Market is expected to OEM foundry will be a massive move from smart phones to artificial intelligence (AI), TSMC actively provide this integrated service, legal persons believe that some of the IC packaging and testing and carrier manufacturers will result in a decrease in business impact.
IDM and foundry will become pioneers in advanced packaging technology development
Although manufacturers can no longer follow the same pace of Moore's Law, but chip, system and software technology will continue to progress, manufacturers are gradually moving to the development of advanced packaging technology to continue the pace of Moore's Law, from the lead in the development of Inform Technology by TSMC Apple was adopted, not It is hard to find that IC packaging and test foundries have become followers in the field of advanced IC packaging and testing. The main reason is that the advanced packaging technology is biased toward higher precision semiconductor manufacturing, which is the strength of IDM and foundry manufacturers.
In addition, these manufacturers relative to IC packaging and testing plants can afford the advanced capital required for the package, in theory, the development schedule than the professional IC packaging and testing faster, so the future in the field of advanced packaging technology IDM and foundry Will be a pioneer in the development role.
IC packaging and testing companies will benefit from Apple's TSMC InFO advertising effect
Although the launch of InFO by TSMC made it impossible for IC packaging and testing manufacturers to lose orders from IC packaging and testing OEMs, the advantages of wafer-level IC packaging and testing technologies, such as InFO and WLCSP, make mobile mounting more lightweight and in such limited space Provide more I / O number and excellent cooling effect in the processor, make the processor can exert its best efficiency.
After Apple adopted the good market response, the advertising effect will be formed on customers and the market to enhance the willingness of other customers to become the business opportunities of the IC packaging and testing companies. In addition, TSMC's IC packaging and testing business currently only serves a small number of wafer orders placed by TSMC There are still other target customers such as Qualcomm and Haas in 2016 and Infineon's single Fan-Out to ASE in 2017, which is the best example of how to benefit from the advertising effect.