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1. Are we all from steelmaking to semiconductor wafer fabs and silicon wafers?
Set micro-mesh news, at present, China's semiconductor market has exceeded the size of the North American market, the semiconductor market has become the largest area in 2016. China's semiconductor industry achieved sales of 637.8 billion yuan, achieving a 14.77% growth rate; China's semiconductor market demand The scale also increased from 689.6 billion yuan in 2008 to 1.38954 trillion yuan in 2016. The rapid development of China's semiconductor market brings strong market demand.It is estimated that in 2018, the demand scale of China's semiconductor market will reach 1.59403 trillion yuan RMB.
Huge demand for wafer manufacturing in mainland China 'building tide'. Followed by the international semiconductor industry trends, many domestic and foreign manufacturers choose to invest in wafer expansion in China. SEMI data show that the Chinese fab construction spending 2017 Year will reach 6 billion US dollars, will reach 6.6 billion in 2018. Over the past two years, the world's new 17 12-inch wafer fab, of which 10 are in mainland China; from 2017 to 2020, is expected to add the world's semiconductor 62 lines of which 62 are located in mainland China, accounting for 42% of the total. It is estimated that the newly built 12-inch factory in 2018 with planned production capacity of 70,000 units a month SMIC (Shanghai), planned month Capacity of 85,000 tablets of the core (Chengdu) and plan early 20,000 wafer wafer TSMC (Nanjing) and so on.
Construction tide has not stopped. December 5 San'an Optoelectronics and Quanzhou, Fujian, Nanan signed a 33.3 billion investment agreement to build high-end GaN LED substrate, epitaxial, chip R & D and manufacturing industrialization projects; high-end gallium arsenide LED Epitaxial, chip R & D and manufacturing industrialization projects; high-power GaN gallium nitride R & D and manufacturing industrialization projects; optical communications devices R & D and manufacturing industrialization projects; RF, filter R & D and manufacturing industrialization projects; Semiconductor (power electronics) R & D and manufacturing industrialization projects; special substrate materials R & D and manufacturing, special packaging products R & D and manufacturing industrialization of seven projects, and started on December 26.
On December 18, Xiamen Haicang and Hangzhou Silan Micro signed a strategic cooperation framework agreement in Xiamen. According to the agreement, the total investment is 22 billion yuan, planning and building two 12-inch feature process chip production lines and an advanced compound semiconductor device production line On December 26, Guangzhou YMCI project started with a total investment of about 7 billion yuan and a monthly output of 30,000 12 - inch wafer chips. After reaching the goal of producing 10 billion yuan in sales revenue, it will drive up and down the production of 100 billion yuan worth of products, It is estimated that the first half of 2019 will be completed and put into production.
More new fabs mean there will be a new round of wafer equipment investment in the next few years.Furthermore, the field of foundry industry can be said to be a technology and capital intensive industries, to build a 12-inch Line investment up to billions of dollars.According to the state consulting survey shows that the initial monthly production capacity of about 10k 28nm new fab, for example, the depreciation cost of the overall revenue of about 49%, compared with the first-line wafer generation Factories depreciation costs accounted for about 23.6%, and 25% of second-tier plants, new plant depreciation costs nearly doubled, while the indirect personnel costs, due to the new plant's key technical manpower, we must rely on at least higher than the market 2 ~ Three times the salary to attract professional and technical personnel, to enhance customer relationships and shorten the product volume of the learning curve, state consulting estimates that the indirect cost of the new plant accounted for 34%, far higher than the first-line and second-line factory 10.2% With 17.5%.
The scale of the investment is so great that mushroomed fabs have raised concerns in the industry that capacity utilization in existing plants has started to fall or even surpassed and what is needed to fill in the capacity of these new plants? Gu Wenjun, a research analyst, commented that the utilization rate of 12-inch fabs in the world is beginning to decline now. That is to say, 12-inch Fab capacity has begun to go down. Now 12-inch production capacity has begun to excess. Several 12-inch Foundries Capacity utilization has begun to decline, the domestic is concentrated in the low-end by low-cost fight, how so many people are willing to do Foundry? From universal steel to universal semiconductor, too far, governments may be prudent to think about their own region is suitable for development Semiconductor industry.
Market, capacity, process conversion triggered silicon wafer market soaring
Corresponding to the fab, China's enthusiasm for developing its own silicon wafer industry is also on the rise.According to IC Insights data, as of the end of December 2016, the global wafer capacity (calculated according to the 8-inch wafer) reached 17.114 million / Month, of which 10.8% of China's global production capacity market; IC manufacturing wafer capacity (calculated according to 8-inch wafer) in 2018 and 2020 are expected to reach 19.42 million / month and 21.3 million / month, It is estimated that the average annual growth rate will be 5.4% between 2015 and 2020. And the mainland's foundry's share will grow from 9.3% in 2015 to 19.2% in 2020. It is estimated that by 2020, the mainland wafer manufacturing capacity Will reach 4.05 million / month in the huge market demand driven by the burst of silicon wafer prices this year continued to rise and demand.
Another reason for boosting the silicon wafer rally is the steady growth in demand for silicon wafers in the past decade, with a reduction in the area of one IC made by more than 24% in 2016 compared with that in 2007, and an IC area of 0.044 in 2 in 2016 , Compared with 0.058 sq.ft. in 2007 and a decrease of 2 ~ 3% in 1 year, but the growth in demand from terminals has driven the demand for silicon wafers to grow by about 5% to 7% every year. Therefore, the overall wafer area is 3-5% Of the growth of the basic supply of suppliers did not expand this year demand suddenly broke out, naturally not have enough capacity to deal with According to DIGITIMES data from 2006 to the first half of 2016, the semiconductor silicon wafer industry after more than 10 years of oversupply , The majority of silicon wafer supplier profit is poor, making the supply side noodles in recent years quite conservative action, leading to 12-inch and 8-inch silicon wafers starting in 2017 from a tight supply status, it is estimated that the fourth quarter of 2017 12-inch The average selling price of silicon wafers is expected to grow by 20-30% over the same period in 2016, and the fourth quarter of 2018 will increase by 20-30% as compared with the same period in 2017.
In the field of silicon wafers, the industry agglomeration effect is also very obvious.Currently the global silicon wafer manufacturers to Japan, Taiwan, Germany and other five major manufacturers, including Japan's Shin-Etsu, Japan wins high SUMCO, global wafer, Germany Siltronic, South Korea SK Siltronic , With the top five suppliers covering about 98% of the market, while there were over 25 suppliers around the world in 1998. The five plants are now full, but the industry estimates the global demand potential of 12-inch silicon wafers a month Up to 6 million or more.
Under the normal out-of-stock prices, wafer fabs, which occupy market leadership, grab silicon wafer capacity one by one, and silicon wafer suppliers also give priority to these large customers. For example, TSMC and UMC grab silicon wafer capacity separately from Two Japanese silicon wafer suppliers signed short-term contracts, and even rumored TSMC in order to ensure supply has been negotiated with the silicon wafer plant the next 2 years, of which 20% increase in 2018; Micron, Intel, cell core, etc. have long advanced Contract package capacity and so on.
For mainland customers in the next 3 years out of new capacity, silicon foundry prices from 135 dollars to jump off and asked to pay a large margin, in addition to the semiconductor plant in mainland China pulled up the threshold, but also for other semiconductor plant to establish Quote bottom line, if not willing to accept the price of 110 to 120 US dollars, many land plants are willing to pay higher prices under the package capacity.Such a supply and demand for oligopolies in the silicon market, the prominent contradiction between supply and demand will force the localization of silicon. The significance of the big wafer project to China's semiconductor industry is that the upstream (raw material end) can be controlled autonomously.
China's silicon wafer factory investment
Unlike foundry, a new silicon fab capacity of at least 100,000, and the cost of 4 to 500 million US dollars, silicon wafer samples come out, the subsequent need for wafer fabs, IC packaging and testing plant Downstream industry chain testing and certification.Cover plant plus certification, it is estimated 1.5 to 2 years before mass production, and now reinvestment is to invest 12-inch or 18-inch manufacturers will also be the focus of consideration.
At present, there are at least 9 silicon projects in China, including Shanghai Xinsheng, Chongqing Su-Si, Ningxia Yinhe, Zhejiang Jinruihong, Zhengzhou Hejing, Yixing Zhonghuan Jingsheng Project and Xi'an Hi-tech Zone Project, etc. . Total investment scale of over 520 billion yuan, is planning 12-inch wafer production capacity has reached 1.2 million in the future to ease the silicon out of stock problem is expected in the next large wafer industry in the next few years will still be There are new players to join.
At present, the monthly production capacity of 8-inch silicon wafers in mainland China has reached 700,000 pieces / month and the capacity under construction is 265,000 pieces / month. With 8-inch production capacity, Zhejiang Jinruihong, Kunshan Zhongchen Round sub-company), Beijing Institute headquarters, with a total monthly capacity of 93,000 / month, far below the demand .12 inches, the current total demand in China is about 420,000 / month, is expected to total demand in 2018 For the 1090000 / month.Currently mainland China does not have the 12-inch electronic grade silicon production capacity, the earliest to the end of 2017. Shanghai New Semiconductor is expected to complete the first phase of product put into production, plans to produce 150,000 per month, to The second phase of 2020 production, plans to produce 300,000 per month, compared with the huge demand is not enough.
July this year, a total investment of 3 billion yuan, a 1.5 billion investment in Ningxia silver and 1.8 million 8-inch semiconductor silicon polishing film project in Yinchuan Economic and Technological Development Zone on the 6th of this project developed with independent intellectual property rights 40 -28nm and 16nm process 8-inch semiconductor polishing pad manufacturing technology, and for the next stage of 12-inch semiconductor wafer polishing technology research and development laid the foundation.
In September, Ferrotec (China) signed an investment agreement with Dajiang Industrial Cluster in Hangzhou to build 300,000 8-inch semiconducting silicon polishing pads per month and 200,000 12-inch semiconducting silicon polishing pads per month Round wafer project), with a total investment of 6 billion yuan.It is planned through the implementation of new investment projects, the formation of 8-inch and 12-inch large-size semiconductor semiconductor wafer large-scale production capacity.
In November, Jingsheng Electrical and Mechanical Services spent 500 million yuan and Central shares in Yixing City, the construction of integrated circuits with 12-inch large wafer production and manufacturing projects with a total investment of about 3 billion US dollars.
December 9 Wilson Silicon industrial base project signing ceremony held in Xi'an.The silicon industrial base project by the Xi'an High-tech Zone and Beijing core kinetic energy companies, Beijing Weiss Wei company tripartite investment, the project total investment of more than 10 billion yuan Of which Beijing Core Kinetic Investment Management Co., Ltd. was jointly established by BOE Technology Group Co., Ltd., State IC Investment Fund Co., Ltd., Beijing Yizhuang International Industrial Investment Management Co., Ltd. and professional team in 2015. The giant entered the market Investment in the silicon industry, the future is expected to break the semiconductor wafer industry entirely dependent on the situation of imports.
Although the scale of silicon fab investment is not as large as fabs, but also worried about whether these projects will result in excess supply of the market, resulting in avalanche of silicon wafer prices?
In this regard, the industry said that if the project can achieve mass production targets, 8-inch silicon does appear overcapacity; but due to the continued increase in demand and process complexity, energy-producing 12-inch wafer manufacturers will not be too much, Expected overcapacity in the field is not expected.Because 12-inch large wafer technology and process requirements are very high, the biggest technical difficulty is the growth of the crystal technology.
At present, the light doped silicon market accounted for about 70%, the crystal defects and metal impurities is very sensitive, only the world's top four manufacturers have production technology.For example, South Korea LG can only do 40% to 50% Of the yield, but to achieve 87% yield, the project is likely to be profitable, only the current super-silicon in Chongqing, Shanghai Xin Sheng really started to produce 12-inch large wafer technology road.
233.3 million yuan Sanan high-end semiconductor project officially started construction, put into operation within five years;
Set micro-grid news, according to Quanzhou network reported yesterday, 'Quanzhou core Valley' security area Sanan high-end semiconductor project officially started construction.
It is understood that the evening of December 5, San An Optoelectronics Announcement, and Quanzhou City, Fujian Province People's Government and Nan'an People's Government of Fujian Province signed the "Investment Cooperation Agreement" motion.According to the agreement: the company intends to Quanzhou in Fujian Province Valley The investment in Nanan Park is one or several project companies with a total investment of 33.3 billion yuan (including public facilities investment, unit: RMB, the same below). All the projects have been put into production within five years and all the projects have been put into production within a period of seven years. In 25 years.
Among them, the project includes high-end GaN LED substrate, epitaxial, chip R & D and manufacturing industrialization projects, high-end gallium arsenide LED epitaxy, chip R & D and manufacturing industrialization projects, high-power GaN gallium nitride R & D and manufacturing industries The seven major industrial clusters and other projects.
Now this high-end semiconductor project has finally officially started construction.
It is reported that the investment will set up a number of project companies, after the completion of the annual sales income of about 27 billion yuan (according to the current product price calculation.) Sanan Optoelectronics in Quanzhou Corey Nanan Park, a wholly owned subsidiary of investment in integrated circuits, LED epitaxy and Chip R & D and manufacturing industries and projects, the company tentatively named Quanzhou Sanan Semiconductor Technology Co., Ltd., the registered capital of 2 billion yuan.
In recent years, seize the country to encourage and support the development of the semiconductor industry, the historical opportunity, in accordance with the provincial party committee and government decision-making deployment, the municipal government proposed planning and construction of Quanzhou Semiconductor Hi-tech Industrial Park, the formation of 'one district and three parks' development pattern , Full introduction of leading enterprises, with two key industries - memory manufacturing and compound semiconductor manufacturing as the pillar, with Fujian IC Industrial Park, Nanan High-tech Industrial Park, Fujian Quanzhou (Lake) Optoelectronics Industrial Park as a platform to foster the design, Manufacturing, IC packaging and testing, terminal applications such as the entire industrial chain, and strive to create a new economic growth pole.
Among them, Nan'an Park is the core area of 'Quanzhou Core Valley', with a planned area of 33 square kilometers. It will focus on compound semiconductors and gather the upstream and downstream enterprises in the industrial chain, eventually forming the entire industrial chain system of compound semiconductors.
Sanan Optoelectronics is principally engaged in the research and development and application of III-V compound semiconductor materials, focusing on epitaxial, chip core The main industry, and strive to build internationally competitive semiconductor manufacturers.San said that this investment project belongs to the emerging national strategic efforts to build the industry, with energy saving and environmental protection.
3. Angao invested 200 million Guangzhou R & D center set up into the AI chip market;
Set micro-mesh news, Anglo-Singapore announced yesterday that it plans to invest 200 million yuan to set up its operation base in Guangzhou Development Zone and set up an artificial intelligence (AI) research and development center to expand its business into smart devices and IoT chips and fully cut into the field of artificial intelligence .
Chan Che-leung, general manager of Ang Po, pointed out that Guangzhou is now actively developing information technology, artificial intelligence and biotech medical industries, of which the chip is an indispensable product in all fields. Therefore, it was decided to set up the new headquarters in Guangzhou.
Anglo announced that it will invest 200 million yuan to set up its operation base in Guangzhou Development Zone and will also set up an artificial intelligence research and development center to extend its existing business to the smart device and networking chips market.
Debao has now locked the market for artificial intelligence and is targeting smart home markets such as smartphones, smart speakers and smart lamps. In addition, it is even possible for AI functions to infiltrate even small home appliances, More intelligent, unlimited market, Ang Tao revenue will have a significant growth.
4.Huahong Semiconductor's second generation of 90-nanometer embedded flash memory technology platform mass production
, A leading 200mm pure foundry in the world, announced today that its second-generation 90nm G2 eFlash process platform has achieved mass production, technical strength and competitiveness Strengthen again
Based on the accumulation of the 90nm G1eFlash process technology of the first generation, Hua Hong Semiconductor has achieved various technological improvements on the 90nm G2 eFlash process platform. The 90nm G2 miniaturizes the cellular size of Flash, Generation of about 25% reduction, for the current global foundry 90nm process node embedded flash memory technology, the smallest size.
In addition, the 90nm G2 incorporates a new Flash IP design architecture that provides a very small area of low-power Flash IP while guaranteeing high reliability (ie, 100,000 write cycles and 25-year data retention). As a result, 90nm G2 eFlash can significantly reduce the overall chip area, resulting in a single wafer with more bare chips, especially for high-capacity eFlash chip products, 90nm G2 eFlash area advantage is more significant.
It is worth mentioning that, 90nm G2 eFlash in the first generation based on the reduction of a layer of mask, making the manufacturing cost is lower.
Currently, the 90 nm G2 eFlash has achieved high yield and stable yield, and is successfully used for large-scale production of telecom card chips. It will also provide cost-effective chip manufacturing technology solutions for diversified products such as smart card chips, security chip products and MCUs .
"The successful production of the second generation of 90nm G2 eFlash technology marks another successful Hua Hong semiconductor in feature-based embedded flash memory technology," said Dr. Hung Wai-ran, executive vice president of Huron Semiconductor Inc. Embedded non-volatile memory Technology is one of our strategic priorities and has long been recognized in the industry for its high level of security, high stability, cost performance, and advanced technology. As the world's leading smart card IC foundry, Hua Hong Semiconductor will continue its plowing and continuous development Optimize the process, upgrade platform, continue to lead the smart IC card OEM field, and vigorously force Internet of things, new energy vehicles and other high growth emerging markets.