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1. Cai Li trip: MediaTek is not the first wave of 7nm users;
Set micro-grid news, 2017 is coming to an end, MediaTek held a press conference yesterday, except for the first time and the media face-to-face Cai Li, the new take over the post of general manager Chen Guanzhou, financial director Gu Dawei, vice president of home entertainment division The total tourist Jie, Xu Jing, vice president in charge of automotive products and other key executives are personally present.
TSMC 7nm process will be mass-produced next year, although MediaTek is not the first wave of customer list, but MediaTek CEO Cai Li-line revealed that MediaTek products are now using 12nm process, I believe 7nm will be very valuable, MediaTek advanced process in the use of not absent, There are three 7nm chip product design, but can not comment when the production.
As for whether MediaTek has a chance to "eat apples," Tsai insisted that "there is no knowledge about it." However, he stressed that as long as there are good opportunities, all will strive to win and the North American market will continue to expand its investment.
Broadcom intends to M & A Qualcomm, Tsai said that the semiconductor industry has stabilized, the phenomenon of industry consolidation is bound to occur, neutral view, not very scared or happy.
MediaTek recently suffered a minor injury due to a minor readjustment of the pace of its efforts to prevent the mid-market from being turned back. "Chen Guanzhou pointed out that the Helio P series launched this year has a good response to the market, mainly targeting RMB 1,500 to 3,000 price band, the market response is very good, next year will push two P-series chips.
In response to the trend of AI, Chen Guanzhou revealed that MediaTek will import AI functions into various product platforms such as mobile phones, TVs and home entertainment. In the next two to three years, AI will be able to see the impact on the industry.
2.AI revolutionary rewrite the image processor chip layout behind the processor;
As artificial intelligence (AI) became significant, the layout of the image processing chip market changed dramatically.
According to Yole Développement, a research institute, embedded video and vision-related chips will be split into two blocks driven by AI applications, one of which is the traditional ISP market, which is based on a 6.3% compound year The growth rate (CAGR) has been steadily rising. The overall market size in 2017 will be 4.4 billion U.S. dollars.
The other is the emerging visual computing processor, which is mainly responsible for the implementation of a variety of image analysis algorithms, thus requiring high computational efficiency and memory bandwidth, the market compound annual growth rate will be as high as 30.7%, and Officially surpassed ISP in 2021 and became the largest block in the embedded imaging and vision chip market.
3.IDM and foundry will become the pioneer of advanced packaging technology development;
TSMC 2016 with 16nm process foundry InFO IC packaging and testing services for the Apple OEM A10 processor; 2017 Apple's new generation of smart phones A11 processor, TSMC 10nm process combined with InFO and then get a large OEM; In 2018 will be 7nm process combined with InFO foundry A12 processor.
The market is expected to OEM foundry will be a massive move from smart phones to artificial intelligence (AI), TSMC actively provide this integrated service, legal persons believe that some of the IC packaging and testing and carrier manufacturers will result in reduced business impact.
IDM and foundry will become pioneers in advanced packaging technology development
Although manufacturers can no longer follow the same pace of Moore's Law, but chip, system and software technology will continue to progress, manufacturers are gradually moving to the development of advanced packaging technology to continue the pace of Moore's Law, from the lead in the development of Inform Technology by TSMC Apple was adopted, not It is hard to find that IC packaging and test foundries have become followers in the field of advanced IC packaging and testing. The main reason is that the advanced packaging technology is biased toward higher precision semiconductor manufacturing, which is the strength of IDM and foundry manufacturers.
In addition, these manufacturers relative to IC packaging and testing plants can afford the advanced capital required for the package, in theory, the development schedule than the professional IC packaging and testing faster, so the future in the field of advanced packaging technology IDM and foundry Will be a pioneer in the development role.
IC packaging and testing companies will benefit from Apple's TSMC InFO advertising effect
Although the launch of InFO by TSMC made it impossible for IC packaging and testing manufacturers to lose orders from IC packaging and testing OEMs, the advantages of wafer-level IC packaging and testing technologies, such as InFO and WLCSP, make mobile mounting more lightweight and in such limited space Provide more I / O number and excellent cooling effect in the processor, make the processor can exert its best efficiency.
After Apple adopted the good market response, the advertising effect will be formed on customers and the market to enhance the willingness of other customers to become business opportunities for IC packaging and testing companies. In addition, TSMC's IC packaging and testing business currently only serves a small number of wafer orders placed by TSMC There are still other target customers such as Qualcomm and Hisilicon in 2016 and Infiniteon's single Fan-Out to ASE in 2017 as the best example of advertising benefit. hospital
4. Researchers build molecular memory for deformation
Researchers at the University of California, Berkeley, and National Laboratories are working on a molecular-sized, deformation-memory technology that takes only a few atoms to store 0 and 1 as a shape and can match the future Atomic processor ...
As complementary metal-oxide-semiconductor (CMOS) approaches atomic level, a molecular-size shape-changing memory technology is maturing, reversibly changing the lattice structure of molybdenum telluride (MoTe2).
According to Zhang Xiang, a professor at UC Berkeley and director of materials science at Lawrence Berkeley National Laboratory (LBNL), this approach requires only a few atoms to take 0 and 1 as Shape memory, in order to achieve a solid state memory capable of storing mechanical materials, and can be used with the future atomic level processor.
The technique uses electron injection - instead of encoding the memory in terms of charges, spins, or any brief amount, it is possible to change the lattice structure of MoTe2 reversibly.According to Zhang Xiang, rearrangement of atoms through electrical stimulation Structure that changes the properties of the material so that less energy than that required to transfer chemistry can be used to form and sense 0 and 1 or thermally induce transitions as in phase-change memory.
The key to this process is the use of transition metal dichalcogenides (TMDs) - in this case MoTe2's atomic monolayer allows its internal lattice structure to be transported through the structure by electron transfer between two steady states To be changed.Zhang Xiang jointly UC Berkeley and Berkeley National Laboratory researchers jointly study, in their MoTe2 film example, the two stable lattice structure is a symmetrical 2H arrangement, as opposed to 1T structure .
Berkeley researchers are currently trying to use a variety of TMDs as the target material for the electron injection of their deformed lattice structure, but MoTe2 is favored for its changing electronic and photonic properties. The researchers' goal is to create a library of 'designer films' that can be used in computer and optical applications, including solar panels.
In 2D, single-layer TMD films, electrical and optical properties can be electronically altered, including resistance, spin transport, and phase-related shape changes used by Berkeley's research methods.
Zhang Xiang said the researchers verify the concept of the use of 'electrostatic doping' electrons (rather than atoms), used as a dopant.After the ionic liquid coating MoTe2 monolayer, the researchers use the injection of electron doping Agent to alter the shape of the lattice and is said to create a defect-free material The resulting 1T structure is tilted and metallic, making it easy to segregate from the 2H atomic lattice arrangement of semimetallic structures The original 2H structure was restored by applying a lower voltage to remove the doping electrons.
The DoE sponsors the research program DoE's Office of Basic Energy Science performs transmission research and its Light Conversion Materials Research Center (EFRC) Light-Material Interactions (LMIs) ) DOE EFRC and the National Science Foundation (NSF) support the project through device design and manufacturing, and Tsinghua University in China provides a resource for research at Stanford University Staff also contributed, as well as grants from the Army Research Office, Naval Research Office, NSF and Stanford University Graduate Scholarships.
Compile: Susan Hong
(Reference text: Berkeley Builds Shape-shifting Molecular Memory, by R. Colin Johnson) eettaiwan