addition, the TSMC 7 nano (N7) process in 2018, production base in the FAB12 and FAB14 Phase III, is expected to strengthen the 7 NM (n7+) process will be imported polar ultraviolet light (EUV) technology to achieve production costs and chip density of the best sweet point.
