680 million yuan fund shares Jing Fang Technology, holding 9.32% stake

Set micro-network news, December 29, Crystal side technology announcement that the company shareholders Engineering and IP Advanced Technologies Ltd. (hereinafter referred to as 'EIPAT') and the National Integrated Circuit Industry Investment Fund Co., Ltd. (hereinafter referred to as the 'big fund' ) Signed the Share Transfer Agreement. EIPAT transferred 21,677,753 shares of its outstanding shares of Crystal Technology, accounting for 9.32% of the total shares of the Company, to the Great Fund. The transfer price was RMB31.38 per share and the total transfer price was RMB6.8 100 million yuan.

Jing Fang Technology Bulletin said the acquisition of large funds the shares of the company, is to play a big fund in the national IC industry's leading role in supporting Jing Fang Science and Technology to become the world's leading sensor advanced packaging and manufacturing enterprises to further enhance their technological innovation And lead the ability to promote the industrialization of the scale of its application and the layout of the industrial chain and promote the national integrated circuit industry in the field of sensor innovation and effective development and effective development, at the same time for large fund investors to create a good return on investment.

Prior to this change in equity, the large fund does not hold the shares of crystal technology shares after the change of equity, the large fund will hold unlimited shares of Crystal Technology 21,677,753 shares, representing 9.32% of total crystal technology shares, Crystal side technology shares more than 5% shareholders.

Crystal technology is a major IC packaging and testing business in the enterprise through continuous technological innovation and the smooth implementation of business projects, Crystal technology has become the world leader in the field of sensor packaging technology, the global 12-inch 3D TSV package Technology pioneer, the world's first IC packaging and testing company with 12-inch 3D TSVs and industry standards makers, and a leading global market in products such as CIS, FinGenePrinter and MEMS.

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